Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

2018 ◽  
Vol 5 (8) ◽  
pp. 1701285 ◽  
Author(s):  
Yousef Farraj ◽  
Michael Layani ◽  
Avi Yaverboim ◽  
Shlomo Magdassi
RSC Advances ◽  
2020 ◽  
Vol 10 (72) ◽  
pp. 44015-44024
Author(s):  
Feng Zhao ◽  
Chen Jiao ◽  
Deqiao Xie ◽  
Bin Lu ◽  
Mingbo Qiu ◽  
...  

A high-precision selective metallization pattern is achieved on the 3D printed Al2O3 ceramic surface by the laser pre-activation and electroless copper plating. This study opens up a broader space for the design and manufacture of 3D microwave devices.


Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang

Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang

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