Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers
2018 ◽
Vol 5
(8)
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pp. 1701285
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2016 ◽
Vol 6
(1)
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pp. 65-73
2010 ◽
Vol 157
(4)
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pp. D222
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1991 ◽
Vol 42
(9)
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pp. 913-917
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Keyword(s):
2007 ◽
Vol 68
(1)
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pp. 150-155
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Keyword(s):