Fully Bottom‐Up Waste‐Free Growth of Ultrathin Silicon Wafer via Self‐Releasing Seed Layer

2021 ◽  
pp. 2103708
Author(s):  
Ji‐Eun Hong ◽  
Yonghwan Lee ◽  
Sung‐In Mo ◽  
Hye‐Seong Jeong ◽  
Jeong‐Ho An ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Seed Layer ◽  
Bottom Up ◽  
Free Growth

Fully Bottom‐Up Waste‐Free Growth of Ultrathin Silicon Wafer via Self‐Releasing Seed Layer (Adv. Mater. 41/2021)

2021 ◽  
Vol 33 (41) ◽  
pp. 2170326
Author(s):  
Ji‐Eun Hong ◽  
Yonghwan Lee ◽  
Sung‐In Mo ◽  
Hye‐Seong Jeong ◽  
Jeong‐Ho An ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Seed Layer ◽  
Bottom Up ◽  
Free Growth

Effects of ZnO seed layer thickness on catalyst-free growth of ZnO nanostructures for enhanced UV photoresponse

2018 ◽  
Vol 98 ◽  
pp. 344-353 ◽  
Author(s):  
Forat H. Alsultany ◽  
Z. Hassan ◽  
Naser M. Ahmed ◽  
Nezar G. Elafadill ◽  
Hassnen R. Abd
Keyword(s):  
Layer Thickness ◽  
Seed Layer ◽  
Zno Nanostructures ◽  
Catalyst Free ◽  
Free Growth ◽  
Seed Layer Thickness

Analysis for Replication and Surface Roughness of Micro-Feature of Silicon Mold Insert by UV-LIGA Method

2008 ◽  
Vol 47-50 ◽  
pp. 443-446
Author(s):  
Chiung Fang Huang ◽  
Jeol Long Lee ◽  
Yung Kang Shen ◽  
Chi Wei Wu ◽  
Yi Lin ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Seed Layer ◽  
Mold Insert ◽  
Master Mold ◽  
Silicon Mold ◽  
Replica Molding

This study demonstrates the replication property and surface roughness for metal micro-mold that combines the replica molding (REM) and electroforming techniques. The micro-mold firstly uses the silicon wafer to fabricate the master mold by UV-LIGA method, and then uses the sputtering method to sputter the Ni element as the seed layer on the surface of master mold. The electroforming method manufactures the Ni mold insert from the master mold with seed layer. Finally, this study uses the PDMS material to replicate the micro-feature from the Ni mold insert by replica molding. This study indicates the replication property and surface roughness of different micro-feature shapes and sizes (concave and convex) for Ni mold insert and molded PDMS.

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