scholarly journals Inverse Design Strategies for 3D Surfaces Formed by Mechanically Guided Assembly

2020 ◽  
Vol 32 (14) ◽  
pp. 1908424 ◽  
Author(s):  
Zhichao Fan ◽  
Yiyuan Yang ◽  
Fan Zhang ◽  
Zheng Xu ◽  
Hangbo Zhao ◽  
...  
Keyword(s):  
Inverse Design ◽  
Design Strategies ◽  
Guided Assembly ◽  
3D Surfaces

scholarly journals Inverse Design Methods: Inverse Design Strategies for 3D Surfaces Formed by Mechanically Guided Assembly (Adv. Mater. 14/2020)

2020 ◽  
Vol 32 (14) ◽  
pp. 2070107
Author(s):  
Zhichao Fan ◽  
Yiyuan Yang ◽  
Fan Zhang ◽  
Zheng Xu ◽  
Hangbo Zhao ◽  
...  
Keyword(s):  
Design Methods ◽  
Inverse Design ◽  
Design Strategies ◽  
Guided Assembly ◽  
3D Surfaces

Inverse Design Strategies for Large Passive Waveguide Structures

2021 ◽  
pp. 1-1
Author(s):  
Marko Perestjuk ◽  
Hendrik Boerma ◽  
Alexander Schindler ◽  
Patrick Runge ◽  
Martin Schell
Keyword(s):  
Inverse Design ◽  
Design Strategies

scholarly journals Machine-enabled inverse design of inorganic solid materials: promises and challenges

2020 ◽  
Vol 11 (19) ◽  
pp. 4871-4881 ◽  
Author(s):  
Juhwan Noh ◽  
Geun Ho Gu ◽  
Sungwon Kim ◽  
Yousung Jung
Keyword(s):  
Materials Science ◽  
Inverse Design ◽  
Grand Challenge ◽  
Design Strategies ◽  
Solid Materials ◽  
Novel Materials

The grand challenge of materials science, discovery of novel materials with target properties, can be greatly accelerated by machine-learned inverse design strategies.

AlCu Pattern Generation on 3D StructuredWafer Using Multi Level Exposure Method on Electrodeposited Polymer Material

2003 ◽  
Vol 766 ◽  
Author(s):  
Vineet Sharma ◽  
Arief B. Suriadi ◽  
Frank Berauer ◽  
Laurie S. Mittelstadt
Keyword(s):  
Line Width ◽  
Metal Film ◽  
Focal Depth ◽  
Cost Effective ◽  
Pattern Generation ◽  
Promising Technique ◽  
Critical Dimensions ◽  
Exposure Method ◽  
Multi Level ◽  
3D Surfaces

AbstractNormal photolithography tools have focal depth limitations and are unable to meet the expectations of high resolution photolithography on highly topographic structures. This paper shows a cost effective and promising technique of combining two different approaches to achieve critical dimensions of traces on slope pattern continuity on highly topographic structures. Electrophoretically deposited photoresist is used on 3-D structured wafers. This photoresist coating technique is fairly known in the MEMS industries to achieve uniform and conformal photoresist films on 3D surfaces. Multi step exposures are used to expose electrophoretically deposited photoresist. AlCu (Cu-0.5%), 0.47-0.53 μm thick metal film is deposited on 3D structured silicon substrate to plate photoresist. By combining these two novel methods, metal (AlCu) traces of 75 μm line width and 150 μm pitch (from top flat to down the slope) have been demonstrated on isotropically etched 350 μm deep trenches with 5-10% line width loss.

AN INVERSE DESIGN METHOD FOR A WING IN FULL CRUISING CONFIGURATION OF A REGIONAL AIRCRAFT VIA RANS APPROACH

2020 ◽  
Vol 51 (1) ◽  
pp. 1-13
Author(s):  
Anatoliy Longinovich Bolsunovsky ◽  
Nikolay Petrovich Buzoverya ◽  
Nikita Aleksandrovich Pushchin
Keyword(s):  
Design Method ◽  
Inverse Design ◽  
Inverse Design Method
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