scholarly journals Flexible Electronics: Flexible Crossbar-Structured Resistive Memory Arrays on Plastic Substrates via Inorganic-Based Laser Lift-Off (Adv. Mater. 44/2014)

2014 ◽  
Vol 26 (44) ◽  
pp. 7418-7418
Author(s):  
Seungjun Kim ◽  
Jung Hwan Son ◽  
Seung Hyun Lee ◽  
Byoung Kuk You ◽  
Kwi-Il Park ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Resistive Memory ◽  
Plastic Substrates ◽  
Memory Arrays ◽  
Lift Off

Flexible Crossbar-Structured Resistive Memory Arrays on Plastic Substrates via Inorganic-Based Laser Lift-Off

2014 ◽  
Vol 26 (44) ◽  
pp. 7480-7487 ◽  
Author(s):  
Seungjun Kim ◽  
Jung Hwan Son ◽  
Seung Hyun Lee ◽  
Byoung Kuk You ◽  
Kwi-Il Park ◽  
...  
Keyword(s):  
Resistive Memory ◽  
Plastic Substrates ◽  
Memory Arrays ◽  
Lift Off

scholarly journals Amorphous Metal Oxide Bilayers to Avoid Sneak‐Path Currents for High‐Density Resistive Memory Arrays

2021 ◽  
pp. 2000222
Author(s):  
Shruti Nirantar ◽  
Md Ataur Rahman ◽  
Edwin Mayes ◽  
Madhu Bhaskaran ◽  
Sumeet Walia ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Amorphous Metal ◽  
High Density ◽  
Resistive Memory ◽  
Memory Arrays ◽  
Amorphous Metal Oxide

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing

2020 ◽  
Vol 47 (1) ◽  
pp. 0100001
Author(s):  
季凌飞 Ji Lingfei ◽  
马瑞 Ma Rui ◽  
张熙民 Zhang Ximin ◽  
孙正阳 Sun Zhengyang ◽  
李鑫 Li Xin
Keyword(s):  
Flexible Electronics ◽  
Electronics Manufacturing ◽  
Lift Off

Flexible Magnetics: Magnetic Lithography and Fabrication of Magnetic Masks on Thin Plastic Substrates

2003 ◽  
Vol 769 ◽  
Author(s):  
Z. Z. Bandić ◽  
H. Xu ◽  
J.E.E. Baglin ◽  
T. R. Albrecht
Keyword(s):  
Magnetic Material ◽  
Flexible Electronics ◽  
Flexible Substrate ◽  
Magnetic Transition ◽  
Soft Magnetic Material ◽  
Plastic Substrate ◽  
Magnetic Media ◽  
Soft Magnetic ◽  
Plastic Substrates ◽  
Pet Films

AbstractFlexible magnetic lithography is a process qualitatively analogous to contact optical lithography which transfers information from a patterned magnetic mask (analog of optical photomask) to magnetic media (analog of photoresist), and is interesting for applications in instantaneous parallel magnetic recording. The magnetic mask consists of patterned soft magnetic material (FeNiCo, FeCo) on a flexible plastic substrate, typically Polyethylene Teraphtalate (PET). When uniformly magnetized media is brought into intimate contact with the magnetic mask, an externally applied magnetic field selectively changes the magnetic orientation in the areas not covered with the soft magnetic material. Flexible substrate of the magnetic mask o.ers superior compliance to magnetic media which is likely to have imperfect flatness and surface particulate contamination.Although magnetic in physical nature, flexible magnetics draws interesting parallels to flexible electronics, especially in challenges of fabrication of sub-micron patterns on thin flexible plastic substrates. We fabricated samples of sub-micron patterned FeCo and FeNiCo magnetic masks on PET substrates by using combined lamination/release process of PET films. Rigid substrates, typically silicon or quartz were initially laminated with PET films and processed using standard fabrication procedures. After completing magnetic mask device fabrication, PET films were released from the rigid substrates.We successfully transferred patterns from magnetic masks to hard disk CrPtCo-based magnetic media. The details of the method, including physics of the magnetic lithography pattern transfer, fabrication of the magnetic mask on flexible PET substrates, lamination and release of PET films, and magnetic force microscopy (MFM) images of the magnetic transition patterns are reported.

All-Printed Carbon Nanotube finFETs on Plastic Substrates for High-Performance Flexible Electronics

2011 ◽  
Vol 24 (3) ◽  
pp. 358-361 ◽  
Author(s):  
Jingsheng Shi ◽  
Chun Xian Guo ◽  
Mary B. Chan-Park ◽  
Chang Ming Li
Keyword(s):  
Carbon Nanotube ◽  
Flexible Electronics ◽  
High Performance ◽  
Plastic Substrates

scholarly journals Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 546
Author(s):  
Seong Hyun Jang ◽  
Young Joon Han ◽  
Sang Yoon Lee ◽  
Geonho Lee ◽  
Jae Woong Jung ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Chemical Structure ◽  
Surface Characteristics ◽  
Dielectric Constants ◽  
Flash Lamp ◽  
Next Generation ◽  
Polyimide Films ◽  
Chemical Structures ◽  
Polyimide Substrate ◽  
Lift Off

Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.

Single Event Susceptibility Analysis in CBRAM Resistive Memory Arrays

2015 ◽  
Vol 62 (6) ◽  
pp. 2606-2612 ◽  
Author(s):  
Debayan Mahalanabis ◽  
Rui Liu ◽  
Hugh J. Barnaby ◽  
Shimeng Yu ◽  
Michael N. Kozicki ◽  
...  
Keyword(s):  
Single Event ◽  
Resistive Memory ◽  
Susceptibility Analysis ◽  
Memory Arrays

scholarly journals Xenon Flash Lamp Lift-Off Technology without Laser for Flexible Electronics

Micromachines ◽  
2020 ◽  
Vol 11 (11) ◽  
pp. 953
Author(s):  
Sang Il Lee ◽  
Seong Hyun Jang ◽  
Young Joon Han ◽  
Jun yeub Lee ◽  
Jun Choi ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Energy Intensity ◽  
Film Surface ◽  
Flash Lamp ◽  
Structural Deformation ◽  
Gravimetric Analysis ◽  
Xenon Flash Lamp ◽  
Optimum Energy ◽  
Lift Off ◽  
Xenon Flash

This study experimentally investigated process mechanisms and characteristics of newly developed xenon flash lamp lift-off (XF-LO) technology, a novel thin film lift-off method using a light to heat conversion layer (LTHC) and a xenon flash lamp (XFL). XF-LO technology was used to lift-off polyimide (PI) films of 8.68–19.6 μm thickness. When XFL energy irradiated to the LTHC was 2.61 J/cm2, the PI film was completely released from the carrier substrate. However, as the energy intensity of the XFL increased, it became increasingly difficult to completely release the PI film from the carrier substrate. Using thermal gravimetric analysis (TGA), Fourier-transform infrared spectroscopy (FTIR) and transmittance analysis, the process mechanism of XF-LO technology was investigated. Thermal durability of the PI film was found to deteriorate with increasing XFL energy intensity, resulting in structural deformation and increased roughness of the PI film surface. The optimum energy intensity of 2.61 J/cm2 or less was found to be effective for performing XF-LO technology. This study provides an attractive method for manufacturing flexible electronic boards outside the framework of existing laser lift-off (LLO) technology.

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