Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

2018 ◽  
Vol 28 (26) ◽  
pp. 1707102 ◽  
Author(s):  
Jeongmin Seo ◽  
Cheogyu Kim ◽  
Boo Soo Ma ◽  
Tae-Ik Lee ◽  
Jae Hoon Bong ◽  
...  
Keyword(s):  
Transfer Printing ◽  
Large Area ◽  
Graphene Transfer

scholarly journals Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

2018 ◽  
Vol 28 (45) ◽  
pp. 1806732
Author(s):  
Jeongmin Seo ◽  
Cheogyu Kim ◽  
Boo Soo Ma ◽  
Tae-Ik Lee ◽  
Jae Hoon Bong ◽  
...  
Keyword(s):  
Transfer Printing ◽  
Large Area ◽  
Graphene Transfer

Dry Techniques for Epitaxial Graphene Transfer

2010 ◽  
Vol 1259 ◽  
Author(s):  
Joshua D. Caldwell ◽  
Travis J. Anderson ◽  
Karl D. Hobart ◽  
Glenn G. Jernigan ◽  
James C. Culbertson ◽  
...  
Keyword(s):  
Carrier Density ◽  
Epitaxial Graphene ◽  
Large Area ◽  
Wafer Scale ◽  
Thermal Release ◽  
Graphene Films ◽  
Graphene Transfer ◽  
Van Der Pauw

AbstractEpitaxial graphene (EG) grown on the carbon-face of SiC has been shown to exhibit higher carrier mobilities in comparison to other growth techniques amenable to wafer-scale graphene fabrication. The transfer of large area (>mm2) graphene films to substrates amenable for specific applications is desirable. We demonstrate the dry transfer of EG from the C-face of 4H-SiC onto SiO2, GaN and Al2O3 substrates via two approaches using either 1) thermal release tape or 2) a spin-on, chemically-etchable dielectric. Van der Pauw devices fabricated from C-face EG transferred to SiO2 gave similar mobility values and up to three fold reductions in carrier density in comparison to devices fabricated on as-grown material.

scholarly journals Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability

2020 ◽  
Vol 6 (31) ◽  
pp. eabb6462
Author(s):  
Tae Wan Park ◽  
Myunghwan Byun ◽  
Hyunsung Jung ◽  
Gyu Rac Lee ◽  
Jae Hong Park ◽  
...  
Keyword(s):  
Self Assembly ◽  
Transfer Printing ◽  
Combined Method ◽  
Large Area ◽  
Metal Insulator ◽  
Metal Insulator Metal ◽  
Good Pattern ◽  
Ordered Nanostructures ◽  
20 Nm ◽  
Pattern Resolution

Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.

scholarly journals High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Abhishek Singh Dahiya ◽  
Dhayalan Shakthivel ◽  
Yogeenth Kumaresan ◽  
Ayoub Zumeit ◽  
Adamos Christou ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Functional Materials ◽  
Transfer Printing ◽  
Semiconducting Materials ◽  
Large Area ◽  
Contact Printing ◽  
Scale Structures ◽  
Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

scholarly journals Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Ayoub Zumeit ◽  
Abhishek Singh Dahiya ◽  
Adamos Christou ◽  
Dhayalan Shakthivel ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Printed Electronics ◽  
Field Effect Transistors ◽  
High Mobility ◽  
Single Step ◽  
High Yield ◽  
Transfer Printing ◽  
Large Area ◽  
Direct Printing

AbstractTransfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

scholarly journals A facile alternative technique for large-area graphene transfer via sacrificial polymer

AIP Advances ◽  
2017 ◽  
Vol 7 (12) ◽  
pp. 125306 ◽  
Author(s):  
Eric Auchter ◽  
Justin Marquez ◽  
Stephen L. Yarbro ◽  
Enkeleda Dervishi
Keyword(s):  
Alternative Technique ◽  
Large Area ◽  
Graphene Transfer

A Novel Method for Large Area Graphene Transfer on the Polymer Optical Fiber

2012 ◽  
Vol 12 (5) ◽  
pp. 3918-3921 ◽  
Author(s):  
Atul Kulkarni ◽  
Hyeongkeun Kim ◽  
Rashid Amin ◽  
Sung Ha Park ◽  
Byung Hee Hong ◽  
...  
Keyword(s):  
Optical Fiber ◽  
Polymer Optical Fiber ◽  
Large Area ◽  
Novel Method ◽  
Graphene Transfer

scholarly journals Large Area Nano-transfer Printing of Sub-50-nm Metal Nanostructures Using Low-cost Semi-flexible Hybrid Templates

2016 ◽  
Vol 11 (1) ◽  
Author(s):  
Robin D. Nagel ◽  
Tobias Haeberle ◽  
Morten Schmidt ◽  
Paolo Lugli ◽  
Giuseppe Scarpa
Keyword(s):  
Low Cost ◽  
Metal Nanostructures ◽  
Transfer Printing ◽  
Large Area

Rolling-based direct-transfer printing: A process for large-area transfer of micro- and nanostructures onto flexible substrates

2016 ◽  
Vol 120 (9) ◽  
pp. 093103 ◽  
Author(s):  
D. S. Grierson ◽  
F. S. Flack ◽  
M. G. Lagally ◽  
K. T. Turner
Keyword(s):  
Flexible Substrates ◽  
Direct Transfer ◽  
Transfer Printing ◽  
Large Area
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