Kinetics of Intermetallic Phases and Mechanical Behavior of ZnSn3% Hot-Dip Galvanization Coatings

2016 ◽  
Vol 18 (12) ◽  
pp. 2088-2094 ◽  
Author(s):  
Andrea Carpinteri ◽  
Vittorio Di Cocco ◽  
Giovanni Fortese ◽  
Francesco Iacoviello ◽  
Stefano Natali ◽  
...  
2015 ◽  
Vol 18 (4) ◽  
pp. 162-169
Author(s):  
Thao Song Thanh Nguyen ◽  
Nhung Thi Tuyet Le

An experimental investigation into ratcheting strain and stress-strain hysteresis loop in stress-controlled cyclic tensile tests at room temperature was performed to determine the effect of loading frequency on the cyclic mechanical behavior of highdensity polyethylene (HDPE). It was found that frequencies ranging from 0.01 Hz up to 1 Hz mostly affects the accumulated strain over related time scales (i.e that of the cycle itself) and not over long time scale (i.e. during the full test). In addition, the higher the frequency is, the more closed and vertical the loops are. Furthermore, the frequency affects only on the kinetics of stabilization of ratcheting strain but not on one of hysteresis loop.


Nanomaterials ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 134 ◽  
Author(s):  
Izabella Kwiecien ◽  
Piotr Bobrowski ◽  
Anna Wierzbicka-Miernik ◽  
Lidia Litynska-Dobrzynska ◽  
Joanna Wojewoda-Budka

Reactivity in nickel–aluminum system was examined for two variants of nickel substrates in terms of the size and shape of Ni grains. The microstructure transformation aroused due to the annealing at 720 °C for different annealing times (0.25 to 72 h) was consequently followed. The sequence of formation of the particular intermetallic phases was given. The interconnection zones were examined by means of scanning electron microscopy supported with energy dispersive X-ray spectroscopy and electron backscattered diffraction techniques as well as by the transmission electron microscopy. The growth kinetics data for AlNi, AlNiNi-rich and AlNi3 phases for both variants of substrates was given, indicating the differences obtained in previous works on this subject.


2008 ◽  
Vol 277 ◽  
pp. 9-20 ◽  
Author(s):  
Yuri S. Kaganovsky ◽  
Lyudmila N. Paritskaya ◽  
V.V. Bogdanov

The kinetics of growth and lateral spreading of intermetallic layers during surface interdiffusion in Cu – Sn system has been studied in a temperature range 160 – 200oC by the methods of optical microscopy, SEM provided with X-ray microprobe, and AFM. Lateral phase spreading over the surface is characterized by competition between two phases: Cu6Sn5 and Cu3Sn. A steady state solution for concentration distribution on the surface of growing intermetallic phases, as well as kinetic equations of lateral spreading of growing phase layers have been obtained. By comparison of experimental data on intermetallic growth kinetics with the proposed theory, the dynamic surface diffusion coefficients have been calculated.


2011 ◽  
Vol 172-174 ◽  
pp. 443-448
Author(s):  
Orlando Soriano Vargas ◽  
Erika O. Avila Davila ◽  
Victor M. Lopez-Hirata ◽  
Maribel L. Saucedo-Muñoz

The hardening behavior of precipitation was studied during aging of Fe-Cr alloys. This mechanical behavior is associated with the nanometric modulation structure of the coherent decomposed Fe-rich and Cr-rich phases formed by the spinodal decomposition of the supersaturated solid solution. The growth kinetics of spinodal decomposition was very slow and it increased during coarsening stage. The morphology of decomposed phases consisted of an interconnected irregular shape with no preferential alignment for short aging times and a further aging caused the change to a plate shape of the decomposed Cr-rich phase aligned in the <110> directions of the Fe-rich matrix. The rapid increase in hardness and embrittlement seem to be associated with the coherency and nanometer size of the spinodally-decomposed phases in the aged alloys.


1986 ◽  
Vol 72 ◽  
Author(s):  
Darrel Frear ◽  
Dennis Grivas ◽  
Lenora Quan ◽  
J. W. Morris

AbstractThe microstructure and mechanical properties of Pb-Sn solder joining Cu plates were studied. Yticrostructural observations were made on both the bulk Pb-Sn solder and on the interface between the solder and Cu plates. Pb-Sn solder has a two-phase microstructure in which the Pb-rich phase is the weaker. β-Sn precipitates in the Pb-rich phase were characterized in TEM. Intermetallic phases (Cu6 Sn5 and Cu3Sn) that form during the reaction of molten Pb-Sn solder with Cu were investigated. Solder joints were tested to fracture in both shear and tensile configurations. The mechanical properties and fracture surface characteristics are reported.


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