Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques

2014 ◽  
Vol 17 (4) ◽  
pp. 512-522 ◽  
Author(s):  
Magdalena Pawełkiewicz ◽  
Marek Danielewski ◽  
Jolanta Janczak-Rusch
Keyword(s):  
Growth Kinetics ◽  
Intermetallic Layer ◽  
Layer Growth ◽  
Diffusion Multiple

scholarly journals FeB/FeB phase transformation during SPS pack-boriding: Boride layer growth kinetics

2005 ◽  
Vol 53 (8) ◽  
pp. 2361-2368 ◽  
Author(s):  
L YU ◽  
X CHEN ◽  
K KHOR ◽  
G SUNDARARAJAN
Keyword(s):  
Phase Transformation ◽  
Growth Kinetics ◽  
Boride Layer ◽  
Layer Growth

Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining

2020 ◽  
Vol 307 ◽  
pp. 26-30
Author(s):  
Azman Jalar ◽  
Maria Abu Bakar ◽  
Mohd. Zulhakimi Ab. Razak ◽  
Norliza Ismail
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Intermetallic Layer ◽  
Compound Layer ◽  
Effect Of Temperature ◽  
Growth Exponent ◽  
Intermetallic Compound Layer ◽  
Growth Behaviour ◽  
Morphological Effect ◽  
Kinetics Of

Evaluating the growth kinetics is one of the most important characteristic in assessing the quality and reliability of metallurgical joining, especially in electronics packaging such as soldering and wire bonding technology. The growth kinetics is normally assessed using Arrhenius equation that involves diffusion activities due to thermally activated process. The well-known factors of thermal and time together with generally accepted growth exponent have been widely used for this assessment. The intermetallic compound layer which is the by-product of metallurgical reaction during soldering process has been exposed to high temperature to accelerate its growth. The cross-section of the joining was observed using optical microscope to quantify the layer of intermetallic compound. Morphological effect and shape factor of the layer have been analysed in complement with the effect of temperature and time on the growth behaviour. Directional growth and irregularities shape of the intermetallic layer show some inconsistency on the selection of growth exponent. The effect of initial size of intermetallic layer must also be considered in this assessment. This study suggests that the morphological effect must be analysed prior to the selection the growth exponent in assessing growth behaviour and kinetics of intermetallic layer in metallurgical joining.

2715 Influence on Intermetallic Layer Growth of HOT-DIP Tin Plating by Heat Treatment

2007 ◽  
Vol 2007.1 (0) ◽  
pp. 591-592
Author(s):  
Motofumi OHKI ◽  
Tatsuya ISHIBASHI ◽  
Satoshi Syoji ◽  
Wataru SUZUKI
Keyword(s):  
Heat Treatment ◽  
Intermetallic Layer ◽  
Layer Growth ◽  
Tin Plating

A Combined Photoelectron Spectroscopy and ab Initio Study of the Adsorbate System O2/PbTe(001) and the Oxide Layer Growth Kinetics

2008 ◽  
Vol 112 (50) ◽  
pp. 19995-20006 ◽  
Author(s):  
Lada V. Yashina ◽  
Tatiana S. Zyubina ◽  
Ralph Püttner ◽  
Alexander S. Zyubin ◽  
Vladimir I. Shtanov ◽  
...  
Keyword(s):  
Ab Initio ◽  
Oxide Layer ◽  
Growth Kinetics ◽  
Photoelectron Spectroscopy ◽  
Layer Growth ◽  
Ab Initio Study
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