Multi-Scale Analysis of IN-718 Microstructure Evolution During Linear Friction Welding

2008 ◽  
Vol 10 (6) ◽  
pp. 573-578 ◽  
Author(s):  
C. Mary ◽  
M. Jahazi
Keyword(s):  
Microstructure Evolution ◽  
Friction Welding ◽  
Scale Analysis ◽  
Linear Friction Welding ◽  
Multi Scale ◽  
Linear Friction ◽  
Multi Scale Analysis

scholarly journals Experimental and Numerical Analysis of Microstructure Evolution during Linear Friction Welding of Ti6Al4V

2015 ◽  
Vol 1 ◽  
pp. 429-441 ◽  
Author(s):  
Gianluca Buffa ◽  
Davide Campanella ◽  
Marco Cammalleri ◽  
Antonino Ducato ◽  
Antonello Astarita ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Microstructure Evolution ◽  
Friction Welding ◽  
Linear Friction Welding ◽  
Linear Friction

Linear Friction Welding of IN-718 Process Optimization and Microstructure Evolution

2006 ◽  
Vol 15-17 ◽  
pp. 357-362 ◽  
Author(s):  
Caroline Mary ◽  
Mohammad Jahazi
Keyword(s):  
Process Parameters ◽  
Microstructure Evolution ◽  
Friction Welding ◽  
Welding Process ◽  
Weld Interface ◽  
Maximum Temperature ◽  
Linear Friction Welding ◽  
Influence Of Process Parameters ◽  
Linear Friction ◽  
The Matrix

Linear Friction Welding (LFW) of IN-718 Superalloy was investigated under several processing conditions. The influence of process parameters such as frequency (60Hz to 100Hz), amplitude (2mm to 3mm) and frictional pressure (50MPa to 110MPa) on the microstructure and mechanical properties of welded specimens was determined. Optical and scanning electron microscopy, and micro-hardness testing were used to characterize the welded areas as well as the Thermo-Mechanically Affected Zones (TMAZ). In-situ thermocouple measurements were performed to follow temperature evolution in the specimens during the different phases of the LFW process. The analysis of the results indicated that for some specific conditions (f=80Hz, a=2mm and P=70MPa) a maximum temperature of 1200°C was attained during the last stage of the welding process, the burn-off phase. This temperature, very close to the alloy melting range, would be sufficient to cause partial liquation in this zone. Microscopic examinations revealed the presence of oxide particles aligned around the weld interface. Their concentration and distribution, varying with process parameters, affect the weld integrity. The TMAZ characterised by a global loss of strength (from 334HV to 250HV) is associated with temperatures exceeding 800°C and causing γ’ and γ’’ reversion. A narrow band of the TMAZ, exposed to high strains and temperatures, showed evidences of dynamic recovery and recrystallization (up to 67% of reduction in the matrix grain size). Visual and microscopic examination of the flash layer, revealed two distinct zones. Microstructure evolution and microhardness variations were associated to process parameters and the optimum conditions for obtaining defect free weldments were determined.

Multi-Scale Numerical-Experimental Analysis of Failure in Solder Alloys

2007 ◽  
Vol 539-543 ◽  
pp. 66-73
Author(s):  
M.G.D. Geers ◽  
R.L.J.M. Ubachs ◽  
M. Erinc ◽  
M.A. Matin
Keyword(s):  
Microstructure Evolution ◽  
Lead Free ◽  
Predictive Analysis ◽  
Scale Analysis ◽  
Main Motivation ◽  
Thermal Anisotropy ◽  
Multi Scale ◽  
The Past ◽  
Free Alternative ◽  
Multi Scale Analysis

The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.

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