Handling Discontinuous Effects in Modeling Spatial Correlation of Wafer-level Analog/RF Tests

2013 ◽  
Author(s):  
Ke Huang ◽  
Nathan Kupp ◽  
John M. Carulli ◽  
Yiorgos Makris
Keyword(s):  
Spatial Correlation ◽  
Wafer Level

IC laser trimming speed-up through wafer-level spatial correlation modeling

2014 ◽  
Author(s):  
Constantinos Xanthopoulos ◽  
Ke Huang ◽  
Abbas Poonawala ◽  
Amit Nahar ◽  
Bob Orr ◽  
...  
Keyword(s):  
Spatial Correlation ◽  
Wafer Level ◽  
Speed Up

Comparison of Nonlinear Spatial Correlation Models by the Influence of the Data Augmentation to the Classification Risk

2002 ◽  
Vol 7 (1) ◽  
pp. 31-42
Author(s):  
J. Šaltytė ◽  
K. Dučinskas
Keyword(s):  
Spatial Correlation ◽  
Random Fields ◽  
Data Augmentation ◽  
Gaussian Random Fields ◽  
Classification Rule ◽  
Numerical Comparison ◽  
First Order ◽  
Bayesian Risk ◽  
Correlation Models

The Bayesian classification rule used for the classification of the observations of the (second-order) stationary Gaussian random fields with different means and common factorised covariance matrices is investigated. The influence of the observed data augmentation to the Bayesian risk is examined for three different nonlinear widely applicable spatial correlation models. The explicit expression of the Bayesian risk for the classification of augmented data is derived. Numerical comparison of these models by the variability of Bayesian risk in case of the first-order neighbourhood scheme is performed.

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

Spatial Correlation and Diversity of Low-Latitude Multipath Multimode HF Skywave Radio Channels

2019 ◽  
Vol 9 (2) ◽  
pp. 110
Author(s):  
Indah Kurniawati ◽  
Gamantyo Hendrantoro ◽  
Wirawan Wirawan ◽  
Muhammad Taufik
Keyword(s):  
Spatial Correlation ◽  
Low Latitude ◽  
Radio Channels
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