scholarly journals Bond Strength and HR-TEM Observation of Clad Materials Produced Using a Vacuum Roll Bonding Method

2015 ◽  
Vol 4 (2) ◽  
pp. 79-82
Author(s):  
Tomiko YAMAGUCHI
2016 ◽  
Vol 87 (12) ◽  
pp. 1619-1626 ◽  
Author(s):  
Illia Hordych ◽  
Dmytro Rodman ◽  
Florian Nürnberger ◽  
Christian Hoppe ◽  
Hans Christian Schmidt ◽  
...  

Author(s):  
Malik Hassan ◽  
Ghulam Hussain ◽  
Aaqib Ali ◽  
Muhammad Ilyas ◽  
Sohail Malik ◽  
...  

The aim of this research was to investigate the effect of pre-rolling temperature on the interfacial properties in delamination modes 1 and 2; and formability in Single Point Incremental Forming (SPIF) of Steel-Steel (St-St) bilayer sheet prepared by roll bonding process. The roll bonding process was performed at three pre-rolling temperatures, 700°C, 800°C, and 950°C, with a constant thickness reduction ratio of 58%. The bond strength and critical strain energy release rate (CSERR) were measured to characterize the interface of St-St bilayer sheet. T-peel test for mode 1 and tensile shear test for mode 2 were conducted to determine the interfacial properties. The formability of St-St bilayer sheet in SPIF was measured in terms of maximum wall angle. The results showed that the increase in pre-rolling temperature from 700°C to 950°C enhanced the bond strength and CSERR, in both mode 1 and 2. The enhancement in bond strength with an increase in pre-rolling temperature was 149.5% and 203% in mode 1 and 2, respectively. However, the increase in CSERR in mode 1 and 2 was 115% and 367%, respectively. The formability of St-St bilayer sheet also showed an increasing trend with an increase in pre-rolling temperature. Moreover, a consistent relation between formability and interfacial parameters was observed. It was also found that to successively deform the bilayer sheet into the desired shape, it is necessary for the sheet to be heated above the critical temperature during fabrication to facilitate good bonding between two sheets.


2008 ◽  
Vol 580-582 ◽  
pp. 183-190
Author(s):  
Oh Sung Song ◽  
Jong Ryul Kim ◽  
Myung Ro Kim

Granulation is a precious metal craft process method that decorates a metal surface using tiny metal granules. It was imported into Korea during the Shilla Dynasty around 1500 years ago, and many granulation ornaments have been found with the process’s unique bonding features. The granules show a direct bonded interface with a neck. The key technology of making granules and bonding the granules is not well known. Thus, it is a technology of the Lost World. Although the exact bonding method is unidentifiable, it is known that the traditional method of preparing gold granules was time consuming and costly. Therefore, we proposed a process to reproduce the Shilla’s granulation ornament using a modern method. First, we employed atomization to produce 22K gold granules. Direct bonding was accomplished using a spot welder and vacuum jig instead of using the traditional method of graphite bed melting and direct annealing. 0.8 mm granules were successfully fabricated and bonded directly to the substrate with a necking and 35% bonding ratio, which is very similar to Shilla’s granule bonding. Moreover, to estimate the bond strength, K factors (fracture toughness index) at different bonding ratios were evaluated using a finite element method simulation. Our proposed direct bonded granule process and design were expected to have enough bond strength to be used as a key element for fine modern jewelry.


2020 ◽  
Vol 2 (12) ◽  
Author(s):  
Sebastian Winkler ◽  
Jan Edelmann ◽  
Andreas Schubert

AbstractApplications for smart medical implants require hermetic and mechanically strong seals between functional and biocompatible materials. Hermetic seals between titanium Ti6Al4V and silica-based glass can be produced using a novel bonding method based on glass pressing at temperatures around the softening point. This paper presents investigation results for the tensile bond strength and the gas leak rate depending on the manufacturing process parameters. Notably, when using blasted surfaces, the tensile bond strengths reached 12 MPa and good adherence with very low leakage due to the removed oxide layer and surface structure. The interface is analyzed and characterized by applying SEM methods related to the different adhesion mechanisms.


2008 ◽  
Vol 584-586 ◽  
pp. 243-248 ◽  
Author(s):  
Ling Jiang ◽  
Maria Teresa Pérez-Prado ◽  
Oscar A. Ruano ◽  
M.E. Kassner

The bond strength of ultrafine grained Zr with a grain size of 0.4 µm, fabricated by accumulative roll bonding (ARB), was assessed. The shear strength of the bond was estimated to be about 20% of the shear fracture strength of the as processed metal, a ratio significantly higher than that found in other materials processed by similar methods. The favorable degree of bonding achieved is attributed to the high ductility of Zr as well as to the high reductions used during the ARB process.


CIRP Annals ◽  
1985 ◽  
Vol 34 (1) ◽  
pp. 221-224 ◽  
Author(s):  
N. Bay ◽  
C. Clemensen ◽  
O. Juelstorp ◽  
T. Wanheim

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