scholarly journals Multiscale simulation of nanometric cutting of single crystal Cu based on bridging domain method

2011 ◽  
Vol 60 (10) ◽  
pp. 100205
Author(s):  
Liang Ying-Chun ◽  
Pen Hong-Min ◽  
Bai Qing-Shun ◽  
Lu Li-Hua
2011 ◽  
Vol 50 (12) ◽  
pp. 3431-3441 ◽  
Author(s):  
H.M. Pen ◽  
Y.C. Liang ◽  
X.C. Luo ◽  
Q.S. Bai ◽  
S. Goel ◽  
...  

2009 ◽  
Vol 628-629 ◽  
pp. 381-386 ◽  
Author(s):  
Ying Chun Liang ◽  
Hong Min Pen ◽  
Qing Shun Bai

A multiscale simulation model was built to study the nanometric cutting process of single crystal copper. This multiscale model distinctly reduces the degree of freedom of the whole system compared with full atomistic simulations. Through analyzing the fluctuations of tangential cutting force and strain energy with cutting distance, we confirm that the deformation mechanism of single crystal copper is plastic deformation caused by generation and evolution dislocation. The highest compressive stress locates in shear zone and highest tensile stress locates in the machined surface and subsurface. Simulation results show that there exists a high value of stress around dislocations, which reveals the local high value of stress is the main reason for the generation and evolution of dislocations in the workpiece material.


2020 ◽  
Vol 83 ◽  
pp. 220-236
Author(s):  
Fubin Tu ◽  
Yuyong Jiao ◽  
Zongwu Chen ◽  
Junpeng Zou ◽  
Zhiye Zhao

2009 ◽  
Vol 81 (13) ◽  
pp. 1635-1658 ◽  
Author(s):  
Mei Xu ◽  
Robert Gracie ◽  
Ted Belytschko

Sign in / Sign up

Export Citation Format

Share Document