scholarly journals Research on thermal contact conductance between crystal rod and heat sink in LD end-pumped solid-state laser

2011 ◽  
Vol 60 (1) ◽  
pp. 014212
Author(s):  
Liu Hai-Qiang ◽  
Guo Zhen ◽  
Wang Shi-Yu ◽  
Lin Lin ◽  
Guo Long-Cheng ◽  
...  
Keyword(s):  
Solid State ◽  
Heat Sink ◽  
Thermal Contact ◽  
Solid State Laser ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
State Laser

Research on Thermal Contact Conductance Using Multi-Piece Heat Sink to Hold Crystal and Dissipate Heat in Solid-State Laser

2011 ◽  
Vol 38 (5) ◽  
pp. 0502006
Author(s):  
刘海强 Liu Haiqiang ◽  
过振 Guo Zhen ◽  
王石语 Wang Shiyu ◽  
林林 Lin Lin ◽  
李兵斌 Li Bingbin ◽  
...  
Keyword(s):  
Solid State ◽  
Heat Sink ◽  
Thermal Contact ◽  
Solid State Laser ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
State Laser

Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

1990 ◽  
Vol 112 (4) ◽  
pp. 350-356 ◽  
Author(s):  
V. K. Maudgal ◽  
J. Kliman ◽  
J. Miles ◽  
J. E. Sunderland
Keyword(s):  
Contact Pressure ◽  
Heat Sink ◽  
Complex Geometry ◽  
Thermal Contact ◽  
Aluminum Foil ◽  
Thermal Contact Conductance ◽  
Interface Temperature ◽  
Contact Conductance ◽  
Quality Of Contact

This study examines experimentally the quality of contact of mechanical joints in a diode heat sink assembly. Steady-state contact conductance, h, is used as a quantitative measure of the quality of contact of a joint. The emphasis of the work is on determining the contact conductance, h, for a nonideal joint using a noncontact method of recording temperature distribution in a complex geometry. Thermal contact conductance for an interface is known to depend on parameters such as contact pressure, mean interface temperature and the surface roughness characteristics of the mating surfaces. The results are presented for three different conditions of the interface namely (i) the mating surfaces are bare (ii) aluminum foil is inserted between the mating surfaces, and (iii) a high thermal conductivity grease is applied to the mating surfaces. Two levels of contact pressure are used for the interface with aluminum foil. The results indicate that the contact conductance increases with the mean temperature of the interface in all the cases. At low interface temperature, the contact conductance was greatest for the bare interface conditions. At high interface temperature, the contact conductance was greatest for the aluminum foil interface condition.

Review of models for thermal contact conductance of metals

10.2514/3.870 ◽  
1997 ◽  
Vol 11 ◽  
pp. 129-140
Author(s):  
B. Merci ◽  
J. Steelant ◽  
J. Vierendeels ◽  
K. Riemslagh ◽  
E. Dick ◽  
...  
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance

Thermal contact conductance of adhesives for microelectronic systems

10.2514/3.871 ◽  
1997 ◽  
Vol 11 ◽  
pp. 141-145
Author(s):  
Andreas Haselbacher ◽  
Jiri Blazek ◽  
S. R. Mirmira ◽  
E. Marotta ◽  
L. S. Fletcher
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance
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