scholarly journals Conference Report: Workshop on Planning for Compound Semiconductor Technology Gaithersburg, MD February 3, 1995

1996 ◽  
Vol 101 (1) ◽  
pp. 89 ◽  
Author(s):  
H.S. Bennett
Keyword(s):  
Conference Report ◽  
Compound Semiconductor ◽  
Semiconductor Technology

PERFORMANCE AT THE EDGE: GALLIUM ARSENIDE AND SILICON ICs FOR OPTICAL ELECTRONICS

1991 ◽  
Vol 02 (03) ◽  
pp. 147-162 ◽  
Author(s):  
ROBERT G. SWARTZ
Keyword(s):  
Gallium Arsenide ◽  
Optical Communication ◽  
Optical Communications ◽  
Integrated Circuit ◽  
High Performance ◽  
Compound Semiconductor ◽  
Performance Curve ◽  
Semiconductor Technology ◽  
Market Trends ◽  
Circuit Technology

Compound semiconductor technology is rapidly entering the mainstream, and is quickly finding its way into consumer applications where high performance is paramount. But silicon integrated circuit technology is evolving up the performance curve, and CMOS in particular is consuming ever more market share. Nowhere is this contest more clearly evident than in optical communications. Here applications demand performance ranging from a few hundreds of megahertz to multi-gigahertz, from circuits containing anywhere from tens to tens of thousands of devices. This paper reviews the high performance electronics found in optical communication applications from a technology standpoint, illustrating merits and market trends for these competing, yet often complementary IC technologies.

scholarly journals GaAs-Based Serial-Input-Parallel-Output Interfaces for Microwave Core-Chips

Electronics ◽  
2021 ◽  
Vol 10 (23) ◽  
pp. 3029
Author(s):  
Chiara Ramella ◽  
Motahhareh Estebsari ◽  
Abbas Nasri ◽  
Marco Pirola
Keyword(s):  
Phased Array ◽  
Beam Shaping ◽  
Compound Semiconductor ◽  
Phase Shifters ◽  
Digital Design ◽  
Semiconductor Technology ◽  
Digital Signals ◽  
Pros And Cons ◽  
Parallel Interface ◽  
Parallel Converters

Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly other elements, each to be controlled by external digital signals. Given the large number of control lines to be integrated in a core-chip, the embedding of a serial to parallel interface is indispensable. Digital design in compound semiconductor technology is still rather challenging due to the absence of complementary devices and the availability of a limited number of metallization layers. Moreover, in large arrays, high chip yield and repeatability are required. This paper discusses and compares challenges and solutions for the key sub-circuits of GaAs serial to parallel converters for core-chip applications, reviewing the pros and cons of the different implementations proposed in the literature.

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