Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field
2009 ◽
Vol 113
(31)
◽
pp. 10770-10778
◽
2013 ◽
Vol 104
◽
pp. 618-624
◽
2012 ◽
Vol 116
(15)
◽
pp. 3918-3925
◽
2010 ◽
Vol 114
(12)
◽
pp. 5675-5685
◽
Keyword(s):
2009 ◽
Vol 40
(12)
◽
pp. 1195-1209
◽
2009 ◽
Vol 40
(3)
◽
pp. 416-427
◽
2005 ◽
Vol 127
(19)
◽
pp. 7192-7202
◽
Keyword(s):
2014 ◽
Vol 118
(8)
◽
pp. 1469-1478
◽