scholarly journals Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field

2012 ◽  
Vol 70 (19) ◽  
pp. 2037 ◽  
Author(s):  
Zhijun Diao ◽  
Yuemin Zhao ◽  
Bo Chen ◽  
Chenlong Duan
2009 ◽  
Vol 113 (31) ◽  
pp. 10770-10778 ◽  
Author(s):  
Luzheng Zhang ◽  
Adri C. T. van Duin ◽  
Sergey V. Zybin ◽  
William A. Goddard III

2005 ◽  
Vol 127 (19) ◽  
pp. 7192-7202 ◽  
Author(s):  
Kimberly Chenoweth ◽  
Sam Cheung ◽  
Adri C. T. van Duin ◽  
William A. Goddard ◽  
Edward M. Kober

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