Silicon-Based Micromachining Process for Flexible Electronics

Organic printed photonics: From microring lasers to integrated circuits

Science Advances ◽

10.1126/sciadv.1500257 ◽

2015 ◽

Vol 1 (8) ◽

pp. e1500257 ◽

Cited By ~ 93

Author(s):

Chuang Zhang ◽

Chang-Ling Zou ◽

Yan Zhao ◽

Chun-Hua Dong ◽

Cong Wei ◽

...

Keyword(s):

Integrated Circuits ◽

Flexible Electronics ◽

Integrated Circuit ◽

Large Scale ◽

Rapid Development ◽

Light Signal ◽

Photonic Integrated Circuit ◽

Printing Technique ◽

On Chip ◽

Silicon Based

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

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Applications of PEDOT:PSS in Solar Cells

Materials Research Foundations - Materials for Solar Cell Technologies II ◽

10.21741/9781644901410-3 ◽

2021 ◽

pp. 40-76

Author(s):

G.R. Nishad

Keyword(s):

Solar Cells ◽

Flexible Electronics ◽

Organic Solar Cells ◽

Dye Sensitized Solar Cells ◽

Polymer Materials ◽

Hybrid Solar Cells ◽

Dye Sensitized ◽

The Family ◽

Silicon Based ◽

Sensitized Solar Cells

Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) is increasingly being used in the field of printed and flexible electronics in the form of electrode as well as intermediate layer. PEDOT:PSS belongs to the family of intrinsically conducting polymer materials whose members can conduct electricity in spite of their organic nature without the presence of metals. It is non-toxic, stable in the presence of air and humidity. Above all, it can be easily processed through conventional means. This chapter deals with the applications of PEDOT:PSS in organic solar cells (OSCs), dye sensitized solar cells (DSSCs) and silicon based hybrid solar cells. PEDOT:PSS is being used as electrode, buffer layer and hole conductive layer. It could manipulate the catalytic nature of counter electrode used in DSSCs. Whereas it may help to manipulate the morphological character in Si based hybrid solar cells along with enhancement of cell performance.

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Adhesion and Mechanical Properties of PDMS-Based Materials Probed with AFM: A Review

REVIEWS ON ADVANCED MATERIALS SCIENCE ◽

10.1515/rams-2018-0038 ◽

2018 ◽

Vol 56 (1) ◽

pp. 62-78 ◽

Cited By ~ 5

Author(s):

S. Vlassov ◽

S. Oras ◽

M. Antsov ◽

I. Sosnin ◽

B. Polyakov ◽

...

Keyword(s):

Mechanical Properties ◽

Flexible Electronics ◽

Food Industry ◽

2D Materials ◽

Organic Polymer ◽

Adhesive Properties ◽

Force Microscopy ◽

Atomic Force ◽

Dry Adhesives ◽

Silicon Based

Abstract Polydimethylsiloxane (PDMS) is the most widely used silicon-based organic polymer, and is particularly known for its unusual rheological properties. PDMS has found extensive usage in various fields ranging from microfluidics and flexible electronics to cosmetics and food industry. In certain applications, like e.g. dry adhesives or dry transfer of 2D materials, adhesive properties of PDMS play crucial role. In this review we focus on probing the mechanical and adhesive properties of PDMS by means of atomic force microscopy (AFM). Main advantages and limitations of AFM-based measurements in comparison to macroscopic tests are discussed.

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High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

Nano Convergence ◽

10.1186/s40580-020-00243-6 ◽

2020 ◽

Vol 7 (1) ◽

Author(s):

Abhishek Singh Dahiya ◽

Dhayalan Shakthivel ◽

Yogeenth Kumaresan ◽

Ayoub Zumeit ◽

Adamos Christou ◽

...

Keyword(s):

Flexible Electronics ◽

High Performance ◽

Printed Electronics ◽

Functional Materials ◽

Transfer Printing ◽

Semiconducting Materials ◽

Large Area ◽

Contact Printing ◽

Scale Structures ◽

Silicon Based

Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

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