scholarly journals Review on Creep Analysis and Solved Problems

Creep ◽  
2018 ◽  
Author(s):  
Vahid Monfared
Keyword(s):  
Creep Analysis

Creep Analysis for an Unbonded Flexible Pipe Barrier

2006 ◽  
Author(s):  
Lun Qiu ◽  
John Zhang
Keyword(s):  
Finite Element ◽  
Creep Behavior ◽  
Barrier Layer ◽  
Polyvinylidene Fluoride ◽  
Element Model ◽  
Polymer Materials ◽  
Flexible Pipe ◽  
Internal Fluid ◽  
Creep Analysis ◽  
Parameter Matching

The fluid barrier in an unbonded flexible pipe seals the pressure from the internal fluid. Since the barrier is usually made of polymer materials, it is unable to hold the pressure by itself. A metal reinforced hoop layer is usually needed outside the barrier layer in order to resist the pressure. The hoop layer is usually a steel bar with a cross-section of an irregular shape. It is helically wrapped at the outside of the barrier layer. When the pipe is pressurized, the barrier will be supported by the hoop reinforcement layer from outside. However, at the gap between the steel wraps where the barrier layer bridges, material of the barrier will be forced to extrude into the gap. The amount of the extrusion is a function of many parameters such as temperature, material property, and internal pressure and so on. In addition, it is time dependent. The creep effect needs be considered. It is critical to have a proper barrier design for a flexible pipe structure. This article presents a practical finite element method for evaluation of the barrier/gap design. The creep behavior of the polymers is multi-parameter related. Therefore, a series of material tests has been conducted under various stresses and temperatures for nylon, polyethylene and Polyvinylidene Fluoride. In this work a method is given to determine the creep behavior parameters through parameter matching based on the tests. The creep deformation of barrier was analyzed with a finite element model using these parameters.

scholarly journals Fine-Grainedcellular Concrete Creep Analysis Technique with Consideration Forcarbonation

2015 ◽  
Vol 9 (4) ◽  
Author(s):  
Said-Alvi Yusupovich Murtazaiev ◽  
Valeriy Stanislavovich Lesovik ◽  
Deni Karim-Sultanovich Bataiev ◽  
Natalia Vasilievna Chernysheva ◽  
Magomed Salamuvich Saidumov
Keyword(s):  
Concrete Creep ◽  
Analysis Technique ◽  
Creep Analysis

scholarly journals Transient Creep Analysis of Pressurized Circular Cylindrical Shells

1969 ◽  
Vol 12 (54) ◽  
pp. 1270-1278 ◽  
Author(s):  
Sumio MURAKAMI ◽  
Shuhei IWATSUKI
Keyword(s):  
Cylindrical Shells ◽  
Transient Creep ◽  
Creep Analysis ◽  
Circular Cylindrical Shells

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

Transient creep analysis of ball indentation

1995 ◽  
Vol 37 (11) ◽  
pp. 1179-1202 ◽  
Author(s):  
N Ogbonna ◽  
N.A Fleck ◽  
A.C.F Cocks
Keyword(s):  
Transient Creep ◽  
Ball Indentation ◽  
Creep Analysis
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