scholarly journals Application of Ni-P Alloys to A Mold Material for Thermal Imprinting on Pyrex Glass

Author(s):  
Harutaka Mekaru
Keyword(s):  
1954 ◽  
Vol 20 (231) ◽  
pp. 208-216 ◽  
Author(s):  
Akira KOBAYASHI ◽  
Kazushige TANAKA
Keyword(s):  

2020 ◽  
Vol 50 (5) ◽  
pp. 296-302
Author(s):  
O. G. Prikhod’ko ◽  
V. B. Deev ◽  
E. S. Prusov ◽  
A. I. Kutsenko

Alloy Digest ◽  
2009 ◽  
Vol 58 (7) ◽  

Abstract Aluminum has long been accepted as a mold material. This alloy has a combination of faster machining, highest heat transfer, lighter weight, higher strength in thick sections, and greater thermal conductivity than other aluminum alloys. This datasheet provides information on physical properties, hardness, elasticity, and tensile properties. It also includes information on forming and machining. Filing Code: AL-423. Producer or source: Alcoa Forged and Cast Products.


Silicon ◽  
2021 ◽  
Author(s):  
Nitesh Kumar Sinha ◽  
I. N. Choudhary ◽  
J. K. Singh
Keyword(s):  

1992 ◽  
Vol 42 (1) ◽  
pp. 87-92 ◽  
Author(s):  
F. Boumaza ◽  
Ph. Déjardin ◽  
F. Yan ◽  
F. Bauduin ◽  
Y. Holl

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