scholarly journals Laser Soldering

10.5772/51527 ◽  
2013 ◽  
Author(s):  
Ezeonu Stella
Keyword(s):  
Laser Soldering

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (3rd Report)

1994 ◽  
Vol 60 (12) ◽  
pp. 1806-1810 ◽  
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Masaharu YOSHIDA ◽  
Osamu HAYASHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

2008 ◽  
Vol 18 (4) ◽  
pp. 814-818 ◽  
Author(s):  
Zong-jie HAN ◽  
Song-bai XUE ◽  
Jian-xin WANG ◽  
Xin ZHANG ◽  
Liang ZHANG ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Diode Laser ◽  
Lead Free ◽  
Soldering Technology ◽  
Laser Soldering ◽  
Lead Free Solders

Effects of hydration on laser soldering

1997 ◽  
Author(s):  
Eric K. Chan ◽  
Dennis T. Brown ◽  
Ian S. Kovach ◽  
Ashley J. Welch
Keyword(s):  
Laser Soldering

Optimal laser condition for laser soldering in cream and ring solder

2013 ◽  
Author(s):  
Risako Kibushi ◽  
Tomoyuki Hatakyeama ◽  
Dai Imai ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Laser Soldering ◽  
Laser Condition

1494: A New Method of Tissue Bonding: Laparoscopic Laser Soldering Pyeloplasty in the Porcine Model

2004 ◽  
Vol 171 (4S) ◽  
pp. 393-393
Author(s):  
Leonid Lobik ◽  
Dmitry Shumalinsky ◽  
Tamar Vasilyev ◽  
Avi Ravid ◽  
Abraham Katzir ◽  
...  
Keyword(s):  
Porcine Model ◽  
New Method ◽  
Laser Soldering

Advances in laser soldering using high power diode lasers

2003 ◽  
Author(s):  
Anthony P. Hoult ◽  
A. J. McLenaghan ◽  
J. Rathod
Keyword(s):  
High Power ◽  
Diode Lasers ◽  
Laser Soldering ◽  
Power Diode
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