scholarly journals Molecular Simulation of Dissociation Phenomena of Gas Molecule on Metal Surface

10.5772/35616 ◽  
2012 ◽  
Author(s):  
Takashi Tokumasu
Keyword(s):  
Molecular Simulation ◽  
Metal Surface ◽  
Gas Molecule

Molecular dynamics study for dissociation phenomena of a gas molecule on a metal surface

2008 ◽  
Vol 37 (8) ◽  
pp. 485-498 ◽  
Author(s):  
Takashi Tokumasu ◽  
Kanako Hara ◽  
Daigo Ito
Keyword(s):  
Molecular Dynamics ◽  
Metal Surface ◽  
Gas Molecule

Molecular simulation and ablation property on the laser-induced metal surface

2019 ◽  
Author(s):  
Qingshun Bai ◽  
Yuhai Li ◽  
Rongqi Shen ◽  
Kai Zhang ◽  
Xinxiang Miao ◽  
...  
Keyword(s):  
Molecular Simulation ◽  
Metal Surface ◽  
Ablation Property

Electrochemical nucleation and growth of copper on iron and aluminum: A TEM study of industrial copper cementation

1978 ◽  
Vol 36 (1) ◽  
pp. 454-455
Author(s):  
L.E. Murr ◽  
V. Annamalai
Keyword(s):  
Metal Surface ◽  
Copper Deposit ◽  
Nucleation And Growth ◽  
16Th Century ◽  
Electrochemical Reactions ◽  
Mine Shaft ◽  
De Re ◽  
Copper Precipitation ◽  
Electrochemical Nucleation ◽  
Interesting System

Georgius Agricola in 1556 in his classical book, “De Re Metallica”, mentioned a strange water drawn from a mine shaft near Schmölnitz in Hungary that eroded iron and turned it into copper. This precipitation (or cementation) of copper on iron was employed as a commercial technique for producing copper at the Rio Tinto Mines in Spain in the 16th Century, and it continues today to account for as much as 15 percent of the copper produced by several U.S. copper companies.In addition to the Cu/Fe system, many other similar heterogeneous, electrochemical reactions can occur where ions from solution are reduced to metal on a more electropositive metal surface. In the case of copper precipitation from solution, aluminum is also an interesting system because of economic, environmental (ecological) and energy considerations. In studies of copper cementation on aluminum as an alternative to the historical Cu/Fe system, it was noticed that the two systems (Cu/Fe and Cu/Al) were kinetically very different, and that this difference was due in large part to differences in the structure of the residual, cement-copper deposit.

Rapid Freezing of Freeze-Etch Specimens

1980 ◽  
Vol 38 ◽  
pp. 752-755
Author(s):  
A. Elgsaeter ◽  
T. Espevik ◽  
G. Kopstad
Keyword(s):  
Low Temperature ◽  
Metal Surface ◽  
Relative Velocity ◽  
Thermal Contact ◽  
High Rate ◽  
Rapid Freezing ◽  
Temperature Decrease ◽  
Freeze Etching

The importance of a high rate of temperature decrease (“rapid freezing”) when freezing specimens for freeze-etching has long been recognized1. The two basic methods for achieving rapid freezing are: 1) dropping the specimen onto a metal surface at low temperature, 2) bringing the specimen instantaneously into thermal contact with a liquid at low temperature and subsequently maintaining a high relative velocity between the liquid and the specimen. Over the last couple of years the first method has received strong renewed interest, particularily as the result of a series of important studies by Heuser and coworkers 2,3. In this paper we will compare these two freezing methods theoretically and experimentally.

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