scholarly journals Pulse Laser Ablation by Reflection of Laser Pulse at Interface of Transparent Materials

Author(s):  
Kunihito Nagayama ◽  
Yuji Utsunomiya ◽  
Takashi Kajiwara ◽  
Takashi Nishiyam
2015 ◽  
Vol 110 ◽  
pp. 51-55 ◽  
Author(s):  
Bruno Yue Cai ◽  
Xianglei Mao ◽  
Huaming Hou ◽  
Vassilia Zorba ◽  
Richard E. Russo ◽  
...  

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2009 ◽  
Vol 255 (17) ◽  
pp. 7605-7609 ◽  
Author(s):  
D.P. Korfiatis ◽  
K.-A. Th. Thoma ◽  
J.C. Vardaxoglou

2013 ◽  
Vol 8 (02) ◽  
pp. P02007-P02007 ◽  
Author(s):  
V Chaudhari ◽  
K Patel ◽  
A Srivastava ◽  
V Sivakumaran ◽  
R K Singh ◽  
...  

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