scholarly journals Small Hole Filling in ITK

2011 ◽  
Author(s):  
David Doria

This code provides an implementation of a simple technique to fill small holes in an image. We use a multi-pass method that fills pixels on the border of a hole with the average of its non-hole 8-connected neighbors. This process is repeated until all holes are filled.The code is available here: https://github.com/daviddoria/SmallHoleFiller

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 828
Author(s):  
Zhaolong Li ◽  
Ye Dai

This paper presents a simulation and experimental study of the structure of small holes in GH4169 alloy electrolytic ally processed by tube electrodes with different characteristic power sources. It analyzes the multi-physical field coupling relationship of flow, temperature, and electric fields within the interstitial space. The results indicate that the tube electrode electrolytic processing of the GH4169 alloy small hole structure with a pulsed power supply has more uniform temperature and current density distribution within the gap, which is beneficial to the processing accuracy and smoothness of the small hole structure. Meanwhile, SEM was used to analyze the microscopic morphology of the electrode end surface during short-circuiting, and it was concluded that as the processing continued, the electrode end surface gradually produced a non-metallic oxide layer, which destroyed the electric field of the gap and affected the processing stability. The use of high-frequency positive and negative pulse power can effectively avoid the generation of a non-metallic oxide layer. Through the combination of simulation analysis and experimental verification, it is concluded that increasing electrolyte pressure in stages can effectively improve machining accuracy and stability. The interstitial current increases as the feed rate of the tool electrode increases, and the diameter of the machined small hole decreases as it increases.


2017 ◽  
Vol 5 (2_suppl2) ◽  
pp. 2325967117S0008
Author(s):  
Gökçer Uzer ◽  
Nuh Mehmet Elmadağ ◽  
Fatih Yıldız ◽  
Yunus Güzel ◽  
Olgu Enis Tok

Purpose: The purpose of this study is small hole microfracure method comparing with traditional microfracture method and investigation of effect of HA based acellular matrix scaffold on microfracture area. Materials-Methods: 21 Twenty-one New Zealand white rabbits were used for the in vitro portion of this study, bilateral knee joint from the same rabbit were same technic. An articular cartilage defect was established in the femoral trochlear groove about 5 mm. Control group was established alone microfracture (MF). 6 groups were formed in this study and each group has 3 rabbits and their six knees. In 3 groups were applied different number of small diameter hole microfracture (4,5,6 small holes microfracture respectively)and the other 3 groups were applied different number of small diameter hole microfracture (4,5,6 small holes micro fracture respectively added HA based acellular matrix scaffold in the same size ostechondral lesion. The regenerated tissues were harvested for gross morphology, histology at 12 weeks postoperatively. Results: Cartilage were regenerated, maintaining a constant thickness of cartilage. MF group has worse Wakitani scores than 6 small diameter holes mıcrofracture groups(group 6 and group 7) in either parameter of the score. (p=0,043, p=0,016) Matrix addition did not contribute to healing. (p=1,000) Conclusions: Increasing number of the small diameter holes microfracture (minimum %15 of defect size) improves cartilage repair compared with traditional MF in the same size ostechondral lesion. Also small diameter holes microfracture combined with HA-based AM implantation didn’t result in improved quality of the regenerated cartilage tissue.


2013 ◽  
Vol 456 ◽  
pp. 358-362
Author(s):  
Jian Hua Ning ◽  
Zheng Ping Hai

this paper first determines the deformation modes of punching small-hole punches by analyzing the forms of the stress applied to die working parts. It analyzes the disadvantages of existing methods for preventing the buckling problem in punching small holes such as protective jackets and proposes a method for preventing the buckling of punches by reducing the punching force so as to make it possible to punch smaller holes.


2010 ◽  
Vol 148-149 ◽  
pp. 769-773
Author(s):  
Yu Qing Shi

Deep-drawing is one of the most important methods to form sheet metal ,but wrinkling and fracture are the main failure modes in sheet-metal forming. Blank shape is important for deep-drawing because of an effective way to promote deep formability sheet metal .This paper presents an attempt to determine the effect of circle blank with circular diving equally small hole on edge of circle blank on the fracture and wrinkling and was investigated using 08Al sheet metal .The circular blank with small hole of diameter = was analyzed to eliminate wrinkling and fracture in deep-drawing .The aim of this study is to investigate the circular diving equally small hole on edge of circle blank on formability in the deep-drawing process and to obtain useful date from the industrial field .The experiment show that limit formability promote with punching small holes on circle blank in deep-drawing process.


Author(s):  
Vladimir SERBIN ◽  
Boris NAZAR
Keyword(s):  

In article is theoretically motivated possibility uses the wheel shapers small hole being element rotary - small hole of the seeders for direct sowing of the agricultural cultures. It Is Motivated dynamic scheme of the swing wheel shaping small hole, their border amount depending on kinematics of the factor and is installed that peak slide reveals itself on background of the even slide, which in phase locations at the depth shaper small hole practical does not introduce significant.


Author(s):  
L. Andrew Staehelin

Freeze-etched membranes usually appear as relatively smooth surfaces covered with numerous small particles and a few small holes (Fig. 1). In 1966 Branton (1“) suggested that these surfaces represent split inner mem¬brane faces and not true external membrane surfaces. His theory has now gained wide acceptance partly due to new information obtained from double replicas of freeze-cleaved specimens (2,3) and from freeze-etch experi¬ments with surface labeled membranes (4). While theses studies have fur¬ther substantiated the basic idea of membrane splitting and have shown clearly which membrane faces are complementary to each other, they have left the question open, why the replicated membrane faces usually exhibit con¬siderably fewer holes than particles. According to Branton's theory the number of holes should on the average equal the number of particles. The absence of these holes can be explained in either of two ways: a) it is possible that no holes are formed during the cleaving process e.g. due to plastic deformation (5); b) holes may arise during the cleaving process but remain undetected because of inadequate replication and microscope techniques.


Author(s):  
P. B. Basham ◽  
H. L. Tsai

The use of transmission electron microscopy (TEM) to support process development of advanced microelectronic devices is often challenged by a large amount of samples submitted from wafer fabrication areas and specific-spot analysis. Improving the TEM sample preparation techniques for a fast turnaround time is critical in order to provide a timely support for customers and improve the utilization of TEM. For the specific-area sample preparation, a technique which can be easily prepared with the least amount of effort is preferred. For these reasons, we have developed several techniques which have greatly facilitated the TEM sample preparation.For specific-area analysis, the use of a copper grid with a small hole is found to be very useful. With this small-hole grid technique, TEM sample preparation can be proceeded by well-established conventional methods. The sample is first polished to the area of interest, which is then carefully positioned inside the hole. This polished side is placed against the grid by epoxy Fig. 1 is an optical image of a TEM cross-section after dimpling to light transmission.


1962 ◽  
Vol 42 (2) ◽  
pp. 157-159 ◽  
Author(s):  
Eugene J. Gangarosa ◽  
William R. Beisel

1998 ◽  
Vol 21 (4) ◽  
pp. 109-114
Author(s):  
C Albarrán ◽  
R Montés-Micó ◽  
A M Pons ◽  
A Gené ◽  
A Lorente

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