Paleozoic Stratigraphy, Tectonism, Thermal History, and Basin Evolution of Central Colorado

Basin evolution, thermal history and hydrocarbon potential of the St. George Basin, Bering Sea, Alaska: a comparative study using one- and two-dimensional models

Marine and Petroleum Geology ◽

10.1016/0264-8172(91)90062-6 ◽

1991 ◽

Vol 8 (4) ◽

pp. 392-409

Author(s):

K. Carter ◽

I. Lerche

Keyword(s):

Comparative Study ◽

Bering Sea ◽

Thermal History ◽

Hydrocarbon Potential ◽

Basin Evolution ◽

Two Dimensional ◽

Dimensional Models

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Thermal history and basin evolution of the Moatize - Minjova Coal Basin (N'Condédzi sub-basin, Mozambique) constrained by organic maturation levels

Journal of African Earth Sciences ◽

10.1016/j.jafrearsci.2019.02.020 ◽

2019 ◽

Vol 153 ◽

pp. 219-238 ◽

Cited By ~ 7

Author(s):

Francesca Galasso ◽

Paulo Fernandes ◽

Giovanni Montesi ◽

João Marques ◽

Amalia Spina ◽

...

Keyword(s):

Thermal History ◽

Basin Evolution ◽

Coal Basin

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Basin evolution, and the timing and extent of oil generation, Canning River region, North Slope, Alaska; preliminary Basin2 calculations assuming a conductive thermal history

Open-File Report ◽

10.3133/ofr97711 ◽

1997 ◽

Author(s):

E.L. Rowan

Keyword(s):

Thermal History ◽

North Slope ◽

Basin Evolution ◽

Oil Generation ◽

River Region

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Analytical electron microscopy of grain boundaries in Al-Cu metallizations

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100133059 ◽

1992 ◽

Vol 50 (2) ◽

pp. 1684-1685

Author(s):

J. R. Michael ◽

A. D. Romig ◽

D. R. Frear

Keyword(s):

Electron Microscopy ◽

Integrated Circuits ◽

Failure Mode ◽

Current Density ◽

Thermal History ◽

Analytical Electron Microscopy ◽

Cu Metallization ◽

Analytical Electron ◽

Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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