EVOLUTION OF INVISIBLE Au IN ARSENIAN PYRITE IN CARLIN-TYPE Au DEPOSITS

2020 ◽  
Author(s):  
Qing-Lin Liang ◽  
Zhuojun Xie ◽  
Xie-Yan Song ◽  
Richard Wirth ◽  
Yong Xia ◽  
...  

Abstract A significant characteristic distinguishing Carlin-type Au deposits from other Au deposits is the abundance of invisible Au in arsenian pyrite. Gold occurs primarily as ionic Au1+ in arsenian pyrite and is unstable during subsequent thermal events. In this study, we used the focused ion beam combined with scanning electron microscope (FIB-SEM) techniques, and a transmission electron microscope (TEM) to examine invisible Au and how it evolved through later geologic events that eventually led to the formation of Au nanoparticles. FIB-SEM techniques were used to prepare site-specific TEM foils from four Carlin-type gold deposits, including Getchell and Cortez Hills, Nevada, USA, and Shuiyindong and Jinfeng, Guizhou Province, China. These samples were analyzed to quantify ore pyrite chemistry and evaluate textures at the nanometer scale. In 17 examined TEM foils, we observed widespread Au-rich domains in high-grade Au arsenian pyrites from the Getchell and Cortez Hills Au deposits and the Jinfeng deposit but only 10 Au-bearing nanoparticles, ~10 to 20 nm in diameter. The Au-rich domains exhibit Au (Sb), (Tl), (Hg), and (Cu) peaks in the energy dispersive X-ray (EDX) spectrum without the presence of recognizable nanoparticles. This confirms that Au is invisible even at a nanometer scale and is most likely present in the crystal structure of arsenian pyrite. Stacking faults and nanometer-sized fluid inclusions were commonly observed in Au-bearing arsenian pyrite from the four deposits, implying rapid crystallization. Moreover, unlike the coarsely crystalline arsenian pyrite from Guizhou Carlin-type Au deposits, arsenian pyrite from Carlin-type deposits in Nevada consists of fine-grained polycrystalline aggregates, further implying rapid crystallization. Additionally, curved dislocations were commonly pinned by solid inclusions, reflecting a former annealing process. Combining nanoscale textures with geologic information previously reported for Carlin-type deposits, invisible ionic Au was initially incorporated into the crystal structure of arsenian pyrite during rapid precipitation. Subsequent post-ore magmatic events in both districts initiated the annealing of the ionic Au-bearing arsenian pyrite, leading to the redistribution of trace elements and formation of Au-bearing nanoparticles in the arsenian pyrite. The presence of predominantly ionically bonded Au in arsenian pyrite confirms that ore fluids were not saturated in Au when Au-bearing arsenian pyrite formed, as previously reported for Carlin-type deposits. Ionic Au that was scavenged from an undersaturated ore fluid and incorporated into the arsenian pyrite crystal structure formed the giant Carlin-type Au deposits.

Author(s):  
E. Hendarto ◽  
S.L. Toh ◽  
J. Sudijono ◽  
P.K. Tan ◽  
H. Tan ◽  
...  

Abstract The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.


Author(s):  
H. J. Bender ◽  
R. A. Donaton

Abstract The characteristics of an organic low-k dielectric during investigation by focused ion beam (FIB) are discussed for the different FIB application modes: cross-section imaging, specimen preparation for transmission electron microscopy, and via milling for device modification. It is shown that the material is more stable under the ion beam than under the electron beam in the scanning electron microscope (SEM) or in the transmission electron microscope (TEM). The milling of the material by H2O vapor assistance is strongly enhanced. Also by applying XeF2 etching an enhanced milling rate can be obtained so that both the polymer layer and the intermediate oxides can be etched in a single step.


Author(s):  
Becky Holdford

Abstract On mechanically polished cross-sections, getting a surface adequate for high-resolution imaging is sometimes beyond the analyst’s ability, due to material smearing, chipping, polishing media chemical attack, etc.. A method has been developed to enable the focused ion beam (FIB) to re-face the section block and achieve a surface that can be imaged at high resolution in the scanning electron microscope (SEM).


Author(s):  
Julien Goxe ◽  
Béatrice Vanhuffel ◽  
Marie Castignolles ◽  
Thomas Zirilli

Abstract Passive Voltage Contrast (PVC) in a Scanning Electron Microscope (SEM) or a Focused Ion Beam (FIB) is a key Failure Analysis (FA) technique to highlight a leaky gate. The introduction of Silicon On Insulator (SOI) substrate in our recent automotive analog mixed-signal technology highlighted a new challenge: the Bottom Oxide (BOX) layer, by isolating the Silicon Active Area from the bulk made PVC technique less effective in finding leaky MOSFET gates. A solution involving sample preparation performed with standard FA toolset is proposed to enhance PVC on SOI substrate.


Author(s):  
Romaneh Jalilian ◽  
David Mudd ◽  
Neil Torrez ◽  
Jose Rivera ◽  
Mehdi M. Yazdanpanah ◽  
...  

Abstract The sample preparation for transmission electron microscope can be done using a method known as "lift-out". This paper demonstrates a method of using a silver-gallium nanoneedle array for a quicker sharpening process of tungsten probes with better sample viewing, covering the fabrication steps and performance of needle-tipped probes for lift-out process. First, an array of high aspect ratio silver-gallium nanoneedles was fabricated and coated to improve their conductivity and strength. Then, the nanoneedles were welded to a regular tungsten probe in the focused ion beam system at the desired angle, and used as a sharp probe for lift-out. The paper demonstrates the superior mechanical properties of crystalline silver-gallium metallic nanoneedles. Finally, a weldless lift-out process is described whereby a nano-fork gripper was fabricated by attaching two nanoneedles to a tungsten probe.


2010 ◽  
Vol 16 (S2) ◽  
pp. 214-215
Author(s):  
T Tanigaki ◽  
K Ito ◽  
K Nakamura ◽  
Y Nagakubo ◽  
J Azuma ◽  
...  

Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.


2000 ◽  
Vol 6 (5) ◽  
pp. 452-462 ◽  
Author(s):  
Julie M. Cairney ◽  
Robert D. Smith ◽  
Paul R. Munroe

AbstractTransmission electron microscope samples of two types of metal matrix composites were prepared using both traditional thinning methods and the more novel focused ion beam miller. Electropolishing methods were able to produce, very rapidly, thin foils where the matrix was electron transparent, but the ceramic reinforcement particles remained unthinned. Thus, it was not possible in these foils to study either the matrix-reinforcement interface or the microstructure of the reinforcement particles themselves. In contrast, both phases in the composites prepared using the focused ion beam miller thinned uniformly. The interfaces in these materials were clearly visible and the ceramic reinforcement was electron transparent. However, microstructural artifacts associated with ion beam damage were also observed. The extent of these artifacts and methods of minimizing their effect were dependent on both the materials and the milling conditions used.


Sign in / Sign up

Export Citation Format

Share Document