Moire interferometry for out-of-plane displacement measurement

1989 ◽  
Author(s):  
Mun-tong Cheung
Keyword(s):  
Moiré Interferometry ◽  
Displacement Measurement ◽  
Moire Interferometry ◽  
Out Of Plane ◽  
Plane Displacement

Out-of-plane displacement measurement by means of endoscopic moiré interferometry

2004 ◽  
Vol 75 (2) ◽  
pp. 492-496 ◽  
Author(s):  
R. A. Martı́nez-Celorio ◽  
Joris J. J. Dirckx ◽  
Luis Martı́-López ◽  
Francisco G. Peña-Lecona
Keyword(s):  
Moiré Interferometry ◽  
Displacement Measurement ◽  
Moire Interferometry ◽  
Out Of Plane ◽  
Plane Displacement

Moire interferometry for out-of-plane displacement measurement

1986 ◽  
Vol 21 (1) ◽  
pp. 51-54 ◽  
Author(s):  
A Asundi ◽  
M T Cheung
Keyword(s):  
High Sensitivity ◽  
Moiré Interferometry ◽  
Displacement Measurement ◽  
Moire Interferometry ◽  
Double Exposure ◽  
Phase Grating ◽  
Out Of Plane ◽  
Plane Displacement ◽  
Exposure Technique

A high sensitivity technique for out-of-plane displacement is demonstrated. A 600 lines mm phase grating is used in conjunction with a specularly reflecting (in some cases mirrored) object, to obtain contours of out-of-plane displacement. Initial patterns due to low quality optics are eliminated by a double exposure technique employing carrier (or mismatch) fringes. Beams with cracks are used to experimentally demonstrate this technique.

A Study of the Deformation Measurement of 3D Displacement Field

2005 ◽  
Vol 295-296 ◽  
pp. 313-318
Author(s):  
S.R. Lee ◽  
Z.S. Luo ◽  
H.S. Chiou ◽  
B.G. Wang ◽  
L.S. Liu
Keyword(s):  
Displacement Field ◽  
Incident Angle ◽  
Vertical Direction ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Measuring Error ◽  
Moire Interferometry ◽  
First Order ◽  
Out Of Plane ◽  
Plane Displacement

With the development of modern engineering such as micro-electro-mechanical system (MEMS) and new material, the deformation measurement of 3D displacement field is required. Moiré interferometry has become common for measuring the deformations of two-dimension in-plane displacement field. To solve the problem of 3D displacement field, a system for measuring the deformations of 3D displacement field is designed. By using this system, we can measure the out-of-plane displacement by appending a set of electronic speckle interference system based on Moiré interferometry system. Adjusting the incident angle of the incident light, the transmitting direction of the first order diffracted wave in a Moiré interferometry system is assigned to deviate with a small angle from the vertical direction of the specimen surface. Thus the first order diffracted wave is separated from the place of the appended interference field. The striated patterns of the deformations of 3D displacement field can be obtained at the same time. These striated patterns are recorded respectively by three CCD cameras and are stored and processed by a computer. The synchronous measuring method brings certain amount of measuring errors into the measurement of in-plane displacement. This measuring error is analyzed in theory. When real-time measurement is not required, this system can be changed into another system in which the in-plane and the out-of-plane displacement field are measured by time sharing to reduce the measuring errors. The theoretical derivation and a part of experimental results for verification are presented.

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

1996 ◽  
Vol 118 (3) ◽  
pp. 157-163 ◽  
Author(s):  
B. Han ◽  
Y. Guo ◽  
C. K. Lim ◽  
D. Caletka
Keyword(s):  
Numerical Models ◽  
Measurement Methods ◽  
Moiré Interferometry ◽  
Displacement Measurement ◽  
Optical Methods ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Microelectronics Packaging ◽  
Packaging Design ◽  
Plane Displacement

Verified/predictive modeling has become an integral part of electronic packaging product development in order to reduce costs and cycle time. In this paper, interferometric displacement measurement methods are utilized to verify the validity of numerical models for microelectronics packaging design. Three optical methods with submicron sensitivities are employed: moire´ interferometry, microscopic moire´ interferometry and Twyman/Green interferometry. The first two provide contour maps of in-plane displacement fields, and the third maps out-of-plane displacement fields. Their high sensitivity and high spatial resolution make them ideally suited for verification of numerical models. By combining numerical modeling and experimental verification until the results merge, numerical models become more accurate and dependable. Then, the models can be applied extensively to optimize the package designs with confidence that the models provide effective information on material and geometry sensitivity.

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