Cold Plasma as Effective Tool for Aluminum Surface Cleaning

2016 ◽  
Author(s):  
Anton Popelka ◽  
Igor Krupa
Keyword(s):  
Cold Plasma ◽  
Surface Cleaning ◽  
Aluminum Surface

scholarly journals Air Temperature Measurement and Monitoring Inside Cold Plasma Treatment Reactor for Steel Wire Surface Cleaning Using Fiber Bragg Grating (FBG)

2020 ◽  
Vol 70 (1) ◽  
pp. 155-167
Author(s):  
Mohd Fadthul Ikmal Misnal ◽  
Norizah Redzuan ◽  
Muhamad Nor Firdaus Zainal ◽  
Norhayati Ahmad ◽  
Raja Kamarulzaman Raja Ibrahim ◽  
...  
Keyword(s):  
Plasma Treatment ◽  
Temperature Measurement ◽  
Fiber Bragg Grating ◽  
Air Temperature ◽  
Cold Plasma ◽  
Steel Wire ◽  
Surface Cleaning ◽  
Bragg Grating ◽  
Wire Surface

scholarly journals Atmospheric pressure microwave plasma for aluminum surface cleaning

2020 ◽  
Vol 38 (2) ◽  
pp. 023002 ◽  
Author(s):  
Lucia Bónová ◽  
Weikun Zhu ◽  
Dhruval K. Patel ◽  
Daniel V. Krogstad ◽  
David N. Ruzic
Keyword(s):  
Atmospheric Pressure ◽  
Microwave Plasma ◽  
Surface Cleaning ◽  
Aluminum Surface

The Experimental Study on Paint Removal from Aluminum Surface Using Ice Jet

2013 ◽  
Vol 395-396 ◽  
pp. 732-736
Author(s):  
De Yu Li ◽  
Xiong Duan ◽  
Xing Dong
Keyword(s):  
Experimental Study ◽  
Plastic Deformation ◽  
Substrate Surface ◽  
Surface Damage ◽  
Surface Cleaning ◽  
Aluminum Surface ◽  
Damage Development ◽  
Sem Images ◽  
Paint Coatings ◽  
Paint Removal

Ice jet technology shows a promising prospect of application in surface cleaning and de-painting engineering because of its environmentally friendly feature. The main objective of this work is to present a deeply experimental study on the organic paint removal from aluminum alloy 2A12 substrates and the surface damage development using ice jets. The effects of ice blasting pressure and blasting time on de-painting and damage to the substrate were mainly concerned. It was shown that at blasting pressure of 0.2MPa, organic paint coatings were stripped from the 2A12 substrates. The paint coatings, moreover, were removed more effectively with increasing blasting pressure. Little changes of the roughness of the blasted substrate surface were observed. SEM images showed little plastic deformation at the blasting pressure of 0.5MPa existed on the surface. Whereas, a few of impact craters due to impact of high-velocity ice particles appeared at 0.7MPa for 7 seconds of exposure time with its number increasing obviously for 15seconds.

Investigation of aluminum surface cleaning using cavitating fluid flow

2013 ◽  
Author(s):  
Aurimas Ralys ◽  
Vytautas Striška ◽  
Vadim Mokšin
Keyword(s):  
Fluid Flow ◽  
Surface Cleaning ◽  
Aluminum Surface ◽  
Cavitating Fluid

TEM characterization of silicon epitaxial layer grown on Si-TaS2, eutectic composites

1991 ◽  
Vol 49 ◽  
pp. 802-803
Author(s):  
C.M. Sung ◽  
M. Levinson ◽  
M. Tabasky ◽  
K. Ostreicher ◽  
B.M. Ditchek
Keyword(s):  
Substrate Surface ◽  
Bulk Sample ◽  
Surface Cleaning ◽  
Native Oxide ◽  
Czochralski Growth ◽  
Ion Milling ◽  
Cross Sectional ◽  
Cleaning Methods ◽  
Field Emission Cathodes

Directionally solidified Si/TaSi2 eutectic composites for the development of electronic devices (e.g. photodiodes and field-emission cathodes) were made using a Czochralski growth technique. High quality epitaxial growth of silicon on the eutectic composite substrates requires a clean silicon substrate surface prior to the growth process. Hence a preepitaxial surface cleaning step is highly desirable. The purpose of this paper is to investigate the effect of surface cleaning methods on the epilayer/substrate interface and the characterization of silicon epilayers grown on Si/TaSi2 substrates by TEM.Wafers were cut normal to the <111> growth axis of the silicon matrix from an approximately 1 cm diameter Si/TaSi2 composite boule. Four pre-treatments were employed to remove native oxide and other contaminants: 1) No treatment, 2) HF only; 3) HC1 only; and 4) both HF and HCl. The cross-sectional specimens for TEM study were prepared by cutting the bulk sample into sheets perpendicular to the TaSi2 fiber axes. The material was then prepared in the usual manner to produce samples having a thickness of 10μm. The final step was ion milling in Ar+ until breakthrough occurred. The TEM samples were then analyzed at 120 keV using the Philips EM400T.

Basic Physics in Color-Coded EOS Metallization Failures (Differentiating between EOS and ESD)

1998 ◽  
Author(s):  
Leo G. Henry ◽  
J.H. Mazur
Keyword(s):  
Failure Analysis ◽  
Light Microscope ◽  
Structural Changes ◽  
Surface Oxide ◽  
Aluminum Surface ◽  
Surrounding Area ◽  
Die Surface ◽  
Basic Physics ◽  
Direct Contrast ◽  
Glass Interface

Abstract The task of differentiating precisely between EOS and ESD failures continues to be a challenging one for Failure Analysis Engineers. Electrical OverStress (EOS) failures on the die surface (burnt/fused metallization) of an IC can be characterized mainly by the discoloration at the site of the failures. This is in direct contrast to the lack of discoloration characteristic of ESD failures, which occur almost exclusively below the die surface (oxide and junction failures). To aid in this distinction, this paper attempts to present the underlying physics behind the discoloration produced in the EOS failures. For the EOS failures, the metal fuses due to the longer pulse widths (sec to msec), while for the ESD failures, the silicon melts because of the shorter pulse widths (&lt; &lt; 500 nsec) and higher energy. After EOS, the aluminum surface becomes dark and rough and the oxide in the surrounding area becomes deformed and distorted, resulting in the discoloration observed in the light microscope. This EOS discoloration could be due to one or more of the following: 1) morphological and structural changes at the metal/glass interface and the glass itself; 2) changes in the thickness and scattering behavior of the glass and metal in the failed areas.

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