Finite Element Method for the Study of Belt Edge Delaminations in Truck Tires

2005 ◽  
Vol 78 (4) ◽  
pp. 557-571 ◽  
Author(s):  
Şebnem Özüpek ◽  
Eric B. Becker

Abstract In this study, we develop a computational procedure to predict the initiation and growth of belt layer separations in pneumatic tires. The procedure consists of finite element modeling and analysis of a tire subject to steady state rolling conditions. First, a global analysis that uses a full tire model is performed. Then, critical regions for crack initiation are determined through local analysis around the belt edges. This is followed by the placement of an initial crack in a local model. A sequence of crack configurations is analyzed and tearing energies at various crack sizes are calculated as part of the fatigue crack growth simulation. The final desired result is the prediction of fatigue life of the tire.

2001 ◽  
Vol 29 (3) ◽  
pp. 186-196 ◽  
Author(s):  
X. Yan

Abstract A method is described to predict relative body turn up endurance of radial truck tires using the finite element method. The elastomers in the tire were simulated by incompressible elements for which the nonlinear mechanical properties were described by the Mooney-Rivlin model. The belt, carcass, and bead were modeled by an equivalent orthotropic material model. The contact constraint of a radial tire structure with a flat foundation and rigid rim was treated using the variable constraint method. Three groups of tires with different body turn up heights under inflation and static footprint loading were analyzed by using the finite element method. Based on the detail analysis for stress analysis parameters in the critical regions in the tires, the relative body turn up edge endurance was predicted.


Author(s):  
Erasmo Carrera ◽  
Ibrahim Kaleel ◽  
Manish Nagaraj ◽  
Marco Petrolo

A global-local approach has been developed for the elasto-plastic analysis of thin-walled metal structures, which interfaces between commercial finite element software and advanced structural theories based on the Carrera Unified Formulation (CUF). The structure is modeled in CUF using the Component-Wise approach where Lagrange polynomials enhance the cross-section kinematics of the beam element. The von Mises constitutive model with isotropic work hardening is used to describe the material nonlinearity. Two types of the global-local approach have been discussed: (1) elastoplasticity is considered in both global and local analyses, and (2) a linear global analysis is followed by a nonlinear local analysis. It is shown that the second version maintains the accuracy of the solution for cases where the plastic zone is localized within the structure. The described approach results in a significant reduction in the computational size of the problem, compared to standard 3D finite element analysis.


Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


2021 ◽  
Vol 11 (11) ◽  
pp. 5170
Author(s):  
Marek Krawczuk ◽  
Magdalena Palacz

Modern engineering practice requires advanced numerical modeling because, among other things, it reduces the costs associated with prototyping or predicting the occurrence of potentially dangerous situations during operation in certain defined conditions. Different methods have so far been used to implement the real structure into the numerical version. The most popular have been variations of the finite element method (FEM). The aim of this Special Issue has been to familiarize the reader with the latest applications of the FEM for the modeling and analysis of diverse mechanical problems. Authors are encouraged to provide a concise description of the specific application or a potential application of the Special Issue.


Heritage ◽  
2021 ◽  
Vol 4 (2) ◽  
pp. 585-611
Author(s):  
Michele Betti ◽  
Valentina Bonora ◽  
Luciano Galano ◽  
Eugenio Pellis ◽  
Grazia Tucci ◽  
...  

This paper reports the knowledge process and the analyses performed to assess the seismic behavior of a heritage masonry building. The case study is a three-story masonry building that was the house of the Renaissance architect and painter Giorgio Vasari (the Vasari’s House museum). An interdisciplinary approach was adopted, following the Italian “Guidelines for the assessment and mitigation of the seismic risk of the cultural heritage”. This document proposes a methodology of investigation and analysis based on three evaluation levels (EL1, analysis at territorial level; EL2, local analysis and EL3, global analysis), according to an increasing level of knowledge on the building. A comprehensive knowledge process, composed by a 3D survey by Terrestrial Laser Scanning (TLS) and experimental in situ tests, allowed us to identify the basic structural geometry and to assess the value of mechanical parameters subsequently needed to perform a reliable structural assessment. The museum represents a typology of masonry building extremely diffused in the Italian territory, and the assessment of its seismic behavior was performed by investigating its global behavior through the EL1 and the EL3 analyses.


Author(s):  
Soroosh Hassanpour ◽  
G. R. Heppler

This paper is devoted to the dynamic modeling of micropolar gyroelastic beams and explores some of the modeling and analysis issues related to them. The simplified micropolar beam torsion and bending theories are used to derive the governing dynamic equations of micropolar gyroelastic beams from Hamilton’s principle. Then these equations are solved numerically by utilizing the finite element method and are used to study the spectral and modal behaviour of micropolar gyroelastic beams.


2018 ◽  
Vol 73 ◽  
pp. 12013
Author(s):  
Eko Saputra ◽  
J Jamari ◽  
Han Ay Lie ◽  
Iwan Budiwan Anwar ◽  
Rifky Ismail ◽  
...  

Failure of cement mantle of bond loosening between liner and cement mantle is an important issue in total hip replacement. Two factors that commonly cause cement mantle failure are initial crack and stress. A solution for reducing stress on the cement mantle has been proposed by adding insertion material between liner and cement mantle. Nevertheless, further study is needed to optimize the proposed solution. A possible option is to vary the thickness of the insertion material. If the thickness of the PMMA material is constant, then the variation of the insertion thickness will be followed by the variation of the thickness of the liner. Consequently, the stress value on the liner will follow the variation of liner thickness. The objective of this study is to examine the effect of the thickness variation of the insertion material to stress on cement mantle and liner using finite element simulation. Results revealed that the magnitude of stress and deflection decreased in the cement mantle and the liner along with the increasing thickness of the insertion material.


In the present study, modeling and analysis of a three-lane three-span box bridge has been carried out by using finite element software STAAD pro.v8i. The study has been execute to find the effect of skew angle on all bride slabs (top slab, bottom slab, outer walls, inner walls) under various loads (dead load, live load, surfacing load, earth pressure, temperature and live load surcharge) and their combinations using IRC 6:2016. Skew angles taken for study ranges from 00 to 700 with an interval of 100 . Parameters that are mainly examined are longitudinal moments, transverse moments, torsional moments, shear forces and displacements. It has been observed that with the increase of skew angle all the parameters increases with the increase of skew angles in all slabs.


Author(s):  
Ramchandra M. Kotecha ◽  
Andriy Zakutayev ◽  
Wyatt K. Metzger ◽  
Paul Paret ◽  
Gilberto Moreno ◽  
...  

Abstract Gallium oxide is an emerging wide band-gap material that has the potential to penetrate the power electronics market in the near future. In this paper, a finite-element gallium oxide semiconductor model is presented that can predict the electrical and thermal characteristics of the device. The finite element model of the two-dimensional device architecture is developed inside the Sentaurus environment. A vertical FinFET device architecture is employed to assess the device’s behavior and its static and dynamic characteristics. Enhancement-mode device operation is realized with this type of device architecture without the need for any selective area doping. The dynamic thermal behavior of the device is characterized through its short-circuit behavior. Based on the device static and dynamic behavior, it is envisioned that reliable vertical transistors can be fabricated for the power electronics applications.


Author(s):  
Xinfang Zhang ◽  
Meng Lin ◽  
Allan Okodi ◽  
Leichuan Tan ◽  
Juliana Leung ◽  
...  

Abstract Cracks and corrosion in pipelines can occur simultaneously, representing a hybrid defect known as cracks in corrosion (CIC), which is often difficult to model using the available assessment codes or methods. As a result, detailed modeling of CIC has not been studied extensively. In this study, the extended finite element method (XFEM) has been applied to predict the failure pressures of CIC defects in API 5L Grade X42 and X52 pipes. The pipes were only subjected to internal pressure and the XFEM models were validated using full-scale burst tests available in the literature. Several CIC models with constant total defect depths (55%, and 60% of wall thickness) were constructed to investigate the effect of the initial crack depth on the failure pressure. The failure criterion was defined when wall penetration occurred due to crack growth, i.e., the instance the crack reached the innermost element of the pipe wall mesh. It was observed that for shorter cracks, the failure pressure decreased with the increase of the initial crack depth. The results indicated that the CIC defect could be treated as crack-only defects when the initial crack depth exceeded 50% of the total defect depth. However, for longer cracks, the initial crack depth was found to have a negligible effect on the failure pressure, implying that the CIC defect could be treated as either a crack or a corrosion utilizing the available assessment methods.


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