scholarly journals C7.3 - From Optochemical Sensors for Industrial Processes to Large-Area Printing of Sensor Systems Integrated with Organic Electronics

2011 ◽  
Author(s):  
St. Köstler ◽  
E. Kraker ◽  
M. Sagmeister ◽  
B. Lamprecht ◽  
A. Bizzari ◽  
...  
Keyword(s):  
Organic Electronics ◽  
Industrial Processes ◽  
Sensor Systems ◽  
Large Area

Vacuum processed large area doped thin-film crystals: A new approach for high-performance organic electronics

2021 ◽  
Vol 17 ◽  
pp. 100352
Author(s):  
S.-J. Wang ◽  
M. Sawatzki ◽  
H. Kleemann ◽  
I. Lashkov ◽  
D. Wolf ◽  
...  
Keyword(s):  
Thin Film ◽  
Organic Electronics ◽  
High Performance ◽  
Large Area ◽  
New Approach

Ocean Sensor “Imaging” Arrays Based on Bio-inspired Architectures and 2-D/3-D Construction

2015 ◽  
Vol 49 (3) ◽  
pp. 43-49 ◽  
Author(s):  
David P. Fries ◽  
Chase A. Starr ◽  
Geran W. Barton
Keyword(s):  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Single Point ◽  
Circuit Board ◽  
Sensor Systems ◽  
Large Area ◽  
Imaging Arrays ◽  
Printed Circuits ◽  
Single Sensor ◽  
New Vision

AbstractMany common ocean sensor systems measure a localized space above a single sensor element. Single-point measurements give magnitude but not necessarily direction information. Expanding single sensor elements, such as used in salinity sensors, into arrays permits spatial distribution measurements and allows flux visualizations. Furthermore, applying microsystem technology to these macro sensor systems can yield imaging arrays with high-resolution spatial/temporal sensing functions. Extending such high spatial resolution imaging over large areas is a desirable feature for new “vision” modes on autonomous robotic systems and for deployable ocean sensor systems. The work described here explores the use of printed circuit board (PCB) technology for new sensing concepts and designs. In order to create rigid-conformal, large area imaging “camera” systems, we have merged flexible PCB substrates with rigid constructions from 3-D printing. This approach merges the 2-D flexible electronics world of printed circuits with the 3-D printed packaging world. Furthermore, employing architectures used by biology as a basis for our imaging systems, we explored naturally and biologically inspired designs, their relationships to visual imagining, and alternate mechanical systems of perception. Through the use of bio-inspiration, a framework is laid out to base further research on design for packaging of ocean sensors and arrays. Using 3-D printed exoskeleton's rigid form with flexible printed circuits, one can create systems that are both rigid and form-fitting with 3-D shape and enable new sensor systems for various ocean sensory applications.

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000018-000024
Author(s):  
Holger Kappert ◽  
Sebastian Braun ◽  
Norbert Kordas ◽  
Andre Kosfeld ◽  
Alexander Utz ◽  
...  
Keyword(s):  
High Temperature ◽  
Flip Chip ◽  
Mechanical Load ◽  
Industrial Processes ◽  
Sensor Systems ◽  
Integrated Sensor ◽  
Chip Technology ◽  
Operating Temperatures ◽  
Silver Sintering ◽  
Soi Cmos

Abstract Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical load do not allow a reliable operation of sensitive electronic components. Fraunhofer is running the Lighthouse Project ‘eHarsh’ to overcome this hurdle. In the course of the project an integrated sensor readout electronic has been realized based on a set of three chips. A dedicated sensor frontend provides the analog sensor interface for resistive sensors typically arranged in a Wheatstone configuration. Furthermore, the chipset includes a 32-bit microcontroller for signal conditioning and sensor control. Finally, it comprises an interface chip including a bus transceiver and voltage regulators. The chipset has been realized in a high temperature 0.35 micron SOI-CMOS technology focusing operating temperatures up to 300 °C. The chipset is assembled on a multilayer ceramic LTCC-board using flip chip technology. The ceramic board consists of 4 layers with a total thickness of approx. 0.9 mm. The internal wiring is based on silver paste while external contacts were alternatively manufactured in silver (sintering/soldering) or in gold-alloys (wire bonding). As interconnection technology, silver sintering has been applied. It has already been shown that a significant increase in lifetime can be reached by using silver sintering for die attach applications. Using silver sintering for flip chip technology is a new and challenging approach. By adjusting the process parameter geared to the chipset design and the design of the ceramic board high quality flip chip interconnects can be generated.

Large area, high resolution, dry printing of conducting polymers for organic electronics

2003 ◽  
Vol 82 (3) ◽  
pp. 463-465 ◽  
Author(s):  
Graciela B. Blanchet ◽  
Yueh-Lin Loo ◽  
J. A. Rogers ◽  
F. Gao ◽  
C. R. Fincher
Keyword(s):  
High Resolution ◽  
Conducting Polymers ◽  
Organic Electronics ◽  
Large Area

scholarly journals Broad-Range Hydrogel-Based pH Sensor with Capacitive Readout Manufactured on a Flexible Substrate

Chemosensors ◽  
2018 ◽  
Vol 6 (3) ◽  
pp. 30 ◽  
Author(s):  
Krister Hammarling ◽  
Magnus Engholm ◽  
Henrik Andersson ◽  
Mats Sandberg ◽  
Hans-Erik Nilsson
Keyword(s):  
Flexible Substrate ◽  
Ph Sensor ◽  
Health And Safety ◽  
Sensor Systems ◽  
Large Area ◽  
Contingency Plans ◽  
Multiple Measurements ◽  
Good Repeatability ◽  
New Sensors ◽  
Land Water

Environmental monitoring of land, water and air, is an area receiving greater attention because of human health and safety concerns. Monitoring the type of pollution and concentration levels is vital, so that appropriate contingency plans can be determined. To effectively monitor the environment, there is a need for new sensors and sensor systems that suits these type of measurements. However, the diversity of sensors suitable for low, battery powered- and large area sensor systems are limited. We have manufactured and characterized a flexible pH sensor using laser processing and blade coating techniques that is able to measure pH between 2.94 and 11.80. The sensor consists of an interdigital capacitance with a pH sensitive hydrogel coating. Thin sensors can reach 95% of their final value value within 3 min, and are stable after 4 min. Good repeatability was achieved in regard to cycling of the sensor with different pH and multiple measurements from dry state. We have also studied the relation between an interdigital capacitance penetration depth and hydrogels expansion. We believe that our passive sensor is suitable to be used in low power and large area sensor networks.

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