Examination of Passive Films on Iron-Nickel Alloys by Auger Electron Spectroscopy

CORROSION ◽  
1981 ◽  
Vol 37 (10) ◽  
pp. 549-556 ◽  
Author(s):  
G. T. Burstein

Abstract Detailed analysis of anodic films formed on amorphous iron-nickel alloys containing phosphorus, boron, and molybdenum has been performed by Auger electron spectroscopy. These films contain considerable quantities of P and B both of which are highest at the metal/film interface. Phosphorus accumulates on the metal side of the interface while boron accumulates on the film side, with continuous variation throughout the film thickness. In the film phase, phosphorus shows complex oxidation states. Molybdenum is also found in the films at low concentrations. Polarization curves show that these alloys exhibit greater passivity in 1M HCl than a comparable polycrystalline iron-nickel alloy.

2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.


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