Data Quality, Issues, and Guidelines for Electrochemical Corrosion Potential Measurement in High-Temperature Water

CORROSION ◽  
2003 ◽  
Vol 59 (7) ◽  
pp. 584-596 ◽  
Author(s):  
Y-J. Kim ◽  
P. L. Andresen
Keyword(s):  
High Temperature ◽  
Data Quality ◽  
Corrosion Potential ◽  
Electrochemical Corrosion ◽  
Potential Measurement ◽  
High Temperature Water ◽  
Quality Issues ◽  
Temperature Water

Protective Insulated Coating for IGSCC Mitigation in BWRs

2004 ◽  
Author(s):  
Young-Jin Kim
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Water Chemistry ◽  
Corrosion Potential ◽  
Electrochemical Corrosion ◽  
304 Stainless Steel ◽  
High Temperature Water ◽  
Coating Methods ◽  
Temperature Water

A protective insulated coating (PIC) on 304 stainless steel (SS) surfaces as an IGSCC mitigation method was developed and investigated in high temperature water under various water chemistry conditions by measuring the electrochemical corrosion potential (ECP) and flow-assisted corrosion (FAC) rate. The ECP results clearly demonstrate that the PIC layer restricted oxidant transport to the metal surface, and the ECP remained at <−230 mV (SHE) in 288°C containing high oxygen (O2) and no hydrogen (H2). In this paper, long term durability of PIC layer prepared by various coating methods will be discussed.

Factors Influencing SCC and IASCC of Stainless Steels in High Temperature Water

2004 ◽  
Author(s):  
Peter L. Andresen
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Yield Strength ◽  
Stainless Steels ◽  
Corrosion Potential ◽  
Synergistic Effects ◽  
Cold Work ◽  
Factors Influencing ◽  
High Temperature Water ◽  
Temperature Water

SCC growth studies were performed in high temperature, high purity water on various grades and various conditions of stainless steel. The synergistic effects of corrosion potential, sensitization, cold work (yield strength), temperature and irradiation were evaluated, and their implications to interpreting and modeling SCC in unirradiated and irradiated structures are discussed.

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