Selective separation of heavy metals from printed circuit board rinse wastewater via shear-induced dissociation coupling with ultrafiltration

2020 ◽  
Vol 191 ◽  
pp. 185-192
Author(s):  
Hui-Shang Le ◽  
Han Zhou ◽  
Yun-Ren Qiu
Keyword(s):  
Heavy Metals ◽  
Printed Circuit Board ◽  
Selective Separation ◽  
Circuit Board ◽  
Printed Circuit

Selective separation of Cu, Ni and Ag from printed circuit board waste using an environmentally safe technique

2018 ◽  
Vol 226 ◽  
pp. 76-82 ◽  
Author(s):  
Wagner Barbosa de Souza ◽  
Christian Silva Abreu ◽  
Guilherme Dias Rodrigues ◽  
Aparecida Barbosa Mageste ◽  
Leandro Rodrigues de Lemos
Keyword(s):  
Printed Circuit Board ◽  
Selective Separation ◽  
Circuit Board ◽  
Printed Circuit ◽  
Environmentally Safe ◽  
Safe Technique

scholarly journals Bioleaching of heavy metals from printed circuit board (PCB) by Streptomyces albidoflavus TN10 isolated from insect nest

2019 ◽  
Vol 6 (1) ◽  
Author(s):  
Dhanalashmi Kaliyaraj ◽  
Menaka Rajendran ◽  
Vignesh Angamuthu ◽  
Annam Renita Antony ◽  
Manigundan Kaari ◽  
...  
Keyword(s):  
Heavy Metals ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Streptomyces Albidoflavus ◽  
Removal Of Heavy Metals ◽  
Core Components

Abstract Background E-waste management is extremely difficult to exercise owing to its complexity and hazardous nature. Printed circuit boards (PCBs) are the core components of electrical and electronic equipment, which generally consist of polymers, ceramics, and heavy metals. Results The present study has been attempted for removal of heavy metals from printed circuit board by metal-resistant actinobacterium Streptomyces albidoflavus TN10 isolated from the termite nest. This bacterium was found to recover different heavy metals (Al 66%, Ca 74%, Cu 68%, Cd 65%, Fe 42%, Ni 81%, Zn 82%, Ag 56%, Pb 46%) within 72 h under laboratory conditions. The metal content of PCB after bioleaching was analyzed by ICP-MS. The crude PCB and bioleaching residue were characterized by FT-IR, XRD, SEM for the determination of structural and functional group changes for confirmation of bioleaching. Conclusion The findings of the present study concluded that Streptomyces albidoflavus TN10 is a promising candidate for bioleaching of heavy metals from the printed circuit board as an eco-friendly and cost-effective process.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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