scholarly journals Power Efficient VLSI Inverter Design using Adiabatic Logic and Estimation of Power dissipation using VLSI-EDA Tool

Author(s):  
Samik Samanta

Power dissipation becoming a limiting factor in VLSI circuits and systems. Due to relatively high complexity of VLSI systems used in various applications, the power dissipation in CMOS inverter, arises from it’s switching activity, which is mainly influenced by the supply voltage and effective capacitance.[1,2,3] To optimize power dissipation, the researches show various techniques like appropriate coding, appropriate design architectures, appropriate manipulation algorithms. In this paper we have applied adiabatic logic design approach to design COMS inverter. Adiabatic switching techniques based on energy recovery principle are one of the innovative solutions at a circuit and logic level achieve reduction in power [12] Various adiabatic logic based inverters are shown. Mainly our aim is to design and simulate PFAL inverters. Finally we have calculated dissipated power of static CMOS inverter and compare it with that of PFAL based inverter. [4, 6]

Author(s):  
T. Suguna ◽  
M. Janaki Rani

In VLSI, power optimization is the main criteria for all the portable mobile applications and developments because of its impact on system performance. The performance of an adder has significant impact on overall performance of a digital system. Adiabatic logic (AL), a new emerging research domain for optimizing the power in VLSI circuits with high switching activity is discussed, in this paper, for implementing the adder circuits. Various adiabatic logic styles full adder designs are reviewed and multiplexer based hybrid full adder topology is designed and implemented with ECRL and 2PASCL AL styles. Moreover in this paper, 32 bit adders such as Ripple Carry Adder (RCA), Carry Select Adder (CSLA), Carry Save Adder (CSA), Carry Skip Adder (CSKA) and Brent Kung Adder (BKA) are realised using proposed ECRL and 2PASCL adiabatic full adders. All the adders are implemented and simulated using TANNER EDA tool 22nm technology, parameters like power, area, delay and power delay product (PDP) of all the adders are observed at different operating frequencies, with supply voltage of 0.95 v and load capacitance of 0.5 pF. The observed parameters are compared with the existing adiabatic full adder designs and concluded that the proposed adiabatic full adders have the advantages of less power, delay and transistor count. In conclusion ECRL full adder is 31% faster, has equal PDP and less area than 2PASCL full adder. At 1000MHz ECRL 32 bit carry save adder is having less delay among all the 32 bit adder and 65% less PDP than 2PASCL adder and it is concluded that ECRL 32 bit carry save adder can be selected for implementation of circuits that can be used in portable mobile applications.


2013 ◽  
Vol 22 (02) ◽  
pp. 1250079
Author(s):  
BASHAR HADDAD ◽  
AMIN JARRAH

Recent demand for low power VLSI circuits has been pushing the development of innovative approaches to reduce power dissipation. Supply voltage (V CC ) and switching activity factor (α) are main sources of dynamic power dissipation in CMOS technology. Furthermore, the power dissipation increases exponentially by the value of supply voltage. New approach based on switching activity analysis and multiple supply voltage is implemented successfully in logical circuits, taking in mind the critical path(s) of the design and switching activity factor of each element in the design. High supply voltage is applied on elements on the critical path(s). Elements off the critical path(s) are classified into categories according to their switching activity factors. The total power dissipation is reduced, while the propagation delay remains without any increase. The proposed approach combines the concepts of critical/non-critical paths and switching activity analysis to assign different V CCs to different elements.


Author(s):  
Neha Raghav ◽  
◽  
Malti Bansal

Nowadays, power dissipation is among the most dominant concerns in designing a VLSI circuits. Endless improvement in technology has points to an increased requirement for devices which have the basic characteristic of low power consumption. Hence power has turn into a demanding design parameter in low power and high-performance applications. The Adiabatic logic technique is becoming a solution to the dilemma of power dissipation. Adders with huge power consumption affect the overall efficiency of the system. Hence, in this paper, the proposed application of full adder circuit is shown using the Modified Glitch Free Cascadable Adiabatic Logic. The circuit is compared with the conventional CMOS Logic and the power dissipation analysis is simulated with supply voltage = 0.9 V, 1.2 V and 1.8 V to analyze the pattern followed with supply variation at different temperature range. Similarly, the calculation of delay is performed for temperature values of 27˚C, 55˚C and 120˚C at 90nm technology.


2021 ◽  
Vol 2089 (1) ◽  
pp. 012080
Author(s):  
M. Srinivas ◽  
K.V. Daya Sagar

Abstract Currently, energy consumption in the digital circuit is a key design parameter for emerging mobile products. The principal cause of the power dissipation during idle mode is leakage currents, which are rising dramatically. Sub-threshold leakage is increased by the scaling of threshold voltage when gate current leakage increases because oxide thickness is scaled. With rising demands for mobile devices, leakage energy consumption has received even greater attention. Since a mobile device spends most of its time in standby mode, leakage power savings need to prolong the battery life. That is why low power has become a significant factor in CMOS circuit design. The required design and simulation of an AND gate with the BSIM4 MOS parameter model at 27 0C, supply voltage of 0,70V with CMOS technology of 65nm are the validation of the suitability of the proposed circuit technology. AND simulation. The performance parameters for the two AND input gate are compared with the current MTCMOS and SCCMOS techniques, such as sub-threshold leakage power dissipations in active and standby modes, the dynamic dissipation, and propagation period. The proposed hybrid super cutoff complete stack technique compared to the current MTCMOS technology shows a reduction in sub-threshold dissipation power dissipation by 3. 50x and 1.15x in standby modes and active modes respectively. The hybrid surface-cutting technique also shows savings of 2,50 and 1,04 in power dissipation at the sub-threshold in standby modes and active modes compared with the existing SCCMOS Technique.


2013 ◽  
Vol 31 (1) ◽  
pp. 24-31 ◽  
Author(s):  
Mayank Kumar Rai ◽  
Rajesh Khanna ◽  
Sankar Sarkar

Purpose – This paper aims to propose to study the control of tube parameters in terms of diameter, separation between adjacent tubes and length, on delay and power dissipation in single-walled carbon nanotube (SWCNT) bundle interconnect for VLSI circuits. Design/methodology/approach – The paper considers a distributed-RLC model of interconnect. A CMOS-inverter driving a distributed-RLC model of interconnect with load of 1 pF. A 0.1 GHz pulse of 2 ns rise time provides input to the CMOS-inverter. For SPICE simulation, predictive technology model (PTM) is used for the CMOS-driver. The performance of this setup is studied by SPICE simulation in 22 nm technology node. The results are compared with those of currently used copper interconnect. Findings – SPICE simulation results reveal that delay increases with increase in separation between tubes and diameter whereas the reverse is true for power dissipation. The authors also find that SWCNT bundle interconnects are of lower delay than copper interconnect at various lengths and higher power dissipation due to dominance of larger capacitance of tube bundle. Originality/value – The investigations show that tube parameters can control delay and this can also be utilized to decrease power dissipation in SWCNT bundle interconnects for VLSI applications.


2020 ◽  
Vol 10 (4) ◽  
pp. 457-470 ◽  
Author(s):  
Dipanjan Sen ◽  
Savio J. Sengupta ◽  
Swarnil Roy ◽  
Manash Chanda ◽  
Subir K. Sarkar

Aims:: In this work, a Junction-Less Double Gate MOSFET (JLDG MOSFET) based CMOS inverter circuit is proposed for ultra-low power applications in the near and sub-threshold regime operations. Background:: D.C. performances like power, delay and voltage swing of the proposed Inverter have been modeled analytically and analyzed in depth. JLDG MOSFET has promising features to reduce the short-channel effects compared to the planner MOSFET because of better gate control mechanism. So, proposed Inverter would be efficacious to offer less power dissipation and higher speed. Objective:: Impact of supply voltage, temperature, High-k gate oxide, TOX, TSI on the power, delay and voltage swing of the Inverter circuits have been detailed here. Methods: Extensive simulations using SILVACO ATLAS have been done to validate the proposed logic based digital circuits. Besides, the optimum supply voltage has been modelled and verified through simulation for low voltage operations. In depth analysis of voltage swing is added to measure the noise immunity of the proposed logic based circuits in Sub & Near-threshold operations. For ultra-low power operation, JLDG MOSFET can be an alternative compared to conventional planar MOSFET. Result:: Hence, the analytical model of delay, power dissipation and voltage swing have been proposed of the proposed logic based circuits. Besides, the ultra-low power JLDG CMOS inverter can be an alternative in saving energy, reduction of power consumption for RFID circuit design where the frequency range is a dominant factor. Conclusion:: The power consumption can be lowered in case of UHF, HF etc. RF circuits using the Double Gate Junction-less MOSFET as a device for circuit design.


2018 ◽  
Vol 7 (2.8) ◽  
pp. 103
Author(s):  
P Sahithi ◽  
K Hari Kishore ◽  
E Raghuveera ◽  
P Gopi Krishna

The paper describes a voltage level shifter for power efficient applications which is simulated in tanner spice tool using 45nm technology. The conservative voltage level shifter is designed by using 6 transistors. The voltage level shifter cell generally used for shifting the voltage range of the signal from one voltage domain to another. This is required when the chip operate at multiple voltage domains. The circuit parameters like leakage voltage and average power dissipation are calculate for this circuit. Mainly level shifter consists of two voltage levels. One is low logic supply voltage (VDDL) another one is high logic supply voltage (VDDH). The simulation results of proposed level shifter with Wilson current mirror by 45nm technology for the input frequency of 1MHZ, the power dissipation of 0.177nW with 3db gain of 9.78.


2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Nabihah Ahmad ◽  
Rezaul Hasan

A power efficient circuit topology is proposed to implement a low-voltage CMOS 2-input pass-transistor XOR gate. This design aims to minimize power dissipation and reduce transistor count while at the same time reducing the propagation delay. The XOR gate utilizes six transistors to achieve a compact circuit design and was fabricated using the 130 nm IBM CMOS process. The performance of the XOR circuit was validated against other XOR gate designs through simulations using the same 130 nm CMOS process. The area of the core circuit is only about 56 sq · µm with 1.5659 ns propagation delay and 0.2312 nW power dissipation at 0.8 V supply voltage. The proposed six-transistor implementation thus compares favorably with other existing XOR gate designs.


2014 ◽  
Vol 23 (05) ◽  
pp. 1450061 ◽  
Author(s):  
VIJAY KUMAR SHARMA ◽  
MANISHA PATTANAIK

Since the last two decades, the trend of device miniaturization has increased to get better performance with a smaller area of the logic functions. In deep submicron regime, the demand of fabrication of nanoscale Complementary metal oxide semiconductor (CMOS) VLSI circuits has increased due to evaluation of modern successful portable systems. Leakage power dissipation and reliability issues are major concerns in deep submicron regime for VLSI chip designers. Power supply voltage has been scaled down to maintain the performance yield in future deep submicron regime. The threshold voltage is the critical parameter to trade-off the performance yield and leakage power dissipation in nanoscaled devices. Low threshold voltage improves the device characteristics with large leakage power in nanoscaled devices. Several leakage reduction techniques at different levels are used to mitigate the leakage power dissipation. Lower leakage power increases the reliability by reducing the cooling cost of the portable systems. In this article, we are presenting the explanatory general review of the commonly used leakage reduction techniques at circuit level. We have analyzed the NAND3 gate using HSPICE EDA tool for leakage power dissipation at different technology nodes in active as well as standby modes. Process, voltage and temperature effects are checked for reliability purpose. Our comparative results and discussion of different leakage reduction techniques are very useful to illustrate the effective technique in active and standby modes.


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