Plating, Electroless Nickel-Phosphorus, Co-Deposited with Polytetrafluoroethylene (PTFE)

Analysis of electroless nickel thin films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100086854 ◽

1991 ◽

Vol 49 ◽

pp. 510-511 ◽

Cited By ~ 1

Author(s):

C. W. Price ◽

E. F. Lindsey

Keyword(s):

Thin Films ◽

Inertial Confinement Fusion ◽

Electroless Nickel ◽

Inertial Confinement ◽

Plating Bath ◽

X Ray ◽

Nickel Thin Films ◽

Nickel Deposits ◽

Confinement Fusion ◽

Thickness Measurements

Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.

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ENPLATE NI-423

Alloy Digest ◽

10.31399/asm.ad.ni0343 ◽

1986 ◽

Vol 35 (11) ◽

Keyword(s):

Wear Resistance ◽

Physical Properties ◽

Surface Treatment ◽

High Speed ◽

Chemical Reduction ◽

Electronic Devices ◽

Electroless Nickel ◽

Heat Treating ◽

Corrosion And Wear ◽

Phosphorus Alloy

Abstract ENPLATE NI-423 is a nickel-phosphorus alloy deposited by chemical reduction without electric current. It is deposited by a stable, relatively high-speed functional electroless nickel process that produces a low-stress coating with good ductility and excellent resistance to corrosion. Its many uses include equipment for chemicals and food, aerospace components, molds and electronic devices. This datasheet provides information on composition, physical properties, and hardness. It also includes information on corrosion and wear resistance as well as heat treating, machining, joining, and surface treatment. Filing Code: Ni-343. Producer or source: Enthone Inc..

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ELECTROLESS NICKEL

Alloy Digest ◽

10.31399/asm.ad.ni0332 ◽

1986 ◽

Vol 35 (4) ◽

Keyword(s):

Nickel Coating ◽

Chemical Reduction ◽

Electroless Nickel ◽

Heat Treating ◽

Corrosion And Wear ◽

Sodium Hypophosphite ◽

Work Piece ◽

Nickel Ions ◽

Continuous Contact ◽

Chemical Corporation

Abstract ELECTROLESS NICKEL is a nickel coating deposited by chemical reduction of nickel ions. The most widely used reducing agent is sodium hypophosphite. The thickness of the deposited coating is uniform over all areas of the work-piece that are in continuous contact with fresh plating solution. The process is applicable to a wide variety of metal and nonmetal substrates. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as heat treating and joining. Filing Code: Ni-332. Producer or source: Occidental Chemical Corporation.

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Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2000p0355 ◽

2000 ◽

Author(s):

George M. Wenger ◽

Richard J. Coyle ◽

Patrick P. Solan ◽

John K. Dorey ◽

Courtney V. Dodd ◽

...

Keyword(s):

Failure Analysis ◽

Case Studies ◽

Failure Modes ◽

Electroless Nickel ◽

Electrical Performance ◽

Printed Wiring Board ◽

Solder Interconnects ◽

Area Array ◽

Surface Finishes ◽

Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

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Waste Reduction for Electroless Nickel Plating Solutions at U.S. Army Depots

10.21236/ada253404 ◽

1992 ◽

Cited By ~ 1

Author(s):

J. S. Davis

Keyword(s):

Electroless Nickel ◽

Waste Reduction ◽

Electroless Nickel Plating ◽

Nickel Plating

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Effect of copper incorporation on phase transformation behavior of electroless nickel–phosphorous coating and its effect on the tribological behavior

Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications ◽

10.1177/1464420720981602 ◽

2020 ◽

pp. 146442072098160

Author(s):

Abhijit Biswas ◽

Suman Kalyan Das ◽

Prasanta Sahoo

Keyword(s):

Heat Treatment ◽

Phase Transformation ◽

Tribological Behavior ◽

Electroless Nickel ◽

Two Phase ◽

Microstructural Changes ◽

Treatment Conditions ◽

Heat Treated ◽

Higher Temperature ◽

Effect Of Copper

The microstructural changes of electroless Ni–P–Cu coating at various heat-treatment conditions are investigated to understand its implications on the tribological behavior of the coating. Coatings are heat-treated at temperatures ranging between 200°C and 800 °C and for 1–4 h duration. Ni–P–Cu coatings exhibit two-phase transformations in the temperature range of 350–450 °C and the resulting microstructural changes are found to significantly affect their thermal stability and tribological attributes. Hardness of the coating doubles when heat-treated at 452 °C, due to the formation of harder Ni3P phase and crystalline NiCu. Better friction and wear performance are also noted upon heat treatment of the coating at the phase transformation regime, particularly at 400 °C. Wear mechanism is characterized by a mixed adhesive cum abrasive wear phenomena. Heat treatment at higher temperature (600 °C and above) and longer duration (4 h) results in grain coarsening phenomenon, which negatively influences the hardness and tribological characteristics of the coating. Besides, diffusion of iron from the ferrous substrate as well as greater oxide formation are noticed when the coating is heat-treated at higher temperatures and for longer durations (4 h).

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