Integrated Pump Assembly - An Active Cooling System for Mars Pathfinder Thermal Control

1996 ◽  
Author(s):  
Gajanana C. Birur ◽  
Pradeep Bhandari ◽  
Marshall B. Gram ◽  
John Durkee
Keyword(s):  
Cooling System ◽  
Thermal Control ◽  
Active Cooling ◽  
Mars Pathfinder ◽  
Pump Assembly

scholarly journals Active cooling photovoltaic with IoT facility

2021 ◽  
Vol 12 (3) ◽  
pp. 1494
Author(s):  
Muhammad Nizam Kamarudin ◽  
Sahazati Md. Rozali ◽  
Mohd Saifuzam Jamri
Keyword(s):  
Real Time ◽  
Cooling System ◽  
Solar Panel ◽  
State Of Charge ◽  
Photovoltaic System ◽  
Passive Cooling ◽  
Active Cooling ◽  
Passive Cooling System ◽  
Pv Power Generation ◽  
Sunlight Intensity

Harvesting energy from the sun makes the photovoltaic (PV) power generation a promising technology. To obtain a consistent state of charge (SOC), consistent energy must be harvested and efficiently directed to the battery. Overcharging or undercharging phenomena decreases the lifetime of the battery. Besides, the effect of irradiance toward solar in term of sunlight intensity effects the efficiency and hence, sluggish the SOC. The main problem of the solar panel revealed when the temperature has increased, the efficiency of solar panel will also be decreased. This manuscript reports the finding of developing an automatic active cooling system for a solar panel with a real time energy monitoring system with internet-of-things (IoT) facility. The IoT technology assists user to measure the efficiency of the solar panel and SOC of the battery in real time from any locations. The automatic active cooling system is designed to improve the efficiency of the solar panel. The effectiveness of the proposed system is proven via the analysis of the effect of active cooling toward efficiency and SOC of photovoltaic system. The results also tabulate the comparative studies of active-to-passive cooling system, as well as the effect of cooling towards SOC and efficiency of the solar panel.

A hollow microlattice based ultralight active thermal control device and its fabrication techniques and thermal performances

2021 ◽  
Author(s):  
Wenjun Xu ◽  
Longquan Liu ◽  
Junming Chen ◽  
Xinying Lv ◽  
Yongtao Yao
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Forced Convection ◽  
Liquid State ◽  
High Efficiency ◽  
Thermal Control ◽  
Test System ◽  
Control Device ◽  
Active Cooling ◽  
Change Material

Abstract This paper introduces a new thermal control device which has not only low weight and high efficiency but also passive and active cooling capabilities. The thermal control device mainly consists of hollow graphene-enhanced-metallic microlattice material, phase change material (PCM) and a peristatic pump. The PCM is inside the spatial-interconnected millimeter-scale diameter tubes, which are the basic constitution of the hollow microlattice material, in addition, the peristatic pump was connected with the tubes and used to force the liquid-state PCM to circulate inside the interconnected thin tubes. Thus, the proposed thermal control device takes combined advantages of the ultralight and high thermal transfer properties of the hollow graphene-enhanced-metallic microlattice materials, the thermal storage capability of the PCM and forced convection of the PCM driven by the peristatic pump as the PCM is in liquid state. The manufacturing process of the active thermal control device was also developed and proposed, which mainly includes additive manufacturing, composite electroless plating, polymer etching, liquid phase change material injecting and the peristatic pump connecting. In addition to that, a thermal test system was built and the effective thermal conductivities of the thermal control device in passive cooling and with active cooling modes were experimentally studied. The thermal control device can absorb heat and actively dissipate heat by means of forced convection. Consequently, the proposed active thermal control device can be used to guarantee the electronic components and spacecrafts operate in a specific temperature range.

Active cooling system for downhole electronics in high temperature environments

2021 ◽  
pp. 1-16
Author(s):  
Wei Minghui ◽  
Cai Wei ◽  
Xu Mingze ◽  
Deng Shuang
Keyword(s):  
High Temperature ◽  
Cooling System ◽  
Capillary Tube ◽  
Thermal Characteristics ◽  
Electric Circuit ◽  
Passive Cooling ◽  
Electronic Components ◽  
Active Cooling ◽  
Temperature Environment ◽  
High Temperature Environment

Abstract Downhole high temperature environment is an important factor affecting the performance of downhole instrument electronic system.At present, various active cooling technologies and passive cooling technologies have been proposed to reduce the temperature of downhole electric circuit system.However, passive cooling technologies can only provide limited cooling capacity for drilling tools under high temperature environment, and the duration of cooling is short, which can not meet the long-time drilling task.This paper presents an Active cooling system(ACS)for downhole electronics and the effects of different temperatures on the performance of electronic components are analyzed.The ACS mainly includes a micro supercharger, condenser tube, evaporation pipe, capillary tube and refrigerant.The theoretical analysis of heat transfer and refrigerant capacity in high temperature environment is carried out.The thermal characteristics of the ACS is evaluated experimentally.The results show that the temperature of electronic components can be reduced to below 163°C in the 200°C downhole environment and components.The geomagnetic field data measured by electronic components at room temperature, 200 °C and with ACS are compared.The results show that ACS can keep electronic components working normally.

scholarly journals Numerical Simulation of the Air Cooling System for Scientific Payload Rack on a Space Station

Energies ◽  
2020 ◽  
Vol 13 (22) ◽  
pp. 6145
Author(s):  
Yuan-Yuan Lou ◽  
Ben-Yuan Cai ◽  
Yun-Ze Li ◽  
Jia-Xin Li ◽  
En-Hui Li
Keyword(s):  
Numerical Simulation ◽  
Cooling System ◽  
Space Station ◽  
Thermal Control ◽  
Physical Models ◽  
Air Cooling ◽  
Ansys Fluent ◽  
System A ◽  
Air Cooling System ◽  
Scientific Payload

The space scientific payload rack is a multifunctional experimental platform, and the requirements of the environmental temperature index are different for diversified experimental modules inside. The air cooling system is an important part of the rack thermal control system. A new type of air cooling system with small size and flexible arrangement is proposed in this paper, that is, micro air ducts with pinhole-sized air vents. The rack physical models of new and traditional air cooling modes are established, respectively. The numerical simulation of the inner air flow is carried out by Ansys Fluent CFD software (Ansys Inc., Canonsburg, PA, USA), which verifies that compared with the traditional method, the temperature field and flow field of the new air cooling method are more uniform, and the heat sources located at the edge of the rack can also be cooled better.

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

1997 ◽  
Vol 119 (1) ◽  
pp. 40-50 ◽  
Author(s):  
D. Pal ◽  
Y. K. Joshi
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Cooling System ◽  
Computational Study ◽  
Power Level ◽  
Thermal Control ◽  
The Other ◽  
Three Dimensions ◽  
Temperature Isotherm ◽  
Laminate Thickness

A computational model is developed to predict the performance of phase change materials(PCMs) for passive thermal control of electronic modules during transient power variations or following an active cooling system failure. Two different ways of incorporating PCM in the module are considered. One is to place a laminate of PCM outside the multichip module, and the other is to place the PCM laminate between the substrate and the cold plate. Two different types of PCMs are considered. One is n-Eicosene, which is an organic paraffin, and the other one is a eutectic alloy of Bi/Pb/Sn/In. Computations are performed in three dimensions using a finite volume method. A single domain fixed grid enthalpy porosity method is used to model the effects of phase change. Effects of natural convection on the performance of PCM are also examined. Results are presented in the form of time-wise variations of maximum module temperature, isotherm contours, velocity vectors, and melt front locations. Effects of PCM laminate thickness and power levels are studied to assess the amount of PCM required for a particular power level. The results show that the PCMs are an effective option for passive cooling of high density electronic modules for transient periods.

scholarly journals Methodology of Supervision by Analysis of Thermal Flux for Thermal Conduction of a Batch Chemical Reactor Equipped with a Monofluid Heating/Cooling System

2012 ◽  
Vol 2012 ◽  
pp. 1-10
Author(s):  
Ghania Henini ◽  
Fatiha Souahi ◽  
Ykhlef Laidani
Keyword(s):  
Thermal Conduction ◽  
Cooling System ◽  
Batch Reactor ◽  
Thermal Flux ◽  
Exothermic Reaction ◽  
Chemical Reactor ◽  
Thermal Control ◽  
Ride Quality ◽  
Heating And Cooling

We present the thermal behavior of a batch reactor to jacket equipped with a monofluid heating/cooling system. Heating and cooling are provided respectively by an electrical resistance and two plate heat exchangers. The control of the temperature of the reaction is based on the supervision system. This strategy of management of the thermal devices is based on the usage of the thermal flux as manipulated variable. The modulation of the monofluid temperature by acting on the heating power or on the opening degrees of an air-to-open valve that delivers the monofluid to heat exchanger. The study shows that the application of this method for the conduct of the pilot reactor gives good results in simulation and that taking into account the dynamics of the various apparatuses greatly improves ride quality of conduct. In addition thermal control of an exothermic reaction (mononitration) shows that the consideration of heat generated in the model representation improve the results by elimination any overshooting of the set-point temperature.

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