Thermal Contact Resistance Measurement Between Alloy Coated Surfaces Versus Temperature and Pressure at the Interface

1995 ◽  
Author(s):  
F. Roberto Torrisi ◽  
Roberto Pagliuso
2015 ◽  
Vol 19 (4) ◽  
pp. 1369-1372 ◽  
Author(s):  
Zhe Zhao ◽  
Hai-Ming Huang ◽  
Qing Wang ◽  
Song Ji

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.


Proceedings ◽  
2019 ◽  
Vol 27 (1) ◽  
pp. 42 ◽  
Author(s):  
Ishizaki ◽  
Igami ◽  
Ueno ◽  
Nagano

This paper proposes a new thermal contact resistance measurement method using lock-in thermography. By the lock-in thermography with an infrared microscope, the dynamic temperature behavior across the contact interface was visualized in the sample side surface. Meanwhile, a new thermal contact resistance measurement principle was constructed by the superimposition of the temperature wave from virtual heat sources in consideration of the thermal contact resistance at the interface. Consequently, the thermal contact resistance was obtained as a fitting parameter by fitting the theoretical curve to the measured amplitude and phase lag. The validity of the principle was shown.


2021 ◽  
Vol 8 (1) ◽  
pp. 18
Author(s):  
Takuya Ishizaki ◽  
Ai Ueno ◽  
Hosei Nagano

This paper proposes a new thermal contact resistance measurement method using lock-in thermography. Using the lock-in thermography with an infrared microscope, the local temperature behavior in the frequency domain across the contact interface was visualized in microscale. Additionally, a new thermal contact resistance measurement principle was constructed considering the superimposition of the reflected and transmitted temperature wave at the boundary and taking into account the intensity distribution of the heating laser as the gaussian distribution, and the specific geometrical condition of the laminated plate sample. As a result of the experiments, the one-dimensional distribution of the thermal contact resistance was obtained along the contact interface from the analysis of the phase lag.


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