Thermal Response and Emission Breakthrough of Platinum Monolithic Catalytic Converters

1973 ◽  
Author(s):  
Charles R. Morgan ◽  
David W. Carlson ◽  
Sterling E. Voltz
Keyword(s):  
Thermal Response ◽  
Catalytic Converters

Microcalorimeters for X-Ray Spectroscopy

1988 ◽  
Vol 102 ◽  
pp. 41
Author(s):  
E. Silver ◽  
C. Hailey ◽  
S. Labov ◽  
N. Madden ◽  
D. Landis ◽  
...  
Keyword(s):  
High Resolution ◽  
High Efficiency ◽  
Thermal Response ◽  
Low Noise ◽  
High Resolution Spectroscopy ◽  
Superconducting Transition ◽  
Sapphire Substrates ◽  
Laboratory Plasmas ◽  
Adiabatic Demagnetization ◽  
Theoretical Predictions

The merits of microcalorimetry below 1°K for high resolution spectroscopy has become widely recognized on theoretical grounds. By combining the high efficiency, broadband spectral sensitivity of traditional photoelectric detectors with the high resolution capabilities characteristic of dispersive spectrometers, the microcalorimeter could potentially revolutionize spectroscopic measurements of astrophysical and laboratory plasmas. In actuality, however, the performance of prototype instruments has fallen short of theoretical predictions and practical detectors are still unavailable for use as laboratory and space-based instruments. These issues are currently being addressed by the new collaborative initiative between LLNL, LBL, U.C.I., U.C.B., and U.C.D.. Microcalorimeters of various types are being developed and tested at temperatures of 1.4, 0.3, and 0.1°K. These include monolithic devices made from NTD Germanium and composite configurations using sapphire substrates with temperature sensors fabricated from NTD Germanium, evaporative films of Germanium-Gold alloy, or material with superconducting transition edges. A new approache to low noise pulse counting electronics has been developed that allows the ultimate speed of the device to be determined solely by the detector thermal response and geometry. Our laboratory studies of the thermal and resistive properties of these and other candidate materials should enable us to characterize the pulse shape and subsequently predict the ultimate performance. We are building a compact adiabatic demagnetization refrigerator for conveniently reaching 0.1°K in the laboratory and for use in future satellite-borne missions. A description of this instrument together with results from our most recent experiments will be presented.

Numerical simulation of the tree higro-thermal response in forest fire environment

2020 ◽  
pp. 57-65
Author(s):  
Eusébio Conceiçã ◽  
João Gomes ◽  
Maria Manuela Lúcio ◽  
Jorge Raposo ◽  
Domingos Xavier Viegas ◽  
...  
Keyword(s):  
Forest Fire ◽  
Numerical Study ◽  
Thermal Response ◽  
View Factor ◽  
Tree Model ◽  
Pine Tree ◽  
Surface Temperatures ◽  
Fire Environment ◽  
Fire Front ◽  
Heat Exchanges

This paper refers to a numerical study of the hypo-thermal behaviour of a pine tree in a forest fire environment. The pine tree thermal response numerical model is based on energy balance integral equations for the tree elements and mass balance integral equation for the water in the tree. The simulation performed considers the heat conduction through the tree elements, heat exchanges by convection between the external tree surfaces and the environment, heat exchanges by radiation between the flame and the external tree surfaces and water heat loss by evaporation from the tree to the environment. The virtual three-dimensional tree model has a height of 7.5 m and is constituted by 8863 cylindrical elements representative of its trunks, branches and leaves. The fire front has 10 m long and a 2 m high. The study was conducted taking into account that the pine tree is located 5, 10 or 15 m from the fire front. For these three analyzed distances, the numerical results obtained regarding to the distribution of the view factors, mean radiant temperature and surface temperatures of the pine tree are presented. As main conclusion, it can be stated that the values of the view factor, MRT and surface temperatures of the pine tree decrease with increasing distance from the pine tree in front of fire.

A New Scanning Thermal Microprobe

1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Thermal Response ◽  
Temperature Sensing ◽  
Thermal Sensor ◽  
Atomic Force ◽  
Thin Film Thermocouple ◽  
Processing Steps ◽  
Thermocouple Junction

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.

Thermal Imaging Product Power-up: Metrology for Capturing Thermal Defects on Live Units Not Visible on Any Other Technique

2005 ◽  
Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta
Keyword(s):  
Thermal Imaging ◽  
Thermal Response ◽  
Recent Application ◽  
Ir Camera ◽  
Thermal Failure ◽  
Response Data ◽  
Startup Process ◽  
Customer Returns ◽  
Actual Computer ◽  
Detection Of Defects

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

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