Structural Quality Inspection Based on a RGB-D Sensor: Supporting Manual-to-Automated Assembly Operations

2015 ◽  
Vol 9 (1) ◽  
pp. 12-15 ◽  
Author(s):  
Perla Maiolino ◽  
Richard A. J. Woolley ◽  
Atanas Popov ◽  
Svetan Ratchev
Author(s):  
Ramaprasad E. Lakshminarayana ◽  
Shun Takai

Although numerous firms have been shifting toward automated assembly, most still rely on manual assembly when complex assembly operation is required for large-scaled systems. Furthermore, because firms design variants of a system to satisfy diverse customer needs, they may manufacture these system variants in the same assembly line. This type of operation, called mixed model assembly, may improve the utilization of existing manufacturing facilities; however, it may also increase assembly errors due to interchanging geometrically similar parts between system variants. Design for Assembly (DFA) is a design guideline that assists engineers in designing systems that are easier to assemble. However, because DFA guidelines group geometrically similar parts in the same part category, it may be impossible to distinguish geometrically similar but functionally different parts (modules) used in different systems. This paper proposes experimenting how cognitive effects of non-geometric part features influence the productivity and quality in mixed model assembly operations. Furthermore, because the productivity and quality of manual assembly may be influenced by the motivation of operators, this paper examines how productivity and quality may be influenced by different incentive schemes.


Author(s):  
Alberto Zorcolo ◽  
Gustavo Escobar-Palafox ◽  
Rosemary Gault ◽  
Robin Scott ◽  
Keith Ridgway

Author(s):  
Tao Peng ◽  
Arvind Balijepalli ◽  
Satyandra K. Gupta ◽  
Thomas W. LeBrun

Optical tweezers have emerged as a powerful tool for micro and nanomanipulation. Using optical tweezers to perform automated assembly requires on-line monitoring of components in the assembly workspace. This paper presents algorithms for estimating positions and orientations of microscale and nanoscale components in the 3-Dimensional assembly workspace. Algorithms presented in this paper use images obtained by optical section microscopy. The images are first segmented to locate areas of interest and then image gradient information from the areas of interest is used to generate probable locations and orientations of components in the XY-plane. Finally, signature curves are computed and utilized to obtain component locations and orientations in 3-D space. We have tested these algorithms with silica micro-spheres as well as metallic nanowires. We believe that the algorithms described in this paper will provide the foundation for realizing automated assembly operations in optical tweezers-based assembly cells.


Author(s):  
Anil Mital ◽  
Arunkumar Pennathur

Abstract Product assembly is a major consideration when designing products for manufacture as the method of assembly (manual, hybrid, or automated) often dictates, among other things the design of components, the assembly process and associated tooling. The choice of assembly method is, on the other hand, frequently dictated by technical and economic considerations. If the technical and economic considerations favor one method over the other, the decision-making is straight forward. However, when a product can be assembled either manually or with the assistance of automated equipment, the designer is confronted with the decision to choose between the two methods. This article provides a systematic procedure for choosing the assembly method in the event both manual and automated assembly methods are technically feasible.


Author(s):  
N. David Theodore ◽  
Mamoru Tomozane ◽  
Ming Liaw

There is extensive interest in SiGe for use in heterojunction bipolar transistors. SiGe/Si superlattices are also of interest because of their potential for use in infrared detectors and field-effect transistors. The processing required for these materials is quite compatible with existing silicon technology. However, before SiGe can be used extensively for devices, there is a need to understand and then control the origin and behavior of defects in the materials. The present study was aimed at investigating the structural quality of, and the behavior of defects in, graded SiGe layers grown by chemical vapor deposition (CVD).The structures investigated in this study consisted of Si1-xGex[x=0.16]/Si1-xGex[x= 0.14, 0.13, 0.12, 0.10, 0.09, 0.07, 0.05, 0.04, 0.005, 0]/epi-Si/substrate heterolayers grown by CVD. The Si1-xGex layers were isochronally grown [t = 0.4 minutes per layer], with gas-flow rates being adjusted to control composition. Cross-section TEM specimens were prepared in the 110 geometry. These were then analyzed using two-beam bright-field, dark-field and weak-beam images. A JEOL JEM 200CX transmission electron microscope was used, operating at 200 kV.


1980 ◽  
Vol 59 (6) ◽  
pp. 37
Author(s):  
Gunter Wittenberg

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