scholarly journals Corrosion Behaviors of Sputtered NiTiCu Shape Memory Films

2020 ◽  
Vol 08 (02) ◽  
pp. 7-15
Author(s):  
Nan Ye ◽  
Xueping Ren
2016 ◽  
Vol 25 (3) ◽  
pp. 035039 ◽  
Author(s):  
K Li ◽  
X Huang ◽  
Z S Zhao ◽  
Y Li ◽  
Y Q Fu

Author(s):  
MingJun Huang ◽  
Cheng Zhou ◽  
Yi Ling ◽  
GuoChen Zhao ◽  
LiangChang Dong ◽  
...  

Coatings ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 267 ◽  
Author(s):  
Algirdas Lazauskas ◽  
Viktoras Grigaliūnas ◽  
Dalius Jucius

In this work, surface microstructurization was coupled with shape-memory polymer to generate reversibly tunable surface properties. A photopolymerizable thiol-ene composition comprising a mixture of pentaerythritol tetrakis(3-mercaptopropionate) (PETMP), 1,3,5-triallyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (TTT) and 2,2-dimethoxy-2-phenylacetophenone (DMPA) was used to prepare microstructured thiol-ene shape-memory film via casting and UV polymerization on the electron beam lithography fabricated arrays of 1 µm and 2 µm square pits. The mechanical deformation via compression and recovery of the surface microstructure were investigated. Results show that, after heat treatment of the deformed thiol-ene film, the recovery yields for microstructures were not worse than 90% ± 2% and 93% ± 2% for structures imprinted with 1 µm and 2 µm square pit micro imprint stamps. Additionally, heat treatment of deformed thiol-ene film resulted in the recovery of intense diffraction colors and laser diffraction patterns. This study opens up an avenue of incorporating microstructured shape-memory films for new products, e.g., optical security devices, superhydrophobic coatings, medical diagnostics and biosensors.


2017 ◽  
Vol 132 ◽  
pp. 327-334 ◽  
Author(s):  
R. Niemann ◽  
A. Backen ◽  
S. Kauffmann-Weiss ◽  
C. Behler ◽  
U.K. Rößler ◽  
...  

2004 ◽  
Vol 54 (S4) ◽  
pp. 213-216
Author(s):  
J. Dubowik ◽  
I. Gościańska ◽  
Y. V. Kudryavtsev

2007 ◽  
Vol 310 (2) ◽  
pp. e996-e998 ◽  
Author(s):  
K. Koike ◽  
M. Ohtsuka ◽  
Y. Honda ◽  
H. Katsuyama ◽  
M. Matsumoto ◽  
...  

2002 ◽  
Vol 394-395 ◽  
pp. 439-442
Author(s):  
Hsiung Cheng Lin ◽  
K.M. Lin ◽  
C.S. Lin ◽  
F.H. Chen

2005 ◽  
Vol 20 (6) ◽  
pp. 1606-1612 ◽  
Author(s):  
D. Wan ◽  
K. Komvopoulos

The effect of the film thickness on the phase transformations encountered in sputtered titanium-nickel (TiNi) shape-memory films due to thermal cycling in the temperature range of −150 to 150 °C was examined in the context of electrical resistivity (ER) measurements. A hysteresis in the ER response was observed for film thickness greater than 300 nm. This phenomenon is characteristic of shape-memory materials and is attributed to the rhombohedral (R) phase produced during cooling from the high-temperature cubic austenite phase to the low-temperature monoclinic martensite phase. The decrease of the TiNi film thickness below 300 nm resulted in a smaller ER hysteresis, leading eventually to its disappearance for film thickness less than ∼50 nm. The results indicate that spatial constraints introduced by the film surface and film/substrate interface generate a resistance force, which prevents lattice distortion and twinning. The inhibition of these mechanisms, which control self-accommodation R-phase transformation, leads to the suppression and eventual disappearance of the shape memory effect for film thickness less than ∼100 nm.


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