scholarly journals Low-Loss Co<sub>2</sub>-Y Ferrites with Added CuO Sintered in Air for High Frequency Application

2014 ◽  
Vol 05 (13) ◽  
pp. 984-989
Author(s):  
Shigeo Fujii ◽  
Koji Wakamatsu ◽  
Hiroshi Satoh ◽  
Setsuo Yamamoto
2018 ◽  
Vol 934 ◽  
pp. 13-17
Author(s):  
N.A. Ngah ◽  
Amiza Rasmi ◽  
Azmi Ibrahim ◽  
Zulkifli Ambak ◽  
Mohd Zulfadli Mohamed Yusoff ◽  
...  

Multilayer low temperature co-fired ceramic (LTCC) is well known in usage as interconnect substrate, especially in high frequency application due to high electrical conductivity of the conductors and low loss of the LTCC dielectric. As substrate and packaging materials, there are many chips or devices placed on the multilayer LTCC board. In this paper, multilayer LTCC is implemented as the packaging at PIN photodiode (PD) module of the Radio over Fiber (RoF) system with the reason to increase thermal dissipation capacity of the PD module.


2004 ◽  
Vol 15 (1) ◽  
pp. 157-167 ◽  
Author(s):  
A Q Liu ◽  
M Tang ◽  
A Agarwal ◽  
A Alphones
Keyword(s):  

2008 ◽  
Vol 320 (20) ◽  
pp. e963-e966 ◽  
Author(s):  
Yong Zhou ◽  
Zhi-Min Zhou ◽  
Ying Cao ◽  
Xiao-Yu Gao ◽  
Wen Ding

2009 ◽  
Vol 23 (17) ◽  
pp. 3649-3654 ◽  
Author(s):  
MOHAN V. JACOB

The microwave properties of some of the low cost materials which can be used in high frequency applications with low transmission losses are investigated in this paper. One of the most accurate microwave characterization techniques, Split Post Dielectric Resonator technique (SPDR) is used for the experimental investigation. The dielectric constants of the 3 materials scrutinized at room temperature and at 10K are 3.65, 2.42, 3.61 and 3.58, 2.48, 3.59 respectively. The corresponding loss tangent values are 0.00370, 0.0015, 0.0042 and 0.0025, 0.0009, 0.0025. The high frequency transmission losses are comparable with many of the conventional materials used in low temperature electronics and hence these materials could be implemented in such applications.


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