scholarly journals Enhanced Thermal Conductivity of Carbon Nanotube Arrays by Carbonizing Impregnated Phenolic Resins

2013 ◽  
Vol 04 (08) ◽  
pp. 453-457 ◽  
Author(s):  
Dongmei Hu ◽  
Hongyuan Chen ◽  
Zhenzhong Yong ◽  
Minghai Chen ◽  
Xiaohua Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Phenolic Resins ◽  
Carbon Nanotube Arrays ◽  
Enhanced Thermal Conductivity

Thermal conductivity of vertically aligned carbon nanotube arrays: Growth conditions and tube inhomogeneity

2014 ◽  
Vol 105 (15) ◽  
pp. 151909 ◽  
Author(s):  
Matthew L. Bauer ◽  
Quang N. Pham ◽  
Christopher B. Saltonstall ◽  
Pamela M. Norris
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Growth Conditions ◽  
Nanotube Arrays ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

2019 ◽  
Vol 11 (1) ◽  
pp. 3-10 ◽  
Author(s):  
Guangjie Yuan ◽  
Haohao Li ◽  
Bo Shan ◽  
Johan Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Free Standing ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Potential Applications ◽  
Vertically Aligned ◽  
Interface Materials

As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.

scholarly journals Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network

2019 ◽  
Vol 6 (8) ◽  
pp. 085616 ◽  
Author(s):  
Majid Kabiri Samani ◽  
Congxiang Lu ◽  
Kong Qinyu ◽  
Narjes Khosravian ◽  
George Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Thermal Conductivity Enhancement ◽  
Nanotube Arrays ◽  
Conductivity Enhancement ◽  
Carbon Nanotube Arrays ◽  
Carbon Nanotube Network

Hierarchical Nano- and Micro-engineered Interlaminar Reinforcement of Advanced Aerospace Grade Composites with Carbon Nanotube Arrays

2021 ◽  
Author(s):  
Jeonyoon Lee ◽  
Luiz H. Acauan ◽  
Estelle Kalfon-Cohen ◽  
Seth S. Kessler ◽  
Brian L. Wardle
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Carbon Nanotube Arrays

scholarly journals Substrate adhesion evolves non-monotonically with processing time in millimeter-scale aligned carbon nanotube arrays

Nanoscale ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 261-271
Author(s):  
Ashley L. Kaiser ◽  
Dale L. Lidston ◽  
Sophie C. Peterson ◽  
Luiz H. Acauan ◽  
Stephen A. Steiner ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Adhesion Strength ◽  
Processing Time ◽  
Effective Modulus ◽  
Work Of Adhesion ◽  
Process Time ◽  
Nanotube Arrays ◽  
Substrate Adhesion ◽  
Carbon Nanotube Arrays

Aligned carbon nanotube (CNT) array adhesion strength evolves with CNT process time, decreasing and then increasing during growth and annealing, as captured by models relating CNT diameter, array effective modulus, and CNT–substrate work of adhesion.

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