scholarly journals STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

2013 ◽  
Vol 03 (04) ◽  
pp. 144-154 ◽  
Author(s):  
Kevin R. Anderson ◽  
Matthew Devost ◽  
Watit Pakdee ◽  
Niveditha Krishnamoorthy
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Power Density ◽  
High Power ◽  
Cold Plate ◽  
High Power Density ◽  
Enhanced Heat Transfer ◽  
Cfd Simulations ◽  
Forced Air

Transient Heat Transfer in Microscale Porous Materials Heated by Microsecond Laser Pulse of High Power Density

2002 ◽  
Author(s):  
Fangming Jiang ◽  
Dengying Liu ◽  
Jim S.-J. Chen ◽  
Richard S. Cohen
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Laser Pulse ◽  
Power Density ◽  
High Power ◽  
Hyperbolic Model ◽  
Transient Temperature ◽  
Hyperbolic Heat Conduction ◽  
High Power Density ◽  
High Heat Transfer

A novel experimental method was developed to measure the rapid transient temperature variations (heating rate > 107 K/s) of porous samples heated by high surface heat fluxes. With a thin film (0.1 μm thick) resistance thermometer of platinum as the temperature sensor and a super-high speed digital oscilloscope (up to 100 MHz) as the data recorder, rapid transient temperature variation in a porous material heated by a microsecond laser pulse of high power density is measured. Experimental results indicate that for high heat transfer cases (q′ > 109 W/m2) with short durations (5 – 20 μs) of heating, non-Fourier heat conduction behaviors appear. The non-Fourier hyperbolic heat conduction model and the traditional Fourier parabolic model are employed to simulate this thermal case respectively and the FDM is used to perform the numerical analysis. The hyperbolic model predicts thermal wave behavior in qualitative agreement with the experimental data.

Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics

2012 ◽  
Vol 4 (2) ◽  
Author(s):  
J. H. Choi ◽  
B. H. Sung ◽  
J. H. Yoo ◽  
C. J. Kim ◽  
D.-A. Borca-Tasciuc
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Power Density ◽  
Thermal Performance ◽  
High Power ◽  
Design Stage ◽  
Working Fluid ◽  
High Power Density ◽  
Graphic Processing Units ◽  
Maximum Heat

The implementation of high power density, multicore central and graphic processing units (CPUs and GPUs) coupled with higher clock rates of the high-end computing hardware requires enhanced cooling technologies able to attend high heat fluxes while meeting strict design constrains associated with system volume and weight. Miniature loop heat pipes (mLHP) emerge as one of the technologies best suited to meet all these demands. Nonetheless, operational problems, such as instable behavior during startup on evaporator side, have stunted the advent of commercialization. This paper investigates experimentally two types of mLHP systems designed for workstation CPUs employing disk shaped and rectangular evaporators, respectively. Since there is a strong demand for miniaturization in commercial applications, emphasis was also placed on physical size during the design stage of the new systems. One of the mLHP system investigated here is demonstrated to have an increased thermal performance at a reduced system weight. Specifically, it is shown that the system can reach a maximum heat transfer rate of 170 W with an overall thermal resistance of 0.12 K/W. The corresponding heat flux is 18.9 W/cm2, approximately 30% higher than that of larger size commercial systems. The studies carried out here also suggest that decreasing the thermal resistance between the heat source and the working fluid and maximizing the area for heat transfer are keys for obtaining an enhanced thermal performance.

Numerical Simulation of Heat Transfer and Fluid Flow of a Flat-Tube High Power Density Solid Oxide Fuel Cell

2004 ◽  
Vol 2 (1) ◽  
pp. 65-69 ◽  
Author(s):  
Yixin Lu ◽  
Laura Schaefer ◽  
Peiwen Li
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Fuel Cell ◽  
Solid Oxide Fuel Cell ◽  
Power Density ◽  
High Power ◽  
Solid Oxide ◽  
High Power Density ◽  
Oxide Fuel ◽  
Flat Tube

To both increase the power density of a tubular solid oxide fuel cell (SOFC) and maintain its beneficial feature of secure sealing, a flat-tube high power density (HPD) solid oxide fuel cell is under development by Siemens Westinghouse, based on their formerly developed tubular model. In this paper, a three dimensional numerical model to simulate the steady state heat transfer and fluid flow of a flat-tube HPD–SOFC is developed. A computer code is programmed using the FORTRAN language to solve the governing equations for continuity, momentum, and energy conservation. The highly coupled temperature and flow fields of the air stream and the fuel stream inside and outside a typical channel of a one-rib flat-tube HPD–SOFC are investigated. This heat transfer and fluid flow results will be used to simulate the overall performance of a flat-tube HPD–SOFC in the near future, and to help optimize the design and operation of a SOFC stack in practical applications.

scholarly journals Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling Application

2021 ◽  
Author(s):  
Naga Ramesh Korasikha ◽  
Thopudurthi Karthikeya Sharma ◽  
Gadale Amba Prasad Rao ◽  
Kotha Madhu Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Power Density ◽  
High Power ◽  
Performance Enhancement ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
High Power Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capacity. Microchannel heat sinks (MCHS) are the most suitable heat exchanging devices for electronic cooling applications with high compactness. The heat transfer enhancement of the microchannel heat sinks (MCHS) is the most focused research area. Huge research has been done on the thermal and hydraulic performance enhancement of the microchannel heat sinks. This chapter’s focus is on advanced heat transfer enhancement methods used in the recent studies for the MCHS. The present chapter gives information about the performance enhancement MCHS with geometry modifications, Jet impingement, Phase changing materials (PCM), Nanofluids as a working fluid, Flow boiling, slug flow, and magneto-hydrodynamics (MHD).

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

2015 ◽  
Author(s):  
Tanya Liu ◽  
Farzad Houshmand ◽  
Catherine Gorle ◽  
Sebastian Scholl ◽  
Hyoungsoon Lee ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Power Density ◽  
Mass Flow ◽  
High Power ◽  
Heat Sink ◽  
High Power Density ◽  
Flow Rates ◽  
Mass Flow Rates ◽  
Insight Into

Advances in manufacturing techniques are inspiring the design of novel integrated microscale thermal cooling devices seeking to push the limits of current thermal management solutions in high heat flux applications. These advanced cooling technologies can be used to improve the performance of high power density electronics such as GaN-based RF power amplifiers. However, their optimal design requires careful analysis of the combined effects of conduction and convection. Many numerical simulations and optimization studies have been performed for single cell models of microchannel heat sinks, but these simulations do not provide insight into the flow and heat transfer through the entire device. This study therefore presents the results of conjugate heat transfer CFD simulations for a complex copper monolithic heat sink integrated with a 100 micron thick, 5 mm by 1 mm high power density GaN-SiC chip. The computational model (13 million cells) represents both the chip and the heat sink, which consists of multiple inlets and outlets for fluid entry and exit, delivery and collection manifold systems, and an array of fins that form rectangular microchannels. Total chip powers of up to 150 W at the GaN gates were considered, and a quarter of the device was modeled for total inlet mass flow rates of 1.44 g/s and 1.8 g/s (0.36 g/s and 0.45 g/s for the quarter device), corresponding to laminar flow at Reynolds numbers between 19.5 and 119.3. It was observed that the mass flow rates through individual microchannels in the device vary by up to 45%, depending on the inlet/outlet locations and pressure drop in the manifolds. The results demonstrate that full device simulations provide valuable insight into the multiple parameters that affect cooling performance.

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