Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions
2013 ◽
Vol 03
(04)
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pp. 136-143
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2019 ◽
Vol 192
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pp. 45-56
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2011 ◽
Vol 43
(3)
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pp. 1070-1078
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