SiAlON Bulk Glasses and Their Role in Silicon Nitride Grain Boundaries: Composition-Structure-Property Relationships

2012 ◽  
Vol 49 (4) ◽  
pp. 301-307 ◽  
Author(s):  
Stuart Hampshire ◽  
Michael J. Pomeroy
2021 ◽  
Vol 33 (4) ◽  
pp. 1213-1217 ◽  
Author(s):  
Ekaterina I. Marchenko ◽  
Vadim V. Korolev ◽  
Artem Mitrofanov ◽  
Sergey A. Fateev ◽  
Eugene A. Goodilin ◽  
...  

2001 ◽  
Vol 7 (S2) ◽  
pp. 400-401
Author(s):  
Y. Lei ◽  
Y. Ito ◽  
N. D. Browning

Yttria-stabilized zirconia (YSZ) has been the subject of many experimental and theoretical studies, due to the commercial applications of zirconia-based ceramics in solid state oxide fuel cells. Since the grain boundaries usually dominate the overall macroscopic performance of the bulk material, it is essential to develop a fundamental understanding of their structure-property relationships. Previous research has been performed on the atomic structure of grain boundaries in YSZ, but no precise atomic scale compositional and chemistry characterization has been carried out. Here we report a detailed analytical study of an [001] symmetric 24° bicrystal tilt grain boundary in YSZ prepared with ∼10 mol % Y2O3 by Shinkosha Co., Ltd by the combination of Z-contrast imaging and electron energy loss spectroscopy (EELS).The experimental analysis of the YSZ sample was carried out on a 200kV Schottky field emission JEOL 201 OF STEM/TEM4.


2012 ◽  
Vol 18 (S2) ◽  
pp. 1512-1513
Author(s):  
D.A. Muller ◽  
P.Y. Huang ◽  
A.W. Tsen ◽  
R. Hovden ◽  
L. Brown ◽  
...  

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.


1995 ◽  
Vol 6 (1-4) ◽  
pp. 173-187 ◽  
Author(s):  
Orlando Auciello ◽  
Kenneth D. Gifford ◽  
Daniel J. Lichtenwalner ◽  
Rovindra Dat ◽  
Husam N. Al-Shareef ◽  
...  

2004 ◽  
Vol 821 ◽  
Author(s):  
C. San Marchi ◽  
N.R. Moody ◽  
M.J. Cordill ◽  
G. Lucadamo ◽  
J.J. Kelly ◽  
...  

Thin gold films and coatings on metal have long constituted an important technology for the microelectronics industry and will continue to be important for microdevices such as contact springs. The properties of these materials may be highly processing dependent, particularly when the gold is deposited by electrochemical means. In this study, we characterize gold electrodeposited on Ni substrates from two bath chemistries: hard Au sulfite with proprietary hardening additive and soft Au cyanide. TEM and SEM show that the bath chemistry alters the microstructure and the resulting surface of the electrodeposits. Nanoindentation techniques were used to determine the elastic and plastic properties of the Au electrodeposits as a function of the specifics of processing. Soft Au electrodeposits have a grain size of on the order of 300 nm and a hardness of about 1 GPa. Hard Au electrodeposits produced from the sulfite bath feature grain sizes as small as 30 nm, some twinning, and fine porosity uniformly distributed both within the grains and at grain boundaries. The hardness is about 2 GPa, approaching the hardest values reported for sputtered gold films. The effect of the hardening agent on the microstructure of electrodeposits from the Au sulfite bath was also investigated and found to significantly refine the grain size at concentrations of at least 4 mL/L, although little additional refinement was found at higher concentrations.


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