scholarly journals Low CTE (Coefficient of Thermal Expansion) Resin System for Chip Carrier Substrate

2016 ◽  
Vol 67 (3) ◽  
pp. 128-131
Author(s):  
Shin TAKANEZAWA
Keyword(s):  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Resin System ◽  
Chip Carrier

Mounting Leadless Chip Carriers onto Printed Circuit Boards

1982 ◽  
Vol 1 (1) ◽  
pp. 38-43 ◽  
Author(s):  
D. Fishman ◽  
N. Cooper
Keyword(s):  
Thermal Expansion ◽  
Thermal Cycling ◽  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
Cycling Performance ◽  
Circuit Board ◽  
Circuit Boards ◽  
Acceptable Solution ◽  
Printed Circuit ◽  
Chip Carrier

It is reasoned that wide penetration of chip carriers into equipment for professional and commercial applications depends on developing methods for mounting the leadless types directly on to conventional polymer type printed circuit boards. The main problem to be overcome is fatigue failure of the solder joints due to the mismatch in thermal expansion, evidenced by poor thermal cycling performance. In this paper the thermal cycling performance is compared when four sizes of ceramic leadless chip carrier are mounted on a selection of printed circuit board materials ranging from the conventional to those specially formulated, either on the basis of matching the coefficient of thermal expansion of the chip carrier material, or to provide a layer of compliant elastomer material underneath the layer bearing the copper contact layer, so that strain due to thermal expansion mismatch is not transmitted to the solder layer. Over 400 thermal cycles (−55 to + 125°C) were recorded using proprietary versions of elastomer coated substrates. For appropriate applications the basis is thus laid for an economic and technically acceptable solution. The practical implications of two methods of soldering—wave (jet) and vapour phase—are also discussed.

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

2015 ◽  
Author(s):  
Yukio Nakamura ◽  
Kenichi Oohashi ◽  
Koji Morita ◽  
Shuji Nomoto ◽  
Takayuki Suzuki ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Mobile Devices ◽  
Coefficient Of Thermal Expansion ◽  
Core Material ◽  
Resin System ◽  
High Modulus ◽  
Next Generation ◽  
Treatment Technology ◽  
Main Factor ◽  
Core Materials

The thinner and higher density PKG (package) is being required strongly for the growth of smaller mobile devices. Especially, package on package technology (PoP) has become a mainstream for application processors which are installed in smartphones and tablets. However, the warpage of thinner PKG often causes a problem at the chip mounting process. The main factor of warpage is the mismatch of CTE (coefficient of thermal expansion) between substrate and chip. Therefore, the lower CTE core materials are needed for the thinner PKG. Recently, Hitachi Chemical has developed the super-low CTE material, core and prepreg, applying our new resin system and filler treatment technology, and placed it on the market. Furthermore, a super-low CTE material of 0.7 ppm/K is currently under development. The super-low CTE material shows the best warpage performance in our low CTE core material lineups, maintaining its higher Tg, high modulus and low Dk/Df values.

NILO ALLOY 36

Alloy Digest ◽  
1987 ◽  
Vol 36 (8) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Constant Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Iron Nickel

Abstract NILO alloy 36 is a binary iron-nickel alloy having a very low and essentially constant coefficient of thermal expansion at atmospheric temperatures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-79. Producer or source: Inco Alloys International Inc..

UNISPAN LR35

Alloy Digest ◽  
1971 ◽  
Vol 20 (1) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Operational Level

Abstract UNISPAN LR35 offers the lowest coefficient of thermal expansion of any alloy now available. It is a low residual modification of UNISPAN 36 for fully achieving the demanding operational level of precision equipment. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and surface treatment. Filing Code: Fe-46. Producer or source: Cyclops Corporation.

DELTALLOY 4032

Alloy Digest ◽  
1998 ◽  
Vol 47 (4) ◽  
Keyword(s):  
Wear Resistance ◽  
Thermal Expansion ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Surface Finish ◽  
Coefficient Of Thermal Expansion ◽  
Single Point ◽  
High Strength ◽  
Corrosion And Wear

Abstract Deltalloy 4032 has good machinability and drilling characteristics when using single-point or multispindle screw machines and an excellent surface finish using polycrystalline or carbide tooling. The alloy demonstrates superior wear resistance and may eliminate the need for hard coat anodizing. Deltalloy 4032 is characterized by high strength and a low coefficient of thermal expansion. This datasheet provides information on composition, physical properties, and tensile properties. It also includes information on corrosion and wear resistance as well as machining and surface treatment. Filing Code: AL-347. Producer or source: ALCOA Wire, Rod & Bar Division.

RED X-20

Alloy Digest ◽  
1960 ◽  
Vol 9 (2) ◽  
Keyword(s):  
Wear Resistance ◽  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Aluminum Silicon Alloy ◽  
Temperature Performance

Abstract RED X-20 is a heat treatable hypereutectic aluminum-silicon alloy with excellent wear resistance and a very low coefficient of thermal expansion. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: Al-89. Producer or source: Apex Smelting Company.

AA 4032

Alloy Digest ◽  
1990 ◽  
Vol 39 (7) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance

Abstract AA 4032 has a comparatively low coefficient of thermal expansion and good forgeability. The alloy takes on an attractive dark gray appearance when anodized which may be desirable in architectural applications. This datasheet provides information on composition, physical properties, hardness, tensile properties, and shear strength as well as fatigue. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Al-305. Producer or source: Various aluminum companies.

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