scholarly journals Solder Ball Test Method

2012 ◽  
Vol 63 (11) ◽  
pp. 666-669
Author(s):  
Tadashi TORIMITSU
Keyword(s):  
Solder Ball ◽  
Test Method ◽  
Ball Test

scholarly journals Comparative experimental research on falling ball test method and K30 plate load method on foundation of different structures

2021 ◽  
Vol 276 ◽  
pp. 02025
Author(s):  
Yingqi Xue ◽  
Xiaokun Han ◽  
Luwan Wang ◽  
Mengjie Wang
Keyword(s):  
Engineering Application ◽  
Layered Materials ◽  
Comparative Test ◽  
Test Method ◽  
Construction Process ◽  
Fine Grained ◽  
Surface Deflection ◽  
Fine Grained Material ◽  
The Relationship ◽  
Ball Test

In highway and railway foundation projects, the mechanical properties of foundation materials are one of the main indicators of construction process control. The elastic modulus of foundation directly affects road surface deflection and must be tested. The falling ball test method and the K30 plate load method are widely used in engineering, In order to explore the relationship between the two methods and guide the engineering application, the falling ball test method and the K30 plate load method are applied to homogeneous materials (homogeneous fine-grained material layers) and layered materials(Old foundation).Through comparative test, we found that there is a strong correlation between the falling ball test method the K30 plate load method in some scenarios,which can be used for mutual reference in engineering experiments.

scholarly journals Deflection detection of the cement stabilizing layer based on the falling ball test method

2020 ◽  
Vol 580 ◽  
pp. 012088
Author(s):  
Xiaokun Han ◽  
Zhu Luo ◽  
Mengjie Wang ◽  
Yingqi Xue
Keyword(s):  
Test Method ◽  
Ball Test

Electromigration of multi-solder ball test structures

2018 ◽  
Author(s):  
C. Hau-Riege ◽  
H. Xu ◽  
Y.-W. Yau ◽  
M. Kakade ◽  
J. Li ◽  
...  
Keyword(s):  
Solder Ball ◽  
Ball Test

Mechanical strength test method for solder ball joint in BGA package

2005 ◽  
Vol 11 (2) ◽  
pp. 121-129 ◽  
Author(s):  
Jong-Woong Kim ◽  
Dae-Gon Kim ◽  
Seung-Boo Jung
Keyword(s):  
Mechanical Strength ◽  
Solder Ball ◽  
Strength Test ◽  
Test Method ◽  
Ball Joint ◽  
Bga Package

The Scuffing Resistance of the Coated Tribosystems Lubricated With Ecological Oils

2005 ◽  
Author(s):  
Remigiusz Michalczewski ◽  
Marian Szczerek ◽  
Waldemar Tuszynski ◽  
Jan Wulczynski
Keyword(s):  
High Resolution ◽  
Service Life ◽  
Renewable Resources ◽  
Hard Coatings ◽  
Test Method ◽  
Test Rig ◽  
Thin Coatings ◽  
Ball Test ◽  
Conformal Contact ◽  
Increasing Load

The objective of the paper is to show that thin, hard coatings deposited on heavy-loaded machine components working in a non-conformal contact (e.g. gears) and lubricated with ecological oils, make it possible to increase the service-life of these components. The scuffing resistance was assessed by employing a high-resolution four-ball test method realized in a tester with continuously increasing load. Also another test method — FZG scuffing test — was realized using a back-to-back gear test rig. The test balls and gears were coated with thin, hard TiN and WC/C coatings deposited using arc-vacuum and reactive sputtering techniques respectively. The performed tests indicate that the presence of thin coatings on machine components gives a possibility of eliminating or reducing the content of toxic AW/EP additives in lubricating oils, as well as using ecological oils made of renewable resources, without any risk of a scuffing failure.

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C

2005 ◽  
Vol 127 (4) ◽  
pp. 483-495 ◽  
Author(s):  
Ahmad Abu Obaid ◽  
Jay G. Sloan ◽  
Mark A. Lamontia ◽  
Antonio Paesano ◽  
Subhotosh Khan ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Solder Ball ◽  
Method Development ◽  
Failure Modes ◽  
Test Methods ◽  
Shear Loading ◽  
Test Method ◽  
Plastic Behavior ◽  
Area Array

The objective of this study is to describe and evaluate test methods developed to experimentally characterize the in situ mechanical behavior of solder ball arrays connecting printed wiring boards to area array packages under tensile, compressive, and shear loading at −40, 23, and 125 °C. The solder ball arrays tested were composed of 62%Sn–36%Pb–2%Ag solder alloy. Finite element modeling was performed. The results indicated that the test fixture should be geometrically equivalent to the projected shape of the ball grid array to achieve uniform loading. Tension, compression, and shear tests were conducted. For tensile loading the interfaces and the solder balls are loaded in series resulting in a large apparent strain (13%). Various interfacial failure modes are observed. Under compression and shear loading the effect of the interfaces are negligible and therefore a significant deformation and a remarkable yielding behavior of solder ball arrays can be observed. Furthermore, the specimens tested under shear loading showed different failure modes such as cohesive or adhesive failure modes depending on the test temperature. From the overall results, it has been determined that shear loading is the most representative test to measure the actual mechanical behavior of solder in ball grid arrays.

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