scholarly journals Analysis of Partial Reactions in Electroless Copper Deposition by Quartz Crystal Microbalance Technique.

1992 ◽  
Vol 43 (5) ◽  
pp. 481-482 ◽  
Author(s):  
Masao MATSUOKA ◽  
Junichi MURAI ◽  
Chiaki IWAKURA
2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.


2019 ◽  
Vol 25 (6) ◽  
pp. 879-884
Author(s):  
Takahiro Sakai ◽  
Hayato Seki ◽  
Shogo Yoshida ◽  
Hayato Hori ◽  
Hisashi Suzuki ◽  
...  

1998 ◽  
Vol 145 (2) ◽  
pp. 492-497 ◽  
Author(s):  
James J. Kelly ◽  
K. M. Anisur Rahman ◽  
Christopher J. Durning ◽  
Alan C. West

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