Special issue/EMI shielding EMI shielding by means of single-sided electroless plating.

Makoto SAITO

doi:10.4139/sfj.42.39

Special issue/EMI shielding EMI shielding by means of single-sided electroless plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.39 ◽

1991 ◽

Vol 42 (1) ◽

pp. 39-43 ◽

Cited By ~ 1

Author(s):

Makoto SAITO

Keyword(s):

Electroless Plating ◽

Emi Shielding ◽

Special Issue

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Special issue/EMI shielding EMI shielding by electroless plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.33 ◽

1991 ◽

Vol 42 (1) ◽

pp. 33-38

Author(s):

Kenji NAKAMURA

Keyword(s):

Electroless Plating ◽

Emi Shielding ◽

Special Issue

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Special issue/EMI shielding Electro-magnetic shielding for buildings.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.13 ◽

1991 ◽

Vol 42 (1) ◽

pp. 13-21

Author(s):

Yoshihiro IWAI

Keyword(s):

Magnetic Shielding ◽

Emi Shielding ◽

Special Issue ◽

Electro Magnetic

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Special issue/EMI shielding EMI shielding by Al-Vacuum deposition.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.29 ◽

1991 ◽

Vol 42 (1) ◽

pp. 29-32

Author(s):

Akira MOTOKI

Keyword(s):

Vacuum Deposition ◽

Emi Shielding ◽

Special Issue

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Supreme EMI Shielding Using Electroless Plating of Metallic Nanoparticle on Cotton Fabric

Research Progress in Nano and Intelligent Materials ◽

10.1201/b12228-4 ◽

2011 ◽

pp. 25-32

Author(s):

A Afzali ◽

V Mottaghitalab ◽

M Saberi

Keyword(s):

Cotton Fabric ◽

Electroless Plating ◽

Emi Shielding ◽

Metallic Nanoparticle

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Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance

2014 IEEE International Conference on Semiconductor Electronics (ICSE2014) ◽

10.1109/smelec.2014.6920860 ◽

2014 ◽

Author(s):

Tai Min Fee ◽

Lee Swee Kah ◽

Goh Soon Lock ◽

Kok Swee Leong ◽

Kenichiroh Mukai ◽

...

Keyword(s):

Electroless Plating ◽

Industrial Test ◽

Emi Shielding

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Special Issue/The Present and Future Trends in the Electroless Plating. Electroless Gold Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.1077 ◽

1991 ◽

Vol 42 (11) ◽

pp. 1077-1086

Author(s):

Yutaka OKINAKA

Keyword(s):

Electroless Plating ◽

Future Trends ◽

Special Issue ◽

Gold Plating ◽

Electroless Gold

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Special Issue/The Present and Future Trends in the Electroless Plating. The Principle of Electroless Plating. Mainly on Reaction Mechanism.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.1058 ◽

1991 ◽

Vol 42 (11) ◽

pp. 1058-1067 ◽

Cited By ~ 3

Author(s):

Masao MATSUOKA

Keyword(s):

Reaction Mechanism ◽

Electroless Plating ◽

Future Trends ◽

Special Issue

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Special issue/EMI shielding Magnetic shielding by composite magnetic materials.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.42.44 ◽

1991 ◽

Vol 42 (1) ◽

pp. 44-49

Author(s):

Masafumi OKAMOTO

Keyword(s):

Magnetic Materials ◽

Magnetic Shielding ◽

Emi Shielding ◽

Special Issue

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boads Reviews. Through-hole Plating Eliminates Electroless Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.599 ◽

1993 ◽

Vol 44 (7) ◽

pp. 599-604 ◽

Cited By ~ 1

Author(s):

Minoru TOYONAGA

Keyword(s):

Electroless Plating ◽

Recent Trend ◽

Surface Finishing ◽

Special Issue ◽

Through Hole

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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Surface Finishing of Printed Wiring Boards. Mainly on Electroless Plating.

Journal of The Surface Finishing Society of Japan ◽

10.4139/sfj.44.578 ◽

1993 ◽

Vol 44 (7) ◽

pp. 578-582 ◽

Cited By ~ 1

Author(s):

Kazuyoshi OKUNO

Keyword(s):

Electroless Plating ◽

Recent Trend ◽

Surface Finishing ◽

Printed Wiring Boards ◽

Special Issue

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