scholarly journals Initial deposition process of electroless nickel plating.

1990 ◽  
Vol 41 (2) ◽  
pp. 164-168 ◽  
Author(s):  
Hideo HONMA ◽  
Masashi NOGUCHI
Keyword(s):  
Electroless Nickel ◽  
Deposition Process ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Initial Deposition

Observation of initial deposition process of electroless nickel plating by quartz crystal microbalance method and microscopy

2002 ◽  
Vol 47 (25) ◽  
pp. 4011-4018 ◽  
Author(s):  
Hiroshi Matsubara ◽  
Takehide Yonekawa ◽  
Yoshihiro Ishino ◽  
Hiroshi Nishiyama ◽  
Nobuo Saito ◽  
...  
Keyword(s):  
Quartz Crystal Microbalance ◽  
Quartz Crystal ◽  
Electroless Nickel ◽  
Deposition Process ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Initial Deposition

Deposition Mechanism Study of a Novel Electroless Nickel Plating Technique on AZ91D Magnesium Alloy

2011 ◽  
Vol 393-395 ◽  
pp. 40-43
Author(s):  
Jian Gang Qian ◽  
Tian Zhao
Keyword(s):  
Magnesium Alloy ◽  
Electroless Nickel ◽  
Nickel Layer ◽  
High Catalytic Activity ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Mechanism Study ◽  
Deposition Mechanism ◽  
Az91d Magnesium Alloy ◽  
Initial Deposition

A novel direct electroless nickel plating method was developed for the AZ91D magnesium alloy. The electroless nickel initial deposition morphology was analyzed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The initial deposition characteristics of the coating and the deposition mechanism of the nickel layer are discussed. The results show that after activation, an uneven scaly-activated membrane was formed on the AZ91D magnesium alloy surface. The weakest part of the activated membrane dissolved first, where small Ni particles deposited initially. These deposited Ni particles had high catalytic activity and they were involved in the catalytic reduction reaction of hypophosphite, from which P was precipitated. As the plating proceeded, the number of the deposited Ni particles gradually increased in a three-dimensional manner and the surface was gradually covered by the growing cellular particles. A compact pore-free nickel-plated film was finally formed.

scholarly journals Relationship between Pretreatment and Initial Deposition in Electroless Nickel Plating on Aluminum Substrate.

1994 ◽  
Vol 45 (7) ◽  
pp. 720-725 ◽  
Author(s):  
Katsuhiko TASHIRO ◽  
Kunio CHIBA ◽  
Yutaka FUKUDA ◽  
Hidehiro NAKAO ◽  
Hideo HONMA
Keyword(s):  
Electroless Nickel ◽  
Aluminum Substrate ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Initial Deposition

Wear and Tribotermal Effects of Nanostructured Nickel Chemical Coatings

2012 ◽  
Vol 157-158 ◽  
pp. 960-963
Author(s):  
Mara Kandeva ◽  
Dimitar Karastoyanov ◽  
Anna Andonova
Keyword(s):  
Wear Resistance ◽  
Abrasive Wear ◽  
Contact Interaction ◽  
Electroless Nickel ◽  
Deposition Process ◽  
Resistance Testing ◽  
Nanosized Particles ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Sic Coatings

The abrasive wear and the wear resistance of composite nickel + SiC coatings are investigated. The coatings are deposited by the method for electroless nickel plating EFTTOM-NICKEL developed in TU-Sofia. Nanosized particles of SiC are used as a strengthened material. The size of the particles is 35-40 [nm]. The thickness of the coatings is 50 [µm]. The investigation of the coatings deposited on the different roughness surfaces is performed. Some of the samples are thermal processed at 300°C, 6 hours after deposition process. The methods for wear resistance testing is developed and the experimental results for the dependence of the massive wear, wear speed, intensity of wear and wear resistance on the friction road and the time of a contact interaction are obtained.

Initial Deposition Mechanism of Electroless Nickel Plating on Magnesium Alloys

2001 ◽  
Vol 79 (1) ◽  
pp. 30-32 ◽  
Author(s):  
Yanghui Xiang ◽  
Wenbin Hu ◽  
Xinkuan Liu ◽  
Changzheng Zhao ◽  
Wenjiang Ding
Keyword(s):  
Magnesium Alloys ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Deposition Mechanism ◽  
Initial Deposition

Preliminary Step in Formulating the Optimum Electroless Nickel Bath Using Taguchi Method

2012 ◽  
Author(s):  
M.N. Mohamad Ibrahim ◽  
C. W. Sia ◽  
Z. A. Ahmad
Keyword(s):  
Deposition Rate ◽  
Orthogonal Array ◽  
Electroless Nickel ◽  
Deposition Process ◽  
Reducing Agent ◽  
Complexing Agent ◽  
Nickel Salt ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Taguchi Orthogonal Array

Teknologi penyaduran nikel secara tanpa elektrik telah berkembang pesat dan diaplikasikan secara meluas dalam banyak bidang industri disebabkan ciri sadurannya yang unggul. Penyaduran tanpa elektrik ialah suatu proses pengautomangkinan iaitu saduran nikel berlaku daripada penurunan garamnya oleh agen penurunan yang hadir dalam larutan elektrik. Komposisi asas larutan tanpa elektrik di dalam kajian ialah NiSO4.6H2O, NaH2PO2.H2O, (NH4)3C6H5O7, agen pembasah dan suhu operasinya ialah 50°C. Dalam kajian awal ini, teknik Taguchi telah digunakan untuk menyelidik beberapa faktor yang dapat mempengaruhi kadar saduran supaya larutan elektrolit nikel yang optimum dapat diformulasikan. Faktor-faktor ini ialah kepekatan garam nikel, agen penurunan, agen pengkompleks dan pH larutan. Susunatur ortogonal Taguchi L9 telah digunakan untuk merancang eksperimen dengan tiga paras bagi setiap faktor. Kepingan keluli lembut digunakan sebagai substrat. Proses penyaduran dijalankan selama setengah jam dan kadar saduran didapati dengan menimbang sampel sebelum dan selepas saduran. Data-data yang diperolehi telah dianalisis berdasarkan nisbah isyarat kepada bisingan Taguchi dan analisis varians. Keputusan menunjukkan bahawa faktor pH paling mempengaruhi kadar saduran diikuti dengan faktor kepekatan garam nikel, agen penurunan dan agen pengkompleks. Formulasi larutan elektrolis yang optimum seterusnya dapat diramalkan berdasarkan keputusan ini. Kata kunci: Penyaduran nikel secara tanpa elektrik; kaedah Taguchi; susun atur ortogonal Taguchi; kadar saduran; larutan tanpa elektrik yang optimum Electroless nickel plating has been rapidly developed and widely used in many fields due to its superior properties of coating. It is an autocatalytic process in which the deposited nickel is reduced from its ionic state by chemical reducing agent in bath. The basic compositions of the bath and operating condition are NiSo4.6H2O, NaH2PO2.H2O,(NH4)3C6H5O7, wetting agent and at 50°C. In this preliminary study, Taguchi Robust Design Technique was used to rank several factors that may affect the deposition rate in order to formulate the optimum electroless nickel bath. They were concentration of nickel salt, reducing agent, complexing agent and pH of the bath. The Taguchi orthogonal array L9 was used for the experimental design with three levels of consideration for each factor. Mild steel plated were used as substrates. The deposition process was carried out for half an hour and the rates were obtained by weighing the samples before and after plating. The response (deposition rate) was analysed based on the Taguchis signal-to-noise ratio (S/N) and analysis of variance (ANOVA). The results showed that the most notable factor influencing the deposition rate was the pH, followed by the concentration of nickel salt, reducing agent and complexing agent. The optimum bath formulation was then predicted based on these results. Key words: Electroless nickel plating; Taguchi's method; Taguchi orthogonal array; deposition rate; optimum bath formulation

Selective Electroless Nickel Plating on Polyelectrolyte Multilayer Platforms

Langmuir ◽  
2001 ◽  
Vol 17 (21) ◽  
pp. 6610-6615 ◽  
Author(s):  
T. C. Wang ◽  
B. Chen ◽  
M. F. Rubner ◽  
R. E. Cohen
Keyword(s):  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Polyelectrolyte Multilayer
Sign in / Sign up

Export Citation Format

Share Document