scholarly journals Development of thermal stability measurement of electroless Ni-P alloy films by pulse heating.

1989 ◽  
Vol 40 (1) ◽  
pp. 142-143
Author(s):  
Jun KAWAGUCHI ◽  
Hideo YAMAZAKI ◽  
Tetsuya OSAKA
Keyword(s):  
Thermal Stability ◽  
Pulse Heating ◽  
Alloy Films ◽  
Stability Measurement ◽  
Electroless Ni

Change of Electroless Ni‐Mo‐P Alloy Films by Transient Pulse Heating

1989 ◽  
Vol 136 (11) ◽  
pp. 3418-3422 ◽  
Author(s):  
Tetsuya Osaka ◽  
Hideo Yamazaki ◽  
Iku Saito ◽  
Jun Kawaguchi
Keyword(s):  
Pulse Heating ◽  
Alloy Films ◽  
Electroless Ni

Increased Thermal Stability of Co-silicide Using Co-Ta Alloy Films

2001 ◽  
Vol 670 ◽  
Author(s):  
Min-Joo Kim ◽  
Hyo-Jick Choi ◽  
Dae-Hong Ko ◽  
Ja-Hum Ku ◽  
Siyoung Choi ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Grain Boundary ◽  
Reaction Rate ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Alloy Films ◽  
Post Annealing ◽  
Alloy Process ◽  
Thermal Stability Of

ABSTRACTThe silicidation reactions and thermal stability of Co silicide formed from Co-Ta/Si systems have been investigated. In case of Co-Ta alloy process, the formation of low resistive CoSi2phase is delayed to about 660°C, as compared to conventional Co/Si system. Moreover, the presence of Ta in Co-Ta alloy films reduces the silicidation reaction rate, resulting in the strong preferential orientation in CoSi2 films. Upon high temperature post annealing in the furnace, the sheet resistance of Co-silicide formed from Co/Si systems increases significantly, while that of Co-Ta/Si systems maintains low. This is due to the formation of TaSi2 at the grain boundaries and surface of Co-silicide films, which prevents the grain boundary migration thereby slowing the agglomeration. Therefore, from our research, increased thermal stability of Co-silicide films was successfully obtained from Co-Ta alloy process.

Thermal stability of polypropylene-clay nanocomposites subjected to laser pulse heating

2013 ◽  
Vol 98 (12) ◽  
pp. 2497-2502 ◽  
Author(s):  
Stephen F. Bartolucci ◽  
Karen E. Supan ◽  
Jeffrey S. Wiggins ◽  
Lawrence LaBeaud ◽  
Jeffrey M. Warrender
Keyword(s):  
Thermal Stability ◽  
Laser Pulse ◽  
Pulse Heating ◽  
Clay Nanocomposites ◽  
Laser Pulse Heating ◽  
Thermal Stability Of

scholarly journals Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Naiming Miao ◽  
Jinjin Jiang ◽  
Wangping Wu
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Deposition Rate ◽  
Electroless Nickel ◽  
Monocrystalline Silicon ◽  
P Content ◽  
Almost All ◽  
P Type ◽  
Electroless Ni ◽  
Thermal Stability Of

Electroless nickel–phosphorus (Ni–P) films were produced on the surface of p-type monocrystalline silicon in the alkaline citrate solutions. The influences of bath chemistry and plating variables on the chemical composition, deposition rate, morphology, and thermal stability of electroless Ni–P films on silicon wafers were studied. The as-deposited Ni–P films were almost all medium- and high-P deposits. The concentrations of Ni2+ and citric ions influenced the deposition rate of the films but did not affect P content in the deposits. With increasing H2PO2− content, the P content and deposition rate were steadily increased. The pH and plating temperature had a significant effect on the chemical composition and the deposition rate of the films. The thermal stability of the medium-P film was better than that of the high-P deposit. At the same time, the proposed mechanism of Ni–P films on monocrystalline silicon substrates in the alkaline bath solution was discussed and addressed.

scholarly journals The Evolution of Texture During Annealing of Nanocrystalline Electroless Nickel Alloy Deposits

2000 ◽  
Vol 34 (2-3) ◽  
pp. 181-195 ◽  
Author(s):  
Dong Nyung Lee ◽  
Kang-Heon Hur
Keyword(s):  
Aluminum Alloy ◽  
Sodium Citrate ◽  
Thermal Strain ◽  
Electroless Nickel ◽  
Alloy Sheet ◽  
Aluminum Alloy Sheet ◽  
Preferential Growth ◽  
Alloy Films ◽  
Texture Change ◽  
Electroless Ni

The electroless Ni–Co–P alloy films containing up to 13.4% Co and 7.6% P were deposited on a 5086 aluminum alloy sheet using baths consisting of NiSO4, CoSO4, (NH4)2SO4, NaH2PO2, sodium citrate and thiourea. The deposits were solid solutions having a grain size of 6–7 nm and strong 〈111〉 texture. When the deposits were annealed for 2 h, Ni5P2 was precipitated at 325°C and transformed into the stable Ni3P phase at higher temperatures. During annealing the texture of deposit changed from 〈111〉 to 〈100〉. The texture change was attributed to preferential growth of 〈100〉 grains at the expense of 〈111〉 grains to decrease the thermal strain energy of the deposits. On the other hand, the electroless Ni–Cu–P alloy films containing Cu and P deposited on 5086 aluminum alloy sheet had the microstructures and textures which are similar to these of the Ni–Co–P alloy films. However, their initial 〈111〉 texture remained relatively stable even after annealing. The differences in annealing textures of Ni–Co–P and Ni–Cu–P alloy films have been discussed.

scholarly journals The formation of electroless Ni-Co-B alloy films.

1990 ◽  
Vol 41 (1) ◽  
pp. 53-56 ◽  
Author(s):  
Tetsuo SAITO ◽  
Shun-ichi YOSHIMURA ◽  
Eiichi SATO
Keyword(s):  
Alloy Films ◽  
Electroless Ni
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