scholarly journals A rapid determination of total organic and inorganic carbon in shales and carbonates

1970 ◽  
Author(s):  
R R Barefoot ◽  
A E Foscolos
2010 ◽  
Vol 173 (2) ◽  
pp. 207-216 ◽  
Author(s):  
Lorenz Walthert ◽  
Ursula Graf ◽  
Adrian Kammer ◽  
Jörg Luster ◽  
Daniele Pezzotta ◽  
...  

Author(s):  
Ali Shihab Ahmed, Hussein Mahmood Shukri, Zeina Tariq Salih

A quantitative and qualitative determination of the pollutants emitted within the work environment, including dust and its components of organic and inorganic carbon was conducted in one of the factories of electrical insulators production. A dust sampler and 5 micron diameter filters were used and prepared for analysis in the carbon analyzer of organic and inorganic components. The result of the analysis shows the dust emissions concentrations of organic carbon (OC) in the mechanical lathing unit for cutting Phenolic Carbon Insulators (PCI) is (244.0 µg.m-3) and the lowest inorganic emissions (59.0 µg.m-3). The emission of manual filings from inorganic carbon dust is the highest concentration (916.0 µg.m-3) and the lowest organic carbon is (4.0 µg. m-3). The highest level for total inorganic carbon (TIC) in the manual unit fillings is (440.0 mg.m-3. .8hr-1) and the lowest TIC concentration is (2.8 mg.m-3. .8hr-1) in the mechanical lathing unit for phenolic carbon. While the highest level for OC in the mechanical lathing unit is (117.0 mg.m-3. .8hr-1) and the lowest OC concentration is (2.0 mg.m-3..8hr-1) in manual and pressing units. All concentrations of the dust and their components of organic and inorganic carbon are out of standards limitation of the International Standards Units (ISU). Exposure to these emissions during an actual working time of 8 hours a day requires commitments to individual and group safety measures to maintain workers safety.


Author(s):  
T. Y. Tan ◽  
W. K. Tice

In studying ion implanted semiconductors and fast neutron irradiated metals, the need for characterizing small dislocation loops having diameters of a few hundred angstrom units usually arises. The weak beam imaging method is a powerful technique for analyzing these loops. Because of the large reduction in stacking fault (SF) fringe spacing at large sg, this method allows for a rapid determination of whether the loop is faulted, and, hence, whether it is a perfect or a Frank partial loop. This method was first used by Bicknell to image small faulted loops in boron implanted silicon. He explained the fringe spacing by kinematical theory, i.e., ≃l/(Sg) in the fault fringe in depth oscillation. The fault image contrast formation mechanism is, however, really more complicated.


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