Comparison of Measured and Modeled Lithographic Process Capabilities for 2.5D and 3D Applications Using a Step and Repeat Camera

2014 ◽  
Vol 2014 (1) ◽  
pp. 000178-000183 ◽  
Author(s):  
James Webb ◽  
Roger McCleary ◽  
Gerald Lopez ◽  
Qing Tan
Keyword(s):  
Image Features ◽  
Large Field ◽  
Light Spectrum ◽  
Single Exposure ◽  
Projection System ◽  
Critical Dimensions ◽  
Optical Projection ◽  
Extensive Evaluation ◽  
Advanced Packaging ◽  
3D Applications

Increasing volume using larger substrates with decreasing process margins create new challenges for advanced packaging applications. Key step and repeat camera technology continues being introduced for the mass production of high density interconnects used for 2.5D and 3D technologies that will provide solutions for the challenges encountered. A 2X reduction stepper with unique features achieves the tighter specifications needed for many advanced packaging applications printed on large substrates. A large field-of-view optical projection system utilizes the 350–450nm light spectrum from a mercury arc to expose the circuit patterns from a reticle mask onto a substrate and image features with the optimal fidelity required for advanced packaging technologies. The imaging field prints a large 52mm x 66mm area or 59.4mm x 59.4mm in a single exposure. These features enable a system to process larger substrates in fewer shots which result in higher throughput using lower power. Details of the camera and the adjustments that are provided to extend the range of use for both high power and high fidelity applications are discussed. An extensive evaluation of measured and modeled lithographic capabilities of the step and repeat camera to achieve critical dimensions with precise image placement is provided. Limiting resolution and depth of focus results sampled over the imaging field will be provided and supported with simulation. Results of thin and thick resist patterning will be presented and compared to simulated 3D resist profiles using the MACK4 model.

scholarly journals Radiomics in radiation oncology—basics, methods, and limitations

2020 ◽  
Vol 196 (10) ◽  
pp. 848-855
Author(s):  
Philipp Lohmann ◽  
Khaled Bousabarah ◽  
Mauritius Hoevels ◽  
Harald Treuer
Keyword(s):  
Mathematical Models ◽  
Quantitative Imaging ◽  
Human Perception ◽  
Image Features ◽  
Radiotherapy Planning ◽  
Large Field ◽  
Imaging Features ◽  
Imaging Data ◽  
Complete Evaluation ◽  
Vast Number

Abstract Over the past years, the quantity and complexity of imaging data available for the clinical management of patients with solid tumors has increased substantially. Without the support of methods from the field of artificial intelligence (AI) and machine learning, a complete evaluation of the available image information is hardly feasible in clinical routine. Especially in radiotherapy planning, manual detection and segmentation of lesions is laborious, time consuming, and shows significant variability among observers. Here, AI already offers techniques to support radiation oncologists, whereby ultimately, the productivity and the quality are increased, potentially leading to an improved patient outcome. Besides detection and segmentation of lesions, AI allows the extraction of a vast number of quantitative imaging features from structural or functional imaging data that are typically not accessible by means of human perception. These features can be used alone or in combination with other clinical parameters to generate mathematical models that allow, for example, prediction of the response to radiotherapy. Within the large field of AI, radiomics is the subdiscipline that deals with the extraction of quantitative image features as well as the generation of predictive or prognostic mathematical models. This review gives an overview of the basics, methods, and limitations of radiomics, with a focus on patients with brain tumors treated by radiation therapy.

Improved compensation for a reduction stepper to meet the challenges for advanced packaging applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000814-000819 ◽  
Author(s):  
James E Webb ◽  
Steven Gardner ◽  
Elvino DaSilveira
Keyword(s):  
Leading Edge ◽  
Image Features ◽  
Wafer Level ◽  
Projection Lens ◽  
Wafer Level Packaging ◽  
Alignment System ◽  
Wide Range ◽  
Advanced Packaging ◽  
Volume Production ◽  
Mix And Match

Advanced packaging manufacturers require steppers that will provide solutions for the challenges encountered with new advances in wafer-level packaging technologies such as TSV, eWLB, silicon and glass interposers being utilized in leading edge mobile devices. Step and repeat photolithography systems capable of finer imaging with tighter overlay are being introduced to meet the challenging manufacturing requirements associated with the mix and match needed for volume production on larger wafers. A 2X reduction stepper with unique features incorporated that extend the range of compensation is necessary to achieve the tighter specifications needed for many advanced packaging applications printed on 300 to 450mm wafers. A high throughput projection optical system is used to expose circuit patterns from a reticle mask onto a substrate to image features with the optimal fidelity required for advanced packaging technologies. The camera incorporates 350–450nm light from a mercury arc lamp that is transmitted through the mask containing circuit patterns. The imaging field prints a large 52mm × 66mm area in a single exposure. These features enable a system to process wafers in fewer shots which result in higher throughput using lower power. Substrates are positioned with a precise X, Y, Θ stage by locating marks using an off-axis, bright field alignment system with fully trainable mark feature capability. The approach results in precisely placed features within a layer and from layer to layer without directly referencing the reticle. The integrated metrology and precision positioning subsystem technologies are combined with a low distortion projection lens and a wide range of adjustments, allowing the stepper to be integrated into a production line in a mix and match setup with other lithography systems. This equipment can be used to image critical layers on substrates while ensuring grid registration and alignment with other lithography systems that are also printing images in the same process line. Several important global and intra-field image placement relationships for devices requiring multiple layer patterning have been combined in the stepper matching correction software. Further adjustment to the tool can be made to improve overlay when incorporated with fab-wide yield management software for automated, real-time process control. The types of adjustments needed and techniques that can be applied to compensate for image placement errors over large areas are discussed.

Three Dimensional X-Ray Image Synthesis

1972 ◽  
Vol 16 ◽  
pp. 336-343
Author(s):  
David G. Grant
Keyword(s):  
Three Dimensional ◽  
Image Synthesis ◽  
Dimensional Structure ◽  
Cross Sectional ◽  
Projection System ◽  
X Ray ◽  
Optical Projection ◽  
Planar Images ◽  
Scan Length ◽  
Simple Filter

AbstractTomographic systems are able to produce cross sectional planar images of three dimensional volumes because of the relative motion of the source, film and the volume under examination. Analysis shows that the image produced is a result of a three dimensional linear filtering process where the filter characteristics are determined by the scan geometry (3). If, instead of integrating continuously on a single film, a set of N radiographs are recorded, each corresponding to a point along the scan trajectory, then a simple filter can be defined to reconstruct the entire three dimensional structure from this data. In this case, the transfer function exhibits repetitive peaks whose spacing is determined by N and whose width is determined by the total scan length. The number of views required to produce the same “blurring” as the continuous case can then be determined by the Nyquist criteria(3).An optical projection system based on circular geometry for producing three dimensional medical images has been fabricated and tested. The technique can be generalized to any geometry and to all x-ray applications where plane-by-plane examination of a structure would prove beneficial.

3D & System-in-Package Development with the Redistributed Chip Package (RCP)

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002374-002398
Author(s):  
Zhiwei (Tony) Gong ◽  
Scott Hayes ◽  
Navjot Chhabra ◽  
Trung Duong ◽  
Doug Mitchell ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Systems On Chip ◽  
3D Packaging ◽  
Packaging Space ◽  
Advanced Packaging ◽  
On Chip ◽  
Imaging Sensors ◽  
3D Applications

Fan-out wafer level packaging (FO-WLP) has become prevalent in past two years as a package option with large number of pin count. As the result of early development, the single die packages with single-sided redistribution has reached the maturity to take off. While the early applications start to pay back the investment on the technology, the developments have shifted to more advanced packaging solutions with System-in-Package (SiP) and 3D applications. The nature of the FO-WLP interconnect along with the material compatibility and process capability of the Redistributed Chip Package (RCP) have enabled Freescale to create novel System-in-Package (SiP) solutions not possible in more traditional packaging technologies or Systems-on-Chip. Simple SiPs using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or a substrate based multi-chip module (MCM). More complex three dimensional (3D) SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMDs, CMOS, GaAs, MEMS, imaging sensors or IPDs gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. The following paper further discusses SiP advantages, applications and examples created with the RCP technology. Rozalia/Ron ok move from 2.5/3D to Passive 1-4-12.

Optical Projection System Design for Photoresist Exposure

1969 ◽  
Vol 8 (1) ◽  
pp. 75 ◽  
Author(s):  
Milton D. Rosenau ◽  
Robert A. Jones ◽  
Leon Contente
Keyword(s):  
System Design ◽  
Projection System ◽  
Optical Projection

Ion Projection Direct-Structuring For Nanotechnology Applications

2002 ◽  
Vol 739 ◽  
Author(s):  
Hans Loeschner ◽  
Ernest J. Fantner ◽  
Regina Korntner ◽  
Elmar Platzgummer ◽  
Gerhard Stengl ◽  
...  
Keyword(s):  
Large Field ◽  
Tool Development ◽  
Magnetic Media ◽  
Single Exposure ◽  
Ion Optics ◽  
First Results

ABSTRACTLarge-field ion-optics has been developed for reduction printing. Sub-100nm ion projection direct-structuring (IPDS) of patterned magnetic media discs has been demonstrated, extending over 17mm diameter exposure fields, in a single exposure. First results of IPDS patterning of nanocomposite resist material are presented. Information about a novel 200x reduction projection focused ion multi-beam (PROFIB) tool development is provided. Further IPDS nanotechnology applications are discussed.

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